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Bio-based UV light-induced viscosity-reducing pressure-sensitive adhesive and preparation method thereof

A bio-based, light-induced technology, applied in the field of pressure-sensitive adhesives, can solve problems such as harmful, environmentally toxic, and inconsistent with the development trend of the ecological environment, and achieve a wide range of application prospects, easy to peel, and achieve the effect of peeling

Active Publication Date: 2021-12-03
HUBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, all raw materials of most existing UV photoviscosity-reducing pressure-sensitive adhesives are petrochemical-based raw materials, some of which are toxic or harmful to the environment, and do not conform to the current development trend of ecological environmental protection

Method used

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  • Bio-based UV light-induced viscosity-reducing pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] In the first step, the following raw materials are added to a four-necked bottle equipped with a thermometer, a spherical condenser, a dropping funnel, and a stirrer: 19.02 g of oleic acid, 14.26 g of lauryl methacrylate, and 2.84 g of tetrahydrofurfuryl methacrylate. g, 5.69 g of itaconic acid, 5.69 g of N-methylolacrylamide and 50.47 g of ethyl acetate. Under stirring, the solution was heated to 75° C., and then a solution of ethyl acetate (21.61 g) dissolved with dibenzoyl peroxide (0.48 g) was slowly added dropwise to the monomer solution in the flask through a dropping funnel. The mixture was stirred at 75 °C for 8 h to obtain a first viscous solution.

[0035]In the second step, 4-dimethylaminopyridine (0.68g), 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride (1.08g) was added to the first step obtained One viscous solution was stirred at room temperature for 24 h to obtain a second viscous solution.

[0036] In the third step, rosin (71.28g) was disso...

Embodiment 2

[0041] In the first step, the following raw materials are added to a four-necked bottle equipped with a thermometer, a spherical condenser, a dropping funnel, and a stirrer: 25.36 g of oleic acid, 19.01 g of lauryl methacrylate, and 3.79 g of tetrahydrofurfuryl methacrylate. g, 7.58 g of itaconic acid, 7.58 g of N-methylolacrylamide, 19.22 g of toluene and 48.05 g of butyl acetate. Under stirring, the solution was heated to 80° C., and then a solution of butyl acetate (28.83 g) dissolved with azobisisobutyronitrile (0.32 g) and dibenzoyl peroxide (0.32 g) was slowly dropped through the dropping funnel. Add to the monomer solution in the flask. The mixture was stirred at 80 °C for 8 h to obtain a first viscous solution.

[0042] In the second step, 4-dimethylaminopyridine (0.91g), 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride (1.44g) was added to the first step obtained One viscous solution was stirred at room temperature for 24 h to obtain a second viscous solut...

Embodiment 3

[0048] In the first step, the following raw materials are added to a four-necked bottle equipped with a thermometer, a spherical condenser, a dropping funnel, and an agitator: 31.70 g of oleic acid, 23.76 g of lauryl methacrylate, and 4.74 g of tetrahydrofurfuryl methacrylate. g, 9.48 g of itaconic acid, 9.48 g of N-methylolacrylamide, 24.03 g of toluene and 60.08 g of butyl acetate. Under stirring, the solution was heated to 80° C., and then a solution of ethyl acetate (36.02 g) dissolved in azobisisoheptanonitrile (0.8 g) was slowly added dropwise to the monomer solution in the flask through the dropping funnel. The mixture was stirred at 80 °C for 8 h to obtain a first viscous solution.

[0049] In the second step, 4-dimethylaminopyridine (1.13g), 1-ethyl-(3-dimethylaminopropyl) carbodiimide hydrochloride (1.80g) was added to the first step obtained in the first step One viscous solution was stirred at room temperature for 24 h to obtain a second viscous solution.

[0050...

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Abstract

The invention discloses a bio-based UV light-induced viscosity-reducing pressure-sensitive adhesive and a preparation method thereof. The UV light induced viscosity-reducing pressure-sensitive adhesive is prepared from the following components in parts by weight: 19.02 to 44.38 parts of oleic acid, 14.26 to 33.26 parts of lauryl methacrylate, 2.84 to 6.63 parts of tetrahydrofurfuryl methacrylate, 5.69 to 13.27 parts of itaconic acid, 5.69 to 13.27 parts of N-hydroxymethyl acrylamide, 178.99 to 417.64 parts of a first solvent, 0.48 to 1.12 parts of a thermal initiator, 1.76 to 4.11 parts of a first catalyst, 71.28 to 166.31 parts of rosin, 35.24 to 42.94 parts of polyol, 196.82 to 232.95 parts of diisocyanate, 0.47 to 0.51 part of a second catalyst, 97.48 to 97.51 parts of a second solvent, 2.01 parts of a polymerization inhibitor, 129.42 to 164.72 parts of hydroxyl acrylate, and 30 parts of a photoinitiator. The UV light-induced viscosity-reducing pressure-sensitive adhesive is synthesized by utilizing the biomass-based monomer and rosin, and is green and environment-friendly. Meanwhile, the prepared pressure-sensitive adhesive has relatively strong adhesive strength before illumination, the peel strength is sharply reduced after illumination, and the pressure-sensitive adhesive has a wide application prospect in the fields of semiconductor chip processing and manufacturing and the like.

Description

technical field [0001] The invention relates to the field of pressure-sensitive adhesives, in particular to a bio-based UV photoviscosity-reduced pressure-sensitive adhesive with strong adhesive force before UV irradiation and a sharp drop in adhesive force after irradiation, and a preparation method thereof. Background technique [0002] Pressure-sensitive adhesive is a kind of polymer material that can form a stronger adhesive force on the surface of two objects through non-covalent bonds under a certain pressure. Pressure-sensitive adhesives have the advantages of easy use and strong bonding and fixing effects, and have been widely used in various fields such as industrial production and express transportation. [0003] In the manufacturing process of the semiconductor chip, the semiconductor wafer needs to be cut to obtain the semiconductor chip. At this time, a pressure-sensitive adhesive is needed to protect and fix the semiconductor wafer. Under this condition, it is...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J133/02C09J193/04
CPCC09J175/14C08L33/02C08L93/04
Inventor 郝同辉刘梓为张群朝蒋涛
Owner HUBEI UNIV
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