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Organic silica gel for potting IGBT (Insulated Gate Bipolar Translator) module

A technology of silicone and silicone gel, applied in the direction of adhesives, etc., can solve problems such as difficult to meet the use requirements, and achieve excellent electrical properties, low viscosity, and good flexibility

Pending Publication Date: 2021-09-21
GUANGZHOU HUITIAN FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, there have been many disclosures about silicone gel potting materials and their preparation methods. However, the dielectric strength of existing silicone gel materials is usually 20-22kV / mm, and the volume resistivity is usually 10 13 ~10 14 ′Ω·cm, difficult to meet higher requirements

Method used

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  • Organic silica gel for potting IGBT (Insulated Gate Bipolar Translator) module
  • Organic silica gel for potting IGBT (Insulated Gate Bipolar Translator) module
  • Organic silica gel for potting IGBT (Insulated Gate Bipolar Translator) module

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Vinyl-terminated polysiloxane (viscosity is 500mPa·s, vinyl content is 0.4%, R 1 is methyl, volatile matter 0.32%) 100 parts, organopolysiloxane with formula (II) structure (viscosity is 1000mPa·s, vinyl content is 0.6%, R 2 3 parts of methyl, 0.28% volatile matter), hydrogen-containing silicone oil with the structure of formula (Ⅲ) (viscosity is about 120mPa·s, hydrogen content is 0.15%, R 3 is methyl, volatile matter 0.39%) 4.13 parts, at this moment, through calculation, the ratio of the molar weight of the silicon-hydrogen bond in the hydrogen-containing silicone oil to the molar weight sum of the vinyl groups in the A and B components is 0.4. As a reaction inhibitor, 0.025 parts of ethynyl cyclohexanol was mixed and stirred for 5 minutes, then 0.27 parts of a platinum catalyst (Pt concentration: 3000 ppm) was added, and mixed and stirred for 5 minutes to obtain a silica gel composition. After the composition is evacuated, it is poured into a mold and an IGBT modul...

Embodiment 2

[0035] Vinyl-terminated polysiloxane (viscosity of 1000mPa·s, vinyl content of 0.3%, R 1 is methyl, volatile matter 0.26%) 100 parts, organopolysiloxane with formula (II) structure (viscosity is 500mPa·s, vinyl content is 0.8%, R 2 It is methyl, 0.35% volatile matter) 6 parts, has the structure of formula (Ⅲ) hydrogen-containing silicone oil (viscosity is 80mPa·s, hydrogen content is 0.2%, R 3 is methyl, volatile matter 0.42%) 3.85 parts, at this moment, through calculation, the ratio of the molar weight of the silicon-hydrogen bond in the hydrogen-containing silicone oil to the molar weight sum of the vinyl groups in the A and B components is 0.60. As a reaction inhibitor, 0.02 parts of cyclic vinylsiloxane were mixed and stirred for 5 minutes, then 0.033 parts of platinum catalyst (Pt concentration: 3000 ppm) was added, and mixed and stirred for 5 minutes to obtain a silicone gel composition. After the composition is evacuated, it is poured into a mold and an IGBT module, a...

Embodiment 3

[0037] Vinyl-terminated polysiloxane (viscosity is about 2000mPa·s, vinyl content is 0.2%, R 1 is methyl, volatile matter 0.21%) 100 parts, organopolysiloxane with formula (II) structure (viscosity is about 400mPa·s, vinyl content is 1.0%, R 2 It is methyl, volatile matter 0.38%) 10 parts, hydrogen-containing silicone oil with formula (Ⅲ) structure (viscosity is about 50mPa·s, hydrogen content is 0.35%, R 3 is methyl, volatile matter 0.44%) 2.54 parts, at this moment, through calculation, the ratio of the molar weight of the silicon-hydrogen bond in the hydrogen-containing silicone oil and the molar weight summation of the vinyl groups in the A and B components is 0.8. As a reaction inhibitor, 0.1 part of cyclic vinyl siloxane was mixed and stirred for 5 minutes, then 0.33 parts of platinum catalyst (Pt concentration: 3000 ppm) was added, and mixed and stirred for 5 minutes to obtain a silicone gel composition. After the composition is evacuated, it is poured into a mold and ...

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Abstract

The invention provides organic silica gel for potting an IGBT (Insulated Gate Bipolar Translator) module, and relates to the technical field of silica gel. The organic silica gel comprises a component A, a component B, a component C, a component D and a component E, wherein the component A is vinyl-terminated polysiloxane, and the vinyl content of the component A is 0.2-0.4 wt%; the component B is an organosilicon compound, and the vinyl content of the component B is 0.6-1.0 wt%; the component C is hydrogen-containing silicone oil, and the hydrogen content of the component C is 0.15-0.35 wt%; the component D is an inhibitor; the component E is a platinum catalyst; the silica gel comprises the following components in parts by weight: 100 parts of the A and 3-10 parts of the B; the ratio of the molar weight of the silicon-hydrogen bonds in the added component C to the sum of the molar weights of the vinyl groups in the component A and the component B is (0.4-0.8):1; the content of the D is 0.02-0.1 part; and the adding amount of the E is based on the total weight of the A, and the using amount of the platinum catalyst is 1-10 ppm according to platinum (Pt). The silica gel disclosed by the invention is good in flexibility (the cone penetration is greater than or equal to 2001 / 10mm) and excellent in electrical performance (the dielectric strength is greater than or equal to 25kV / mm, and the volume resistivity is greater than or equal to 10<16>omega.cm), and is suitable for potting of an IGBT module.

Description

technical field [0001] The invention relates to the technical field of silicone gel, in particular to a silicone gel for IGBT module encapsulation. Background technique [0002] IGBT, specifically called insulated gate bipolar transistor, is a compound full-control voltage-driven power semiconductor device, which has the advantages of fast switching speed, high power output, small size and high reliability in terminal applications. It is used in smart grids, It is widely used in rail transit, aerospace, new energy and other fields. When IGBT modules are applied to control modules such as high-speed trains, electric vehicles, and high-power generator sets, they often have to withstand the impact of cold, hot, high and low temperatures, water vapor erosion, and various harsh conditions of mechanical vibration. Therefore, how to ensure the use environment and prolong the service life of the IGBT module is a major problem in technical engineering. [0003] The IGBT module usua...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05
CPCC09J183/04C08L2205/03C08L2205/025C08L2203/206C08L83/04
Inventor 孔丽芬张探张银华史襄桥章锋
Owner GUANGZHOU HUITIAN FINE CHEM
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