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Organic silicon electronic pouring sealant capable of being deeply cured and condensed and manufacturing method thereof

A technology of deep curing and manufacturing methods, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of longer curing time of silicone rubber, affecting product production cycle, limiting application scenarios of condensed silicone rubber, etc. Achieve the effect of improving production efficiency and flexibility, shortening production cycle and reducing hydrolysis

Inactive Publication Date: 2021-08-13
SHANGHAI YOUNAI ORGANOSILICON MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the infusion depth of silicone rubber is large (generally greater than 1cm), the curing time of silicone rubber (i.e. deep curing) becomes longer, which affects the production cycle of the product and limits the application scenarios of condensed silicone rubber

Method used

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  • Organic silicon electronic pouring sealant capable of being deeply cured and condensed and manufacturing method thereof
  • Organic silicon electronic pouring sealant capable of being deeply cured and condensed and manufacturing method thereof
  • Organic silicon electronic pouring sealant capable of being deeply cured and condensed and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Put 100 parts of α, ω-dihydroxypolydimethylsiloxane with a viscosity of 1500 mPas at 25±2°C, and 300 parts of aluminum hydroxide, and knead them in a kneader at a temperature of 180°C and a vacuum of -0.08MPa After 3 hours, the base material was obtained after cooling. At room temperature, add 100 parts of the base material, 50 parts of α, ω-dihydroxy polydimethylsiloxane, and 3 parts of high-hydroxyl silicone oil into the planetary mixer, keep the vacuum at -0.08MPa, and stir at a speed of 70rpm. 20 minutes to prepare component A; at room temperature, add 100 parts of ethyl silicate, 0.5 part of γ-aminoethylaminopropyltrimethoxysilane, and 0.5 part of stannous dihydroxylate into the planetary mixer, and keep the vacuum -0.08MPa, the stirring speed is 70rpm, stirring for 20 minutes to prepare component B. The product performance test results are shown in Table 1.

Embodiment 2

[0036] Put 100 parts of α, ω-dihydroxy polydimethylsiloxane with a viscosity of 1500 mPas at 25±2°C, and 300 parts of silicon micropowder, and knead them in a kneader at a temperature of 180°C and a vacuum of -0.08 MPa for 3 Hours, the base material is obtained after cooling. At room temperature, add 100 parts of base material, 50 parts of α, ω-dihydroxy polydimethylsiloxane, and 2 parts of high-hydroxyl silicone oil into the planetary mixer, keep the vacuum at -0.08MPa, and stir at a speed of 70rpm. 20 minutes to prepare component A; at room temperature, add 100 parts of ethyl silicate, 0.5 part of γ-aminoethylaminopropyltrimethoxysilane, and 0.3 part of stannous dihydroxylate into the planetary mixer, and keep the vacuum -0.08MPa, the stirring speed is 70rpm, stirring for 20 minutes to prepare component B. The product performance test results are shown in Table 1.

Embodiment 3

[0038] Put 100 parts of α, ω-dihydroxy polydimethylsiloxane with a viscosity of 1500 mPas at 25±2°C and 20 parts of fumed silica into a kneader at a temperature of 180°C and a vacuum of -0.08MPa After kneading for 3 hours, the base material was obtained after cooling. At room temperature, add 100 parts of base material, 50 parts of α, ω-dihydroxy polydimethylsiloxane, and 1 part of high-hydroxyl silicone oil into the planetary mixer, keep the vacuum at -0.08MPa, and stir at a speed of 70rpm. 20 minutes to prepare component A; at room temperature, add 100 parts of ethyl silicate, 0.5 part of γ-aminoethylaminopropyl trimethoxysilane, and 0.9 part of stannous dihydroxylate into the planetary mixer, and keep the vacuum -0.08MPa, the stirring speed is 70rpm, stirring for 20 minutes to prepare component B. The product performance test results are shown in Table 1.

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Abstract

The invention discloses an organic silicon electronic pouring sealant capable of being deeply cured and condensed and a preparation method thereof. The preparation method comprises the following steps: adding 100 parts of alpha, omega-dihydroxy polydimethylsiloxane and 10-300 parts of inorganic filler into a kneading machine, and dehydrating for 1-4 hours at the temperature of 100-180 DEG C and the vacuum degree of -0.06 to -0.1 MPa; adding 100 parts of a base material, 20-50 parts of alpha, omega-dihydroxyl polydimethylsiloxane, 0-0.1 parts of pigment paste and 0.2-4 parts of silicone oil with high hydroxyl content into a planetary stirrer, and stirring for 10-30 minutes at the stirring speed of 50-100 rpm and the vacuum degree of -0.06 to -0.1 MPa to obtain a component A; adding 100 parts of a cross-linking agent, 0-10 parts of a coupling agent and 0.2-1.0 part of an organic tin catalyst into the planetary stirrer, and stirring for 10-30 minutes at the vacuum degree of - 0.06 to -0.1 MPa and the stirring speed of 50-100 rpm to obtain a component B; and mixing the components A and B to obtain the organic silicon electronic pouring sealant capable of being deeply cured and condensed. The organic silicon electronic pouring sealant does not depend on external water vapor reaction, the bonding effect of a coupling agent on materials is effectively embodied, and deep curing is rapidly achieved.

Description

technical field [0001] The invention relates to the technical field of electronic potting adhesives, and specifically refers to a deep-layer curing condensation organic silicon electronic potting adhesive and a manufacturing method thereof that have certain bonding requirements for materials. Background technique [0002] Condensed organic silica gel has excellent aging resistance, physical inertness, electrical properties, waterproof and dustproof properties, etc., and can be vulcanized under normal temperature and pressure. Since it was introduced into the Chinese market in the 1980s, it has developed rapidly. It is widely used in construction, automobile, electrical and electronic, machinery, chemical, food and other industries. Ordinary condensation-type silicone rubber needs to add different coupling agents to meet the bonding of various materials to achieve the purpose of bonding to materials. When the infusion depth of silicone rubber is large (generally greater than...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J11/04C09J11/08C09J11/06
CPCC09J183/04C09J11/04C09J11/08C09J11/06C08K2003/2227C08L2205/025C08L2203/206
Inventor 毛岳义
Owner SHANGHAI YOUNAI ORGANOSILICON MATERIAL
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