High-thermal-conductivity low-viscosity epoxy molding compound and preparation method thereof

An epoxy molding compound and low-viscosity technology, which is applied in the direction of heat exchange materials, chemical instruments and methods, semiconductor devices, etc., can solve the problems of high viscosity of compound filling and low efficiency of single filling, so as to reduce the thermal resistance of the interface, and can Good processability and dense heat transfer network

Active Publication Date: 2022-01-14
安徽工业技术创新研究院六安院
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the problems of low single filling efficiency and high viscosity of compound filling in the existing method of improving the thermal conductivity of epoxy resin for spherical alumina in the prior art, and provide a high thermal conductivity and low viscosity epoxy resin Plastic sealing compound and preparation method thereof

Method used

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  • High-thermal-conductivity low-viscosity epoxy molding compound and preparation method thereof
  • High-thermal-conductivity low-viscosity epoxy molding compound and preparation method thereof
  • High-thermal-conductivity low-viscosity epoxy molding compound and preparation method thereof

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Embodiment 1

[0033] This embodiment provides a method for preparing flaky alumina by a molten salt method, which specifically includes the following steps: fully mix aluminum sulfate salt and ammonium bicarbonate powder in an equal mass ratio, and then let it stand for 0.5-2h, then use deionized water to The mixture is fully washed, and then the precipitate is mixed with an equal proportion of potassium sulfate salt and then calcined at a high temperature of 1200° C. for 3-5 hours.

[0034] The above-mentioned flaky alumina scanning X-ray diffraction spectrogram of preparation, the result is as attached figure 1 Shown; scanning SEM morphology, the results are as follows figure 2 shown. Depend on figure 1It can be seen that the XRD spectrum of flaky alumina obtained by the molten salt method matches well with the PDF card of α-Al2O3, which proves that the crystal structure is complete. The alpha crystal form of alumina is the basis for improving the thermal conductivity of epoxy resins....

Embodiment 2

[0036] S1. Add a mixed solution of ethanol and water (ethanol:water=19:1) to the reaction container, adjust the pH value to 5-6 with acetic acid; add spherical alumina (D50=50 microns) powder and KH550 to the container, and The amount of KH550 mentioned above is 2.5% of the amount of spherical alumina; replace the air in the reaction vessel with inert gas, heat to 80°C, and stir for 4 hours; drying in a medium temperature, and cooling to room temperature to obtain spherical alumina with amino groups on the surface.

[0037] Disperse the flaky alumina (size 2-5 μm) powder prepared in Example 1 into toluene, add KH560 with 3% powder mass; stir and react at 80°C for 6 hours under a nitrogen atmosphere, after the reaction, the product is passed through toluene several times Wash and filter with suction, dry in an oven at 100°C, and cool to room temperature to obtain flaky alumina with epoxy groups on the surface.

[0038] S2. Disperse the amination-modified spherical alumina and ...

Embodiment 3

[0042] S1. Add a mixed solution of ethanol and water (ethanol:water=19:1) to the reaction container, adjust the pH value to 5-6 with acetic acid; add spherical alumina (D50=20 microns) powder and KH792 to the container, the The amount of KH792 mentioned above is 5% of the amount of spherical alumina; replace the air in the reaction vessel with inert gas, heat to 80°C, and stir for 4 hours; drying in a medium temperature, and cooling to room temperature to obtain spherical alumina with amino groups on the surface.

[0043] Disperse the flaky alumina (size 2-5 μm) powder prepared in Example 1 into toluene, add 3-glycidyl etheroxypropylmethyldimethoxysilane of 3% by mass of the powder; The reaction was stirred and reacted for 6 hours under atmospheric conditions. After the reaction, the product was washed and filtered with toluene several times, dried in an oven at 100°C, and cooled to room temperature to obtain flaky alumina with epoxy groups on the surface.

[0044] S2. Disper...

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Abstract

The invention discloses a high-thermal-conductivity low-viscosity epoxy resin molding compound for semiconductor packaging and a preparation method of a heat-conducting component of the high-thermal-conductivity low-viscosity epoxy resin molding compound. The molding compound is composed of 50-100 parts by weight of epoxy resin, 40-100 parts by weight of a curing agent, 3-5 parts by weight of an ion capturing agent, 2-6 parts by weight of a coupling agent, 400-600 parts by weight of a hybrid filler, 2-5.25 parts by weight of a flame retardant and 1-2.5 parts by weight of a coloring agent. The heat-conducting component is formed by assembling alpha crystal form aluminum oxide microspheres (10-50 microns) and aluminum oxide nanosheets through chemical bonds, and the mass ratio of the alpha crystal form aluminum oxide microspheres (10-50 microns) to the aluminum oxide nanosheets is (2-10): 1. The method comprises the steps of assembling spherical aluminum oxide and flaky aluminum oxide into a hybrid filler according to a certain component ratio through chemical bonding, adding the hybrid filler into an epoxy molding compound mixture, and carrying out high-speed dispersion, mixing, crushing, mold pressing and other processes to form the molding compound. The prepared epoxy resin molding compound has high heat conductivity coefficient and lower internal stress, the spiral flow length is not less than 50 inches, and the typical value of the heat conductivity coefficient can reach 4.3 W/mK.

Description

technical field [0001] The invention belongs to the field of materials for semiconductor packaging, and in particular relates to a high thermal conductivity and low viscosity epoxy molding compound and a preparation method thereof. Background technique [0002] As an important embedding material for semiconductor chips, epoxy resin-based packaging materials provide protection for chips with excellent moisture resistance, thermal shock resistance, and mechanical vibration resistance. However, with the continuous improvement of chip integration in integrated circuits, the power density of various packaging modules has risen sharply, which has brought serious problems of heat accumulation and thermal failure. As a thermosetting polymer material, epoxy resin has an intrinsic thermal conductivity of only about 0.2W / mK, which cannot meet the higher operating temperature and reliability requirements of the new generation of high-power modules. Therefore, improving the thermal cond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/18C08K7/00C08K3/22C08K9/06C09K5/14H01L23/29
CPCC08K7/18C08K7/00C08K3/22C08K9/06C09K5/14H01L23/295C08K2003/2227C08L63/00
Inventor 肖超包超郑康张献
Owner 安徽工业技术创新研究院六安院
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