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Micropore manufacturing method suitable for liquid crystal polymer substrate

A technology of liquid crystal polymers and production methods, applied in the processing of insulating substrates/layers, printed circuit manufacturing, printed circuits, etc., can solve the problems of low production efficiency, high equipment precision requirements, and inability to effectively solve the problem of peeling heat between dielectric and conductor layers Melt shrinkage and other problems to achieve high efficiency and ensure the effect of pass

Pending Publication Date: 2021-12-17
AKM ELECTRONICS TECH SUZHOU +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the thermoplastic characteristics of the LCP substrate material, the existing mechanical drilling and laser drilling methods have encountered bottlenecks, which cannot effectively solve the problems of dielectric-conductor layer peeling and thermal melting shrinkage caused by heat accumulation in the microhole manufacturing process; High precision requirements, high production costs, and low production efficiency
Moreover, after the existing LCP micro-hole manufacturing method is drilled, drilling dirt will be left in the hole, and the hole wall needs to be cleaned and roughened before the hole metallization can be carried out.

Method used

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  • Micropore manufacturing method suitable for liquid crystal polymer substrate
  • Micropore manufacturing method suitable for liquid crystal polymer substrate
  • Micropore manufacturing method suitable for liquid crystal polymer substrate

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Embodiment 1

[0049] Embodiment 1 LCP flexible substrate microhole production equipment

[0050] The LCP flexible substrate micropore production equipment in this embodiment is used to match the production of liquid crystal polymer flexible substrate micropores by using etching confinement technology.

[0051] Such as figure 1 As shown, the LCP flexible substrate micropore manufacturing equipment in the present embodiment comprises a container 1, an electrochemical workstation 6, an electrode connected to the electrochemical workstation 6, a control module (computer 5), a motion module (three-dimensional motion platform 10) and a visual module (CCD camera 11). The electrochemical workstation 6, the motion module and the vision module are respectively connected with the control module.

[0052] The container 1 is used to accommodate the LCP flexible substrate 4 and the electrolyte solution 18, and its top is provided with a liquid inlet 2, and the bottom of the container 1 is provided with...

Embodiment 2

[0055] Embodiment 2 is applicable to the micropore fabrication method of liquid crystal polymer substrate

[0056] This embodiment provides a method for manufacturing micropores on a liquid crystal polymer flexible substrate based on the etching constraint technology and the LCP flexible substrate micropore manufacturing equipment in Example 1, which specifically includes the following steps:

[0057] 1. Preparation of copper layer etching-constraint system electrolyte solution

[0058] The etching-constrained system electrolyte solution of copper layer in the present embodiment comprises the composition of following molar concentration: 0.04mol / L FeCl 2 , 0.012mol / L bipy, 0.2mol / L SnCl 2 , 0.2mol / L HCl.

[0059] Electrolyte solution 18 adopts a chemical solution preparation method, weighs a specific mass of corresponding electrolyte substance according to the above molar concentration, dissolves it in a specific volume of deionized water, and mixes it uniformly.

[0060] C...

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Abstract

The invention discloses a micropore manufacturing method suitable for a liquid crystal polymer substrate, the liquid crystal polymer substrate comprises a liquid crystal polymer layer and a copper layer which are attached to each other, and the micropore manufacturing method comprises the following steps: respectively preparing electrolyte solutions of the copper layer and the liquid crystal polymer layer; manufacturing a working electrode; and utilizing working electrode, sequentially adopting the electrolyte solution of the copper layer and the electrolyte solution of the liquid crystal polymer layer to conduct electrified etching on the copper layer and the liquid crystal polymer layer, and preparing the micropores, wherein the electrolyte solution includes an etchant precursor and a constraining agent. According to the micropore manufacturing method suitable for the liquid crystal polymer flexible substrate, the micropores with tiny diameters and high depth-to-width ratios can be machined in the LCP flexible substrate; many problems caused by heat accumulation in the hole manufacturing process are avoided, and it is guaranteed that the hole pattern is good; and meanwhile, hole wall coarsening is achieved, and the efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a microhole manufacturing method suitable for liquid crystal polymer (LCP) flexible substrates. Background technique [0002] As wireless communication enters the 5G era, from the communication network to the terminal application, the communication frequency is fully high-frequency, high-speed, and large-capacity. It is proposed that the flexible packaging substrate be used more frequently, smaller in size, better in heat resistance, and has better performance. More stability and more technical requirements. Liquid crystal polymer (LCP) has the characteristics of easy bending, low dielectric loss, low moisture absorption, low thermal expansion coefficient, and good chemical resistance. It is considered to be the best flexible packaging substrate for high-frequency and high-speed signal transmission. Material. [0003] Compared with traditional flexible substr...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/002
Inventor 王峰刘喜梅柴志强潘丽
Owner AKM ELECTRONICS TECH SUZHOU
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