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IGBT (Insulated Gate Bipolar Translator) chip with novel structure and preparation method

A new type of structure and chip technology, applied in semiconductor/solid-state device manufacturing, transportation and packaging, transistors, etc., can solve the problems of decreased breakdown capacity, breakdown voltage, and short-circuit capacity

Pending Publication Date: 2022-05-31
上海睿驱微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are still some serious problems in the existing IEGT, for example, due to the presence of lateral current in the large-area P floating region, the current density under the N+ emitter region increases, which reduces the latch-up capability and the short-circuit capability; or due to the large-area P floating area, resulting in a decrease in breakdown capability and a decrease in breakdown voltage

Method used

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  • IGBT (Insulated Gate Bipolar Translator) chip with novel structure and preparation method
  • IGBT (Insulated Gate Bipolar Translator) chip with novel structure and preparation method
  • IGBT (Insulated Gate Bipolar Translator) chip with novel structure and preparation method

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0046] The object of the present invention is to provide a novel structure IGBT chip and its preparation method, so as to improve the short-circuit capability of the IGBT while ensuring the stability of the breakdown voltage.

[0047] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific e...

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PUM

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Abstract

The invention relates to an IGBT (Insulated Gate Bipolar Translator) chip with a novel structure and a preparation method. The IGBT chip with the novel structure comprises a plurality of cellular structures, each single cellular structure sequentially comprises a chip surface area, a chip internal area and a chip back area from top to bottom; wherein the chip surface region comprises an emitter region and an oxide layer; the internal region of the chip comprises a polycrystalline silicon layer, a gate oxide layer, an N + emitter region, a P + region, a P base region, a P floating region, an N-drift region and an N-buffer region. The chip back area comprises a P + collector and a back metal electrode; a single cellular structure is an axisymmetric structure; and a plurality of shunting holes which are arranged at equal intervals are etched in the central area of the oxide layer. According to the invention, a plurality of shunt holes arranged at equal intervals are etched in the central area of the oxide layer, a hole channel is provided above the P floating region, hole carriers are prevented from gathering in the P floating region, and the short-circuit capability of the IGBT is improved under the condition of ensuring the stability of breakdown voltage.

Description

technical field [0001] The invention relates to the technical field of high-power IGBTs, in particular to an IGBT chip with a novel structure and a preparation method. Background technique [0002] Insulated Gate Bipolar Transistor (Insulated Gate Bipolar Transistor, IGBT) has both power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor, Metal-Oxide-Semiconductor Field-Effect Transistor) easy to drive, simple control, high switching frequency and power dual Bipolar Junction Transistor (BJT) has the advantages of low saturation voltage drop, large current transport capability and low loss, and has significant advantages in technology and efficiency. The growth of the renewable energy sector such as solar and wind power has led to the need for high-power IGBTs. The motors used in wind turbines are of the variable-speed type, and high-power IGBTs are required to improve efficiency. Applications in electric vehicles (Electric Vehicle, EV) and hybrid electric vehicles (H...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/06H01L29/739H01L21/331H01L27/082H01L21/8222
CPCH01L29/0603H01L29/7397H01L29/66348H01L27/0823H01L21/8222Y02T10/7072
Inventor 陆界江周明江吴磊李娇
Owner 上海睿驱微电子科技有限公司
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