Aluminum silicon carbide composite material, method and heat dissipation lining plate

A composite material, aluminum silicon carbide technology, applied in metal material coating process, liquid chemical plating, coating and other directions, to achieve the effect of reducing scrap rate, avoiding complex process and simplifying process flow

Inactive Publication Date: 2021-10-26
珠海亿特立新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an aluminum-silicon carbide composite material and method and a heat dissipation liner to solve the problem of traditional heat conduction and heat dissipation materials and traditional processes for preparing aluminum-silicon carbide complex heat dissipation liners. During the forming process of the board, there are problems such as low structure density, unstable performance, low volume fraction and high cost, long production cycle and low yield rate.

Method used

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  • Aluminum silicon carbide composite material, method and heat dissipation lining plate
  • Aluminum silicon carbide composite material, method and heat dissipation lining plate
  • Aluminum silicon carbide composite material, method and heat dissipation lining plate

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preparation example Construction

[0051] The first object of the present invention provides a method for preparing an aluminum silicon carbide composite material, comprising:

[0052] First, through theoretical calculation combined with digital simulation technology, the design parameters of aluminum silicon carbide raw materials that meet technical indicators such as high thermal conductivity and good dimensional stability are calculated, including the volume of silicon carbide, the particle size distribution of silicon carbide, and the shape of silicon carbide. And the element composition of aluminum alloy, etc.;

[0053] Secondly, according to the design parameters of raw materials, pretreatment of raw materials such as batching, ball milling, granulation, etc. is carried out; at the same time, special molds are preheated;

[0054] Then mix the pretreated silicon carbide particles evenly, and then fill them into the mold; put the mold into the heating furnace, and heat the mold evenly according to the corre...

Embodiment 1

[0075] The invention provides a method for preparing an aluminum silicon carbide thermal radiation liner, the specific steps are as follows:

[0076] S1. According to the requirements of high thermal conductivity, high dimensional stability technical indicators and the principle of heat conduction and bending strength of aluminum silicon carbide composite material microstructure, the particle gradation design is 240#, 110# and 15# mass ratio 10:4: 2; In order to improve the wettability of aluminum alloy, adjust the content of Mg and Si in the refining process of ZL101A to increase to 0.5% and 0.8% respectively.

[0077] S2. Select silicon carbide particles with corresponding particle size distribution according to the gradation theory, and mix silicon carbide powder with ball milling beads with diameters of 15cm, 10cm, and 5cm (the mass ratio of the three kinds of ball milling beads is 2:3:3) according to the mass ratio of 1: 5 Put it into a ball mill jar and mill it for 3-5 h...

Embodiment 2

[0089] The invention provides a method for preparing an aluminum silicon carbide thermal radiation liner, the specific steps are as follows:

[0090] S1. According to the requirements of high thermal conductivity, high dimensional stability technical indicators and the principle of heat conduction and bending strength of aluminum silicon carbide composite material microstructure, the particle gradation design is 240#, 110# and 15# mass ratio 10:4: 2; In order to improve the wettability of aluminum alloy, adjust the content of Mg and Si in the refining process of ZL101A to increase them to 0.6% and 0.6% respectively.

[0091] S2. Select silicon carbide particles with corresponding particle size distribution according to the gradation theory, and mix silicon carbide powder with ball milling beads with diameters of 15cm, 10cm, and 5cm (the mass ratio of the three kinds of ball milling beads is 2:3:3) according to the mass ratio of 1: 5 Put it into a ball mill jar and mill it for ...

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Abstract

The invention provides an aluminum silicon carbide composite material, a method and a heat dissipation lining plate. The method comprises the following steps that burdening, ball-milling and mixing, granulating are conducted, and raw materials are pretreated; meanwhile, a mold is preheated; pretreated silicon carbide particles are evenly mixed, and then a mold is filled with the silicon carbide particles; the mold is put into a heating furnace, and the mold is uniformly heated according to a corresponding heating rate; an aluminum alloy is put into an aluminum melting furnace for melting and casting; the heated mold is moved to a hot press platform, and an aluminum alloy solution in the aluminum melting furnace is injected into the mold; hot pressing is conducted on a hot press; a demolded casting is forged; and the aluminum silicon carbide composite material of the forged casting is machined by combining an ultrasonic vibration cutting technology with a diamond grinding head, and then surface metallization plating process treatment is conducted to obtain the aluminum silicon carbide composite material. The method has the advantages that the product is compact, the performance is good, operation is simple, the cost is low, and the application range is wide.

Description

technical field [0001] The invention belongs to the technical field of new material preparation, heat conduction and heat dissipation, and particularly discloses an aluminum silicon carbide composite material, a method and a heat dissipation liner. Background technique [0002] AlSiC has high thermal conductivity (180-240W / mK) and adjustable thermal expansion coefficient (6.5-9.5×10-6 / K), so on the one hand, the thermal expansion coefficient of AlSiC is well matched with semiconductor chips and ceramic substrates, which can To prevent fatigue failure, power chips can even be directly mounted on AlSiC substrates; on the other hand, the thermal conductivity of AlSiC is ten times that of Kovar, and the heat generated by chips can be dissipated in time, ensuring the reliability and stability of the entire component Sex is greatly improved. [0003] In order to meet the thermophysical performance requirements of high-power electronic component heat dissipation liners such as hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C21/08B22D17/02C22F1/043C22F1/047C25D3/12C23C18/32
CPCC22C21/02C22C21/08B22D17/02C22F1/043C22F1/047C25D3/12C23C18/32
Inventor 王泽民何岚何娟景文甲
Owner 珠海亿特立新材料有限公司
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