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Dielectric ceramic material, preparation method thereof and method for producing ceramic capacitor

A technology of ceramic capacitors and ceramic dielectrics, which is applied in the direction of multilayer capacitors, fixed capacitor dielectrics, and components of fixed capacitors, etc. Insulation resistance, low alkalinity effect

Inactive Publication Date: 2005-07-20
广东风华高新科技集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional dielectric materials for multilayer chip ceramic capacitors have the characteristics of being sintered and reduced to semiconductors in a reducing atmosphere, which cannot meet the manufacturing requirements of multilayer chip ceramic capacitors with base metal nickel or nickel alloys as internal electrodes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment mainly introduces the preparation process, composition and characteristics of the anti-reduction heat stable ceramic dielectric material.

[0027] The preparation process includes preparation of main components and preparation of ceramic medium powder.

[0028] The preparation process of the main component includes: starting raw materials such as MgCO 3 , CaCO 3 , SrCO 3 , BaCO 3 and ZrO 2 Press the formula Mg a Ca b Sr c Ba 1-a-b-c Zr d o 1+2d The proportional weighing portion, where a, b, c and d are listed in Table 1. After being refined by wet ball milling, drying and crushing, it is calcined at 1200°C to 1300°C for 2 to 3 hours to obtain the desired main component.

[0029] The preparation process of the ceramic medium powder is: adding auxiliary components to the main component as sintering aids, and the mass percentage of each auxiliary component is listed in Table 1. After being mixed by ball milling, and then processed by ultra-fine ...

Embodiment 2

[0035] This embodiment mainly introduces the preparation process and characteristics of thermally stable multilayer chip ceramic capacitor (MLCC) with nickel inner electrode and copper terminal electrode.

[0036] It is characterized in that it uses the anti-reduction ceramic dielectric material described in Embodiment 1 as the dielectric material, the internal electrode slurry uses nickel alloy slurry containing 0.1-10% inorganic additives, and the terminal electrode slurry uses nickel alloy slurry containing 1-20% Copper alloy paste with inorganic additives.

[0037] The preparation process of the nickel inner electrode thermally stable multilayer chip ceramic capacitor (MLCC) described in this embodiment includes:

[0038] After the diaphragm of 5-100 μm is produced by the traditional casting process, the above-mentioned nickel alloy internal electrode paste containing 0.1-10% of inorganic additives is printed on the diaphragm by screen printing technology, and alternately ...

Embodiment 3

[0043] This implementation plan mainly introduces the preparation process and characteristics of the thermally stable multilayer chip ceramic capacitor (MLCC) with nickel inner electrode and nickel nickel terminal electrode.

[0044] It is characterized in that it uses the anti-reduction ceramic dielectric material described in Embodiment 1 as the dielectric material, the internal electrode slurry uses nickel alloy slurry containing 0.1-10% inorganic additives, and the terminal electrode slurry uses nickel alloy slurry containing 1-20% Nickel alloy paste with inorganic additives.

[0045] The preparation process of the nickel inner electrode thermally stable multilayer chip ceramic capacitor (MLCC) described in this embodiment includes:

[0046]After the diaphragm of 5-100 μm is produced by the traditional casting process, the above-mentioned nickel alloy internal electrode paste containing 0.1-10% of inorganic additives is printed on the diaphragm by screen printing technolog...

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PUM

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Abstract

A ceramic medium is prepared from the composite, oxide, MgaCab SrcBa1-a-b-cZrdO1+2d, where a=0-1, b=0-1, c=0-1 and d=0.8-1.2, through ball grinding, drying, pulverizing, calcining at 1200-1300 deg.C for 2-3 hr, adding sintering aid, pulverizing, and sintering. It can be used to prepare multi-layer capacitor using Ni or Ni-alloy as internal electrodes.

Description

technical field [0001] The invention relates to an anti-reduction thermally stable ceramic dielectric material. [0002] The present invention also relates to a preparation method of the above-mentioned anti-reduction thermally stable ceramic dielectric material. [0003] The present invention also relates to a method of producing a multilayer chip ceramic capacitor using the above material. Background technique [0004] Multilayer chip ceramic capacitors are widely used in the manufacturing process of electronic equipment due to their small size, high reliability and convenient mounting. With the development of digital technology and the advent of the mobile communication era, various electronic devices and equipment are developing in the direction of miniaturization and high-density integration, requiring surface-mounted multilayer chip ceramic capacitors to achieve small size, large capacity and high reliability. sex. [0005] Multilayer chip ceramic capacitors use scr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/48C04B35/64H01G4/12H01G4/30
Inventor 陈兆藩杨成锐唐亦斌魏汉光张火光郭海明唐洪涛
Owner 广东风华高新科技集团有限公司
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