Flexible high-thermal-conductivity composite phase change film and preparation method thereof

Abstract

The invention discloses a flexible high-thermal-conductivity composite phase change film and a preparation method thereof. The flexible high-thermal-conductivity composite phase change film comprises the following components in parts by weight: 5-20 parts of paraffin, 1-20 parts of a phase change temperature regulator, 1-20 parts of a thermoplastic elastomer, 50-600 parts of a thermal conductive filler, 0.5-10 parts of a coupling agent and 0.01-1 part of an antioxidant. The phase-change temperature of the phase-change film is adjusted by changing the ratio of the paraffin to the phase-change temperature regulator, so that different actual requirements are met; the heat-conducting filler is subjected to surface treatment by a coupling agent, so that cross-linking and hydrogen-bond interaction can be generated between the heat-conducting filler and polymer matrix macromolecules, the compatibility and interface bonding force of the heat-conducting filler are enhanced, and the interface thermal resistance can be further reduced; the thermoplastic elastomer has a flexible cross-linked network structure, so that the phase-change film can be endowed with good flexible performance, and the three-dimensional network structure can bind the phase-change component to prevent leakage; the method is simple in process and low in cost, and can be applied to the fields of miniaturized and compact electronic products and the like.

Description

technical field [0001] The invention belongs to the technical field of phase change materials, and in particular relates to a flexible high thermal conductivity composite phase change film and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the trend of miniaturization and integration has brought challenges to the efficient heat dissipation of electronic devices. According to statistics, for every 2°C increase in the temperature of electronic devices, the system stability will decrease by 10%, and even in some cases, overheated electronic devices may catch fire or explode. Therefore, it is particularly important to develop new high thermal conductivity materials suitable for thermal management of high power density electronic devices. [0003] A phase change material is a material that can absorb or release a large amount of latent heat during a phase change for thermal management. Among them, organic phas...

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Problems solved by technology

Chinese invention patent CN113004793A reports a thermally conductive phase change material, which contains multifunctional modified polysiloxane as the base polymer and thermally conductive fillers. The thermally conductive phase change material has good component compatibility and oxidation resistance. performance, but the production process is relatively complicated, and the thermal conductivity of the prepared phase change material is only about 4W / (m×K), which is difficult to meet the application requirements of the high-end market

Chinese invention patent CN111072318A discloses a graphene airgel phase change composite material with oriented thermal conductivity, in which the three-dimensional structure of graphene airgel has excellent directional thermal conductivity, and its porous structure is conducive to the adsorption of phase change materials. It also has a certain anti-leakage ability, but the phase change composite material has a single phase change temperature, high cost and difficult to prepare on a large scale, which reduces the feasibility of industrial application

[0004] In addition, the above-mentioned phase change materials in the prior art have poor flexibility at room temperature, are easily broken by external forces, and are difficult to process into thin films, which is not conducive to the application in electronic equipment with miniaturized volume and compact structure. Wearable electronics field

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