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High-temperature-resistant inorganic adhesive and preparation method thereof

A technology of inorganic glue and high temperature resistance, applied in the direction of electrical components, circuits, electric solid devices, etc., can solve the problems of low bonding strength, aging, molecular dissociation damage, etc., and achieve good acid and alkali resistance and high temperature resistance , the effect of good adhesive performance

Active Publication Date: 2021-07-16
武汉利之达科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for deep-ultraviolet LED packaging, due to the high energy of deep-ultraviolet photons, if organic materials are used for packaging, under long-term high-energy ultraviolet irradiation conditions, organic materials will undergo molecular dissociation and damage, aging and yellowing will occur, which will greatly reduce the performance of the device. Light extraction efficiency and reliability
At the same time, since the organic material is non-airtight, harmful gases, especially water vapor, can easily infiltrate into the surface of the chip, thereby affecting the performance and life of the LED device.
At the same time, because the LED chip can withstand a temperature lower than 260°C, in order to achieve high-strength welding between the device and the substrate, some low-temperature bonding technologies have been developed in recent years, such as low-temperature solder bonding and surface activation bonding. Low, poor heat resistance, limited range of use

Method used

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  • High-temperature-resistant inorganic adhesive and preparation method thereof
  • High-temperature-resistant inorganic adhesive and preparation method thereof
  • High-temperature-resistant inorganic adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Make a kind of high temperature resistant inorganic glue, this high temperature resistant inorganic glue is configured according to the following parts by weight: 60% sodium water glass, 32% metakaolin, 5% silicon phosphate, 0.2% styrene-acrylic emulsion, 0.5% magnesium oxide, 0.3% Polyacrylic acid, 2% spherical alumina;

[0038] The Baume degree of sodium water glass solution among the present invention is 39, and modulus is 3.2;

[0039] The average particle size of metakaolin is 10μm;

[0040] The average particle size of spherical alumina is 30um;

[0041] Preparation method: The following preparation methods are carried out at room temperature.

[0042] Use sand core movable filtering device, use 200 order filter screens to filter the sodium water glass solution for 30 minutes, obtain the sodium water glass after the suction filtration; Add the silicon phosphate under the weight ratio in the sodium water glass after the suction filtration, in Stir for 2min at a ...

Embodiment 2

[0050] The high temperature resistant inorganic glue includes the following raw materials in parts by weight: 60% sodium water glass, 29.5% metakaolin, 5% silicon phosphate, 0.2% styrene-acrylic emulsion, 1.0% magnesium oxide, 0.3% polyacrylic acid and 4% spherical oxide aluminum;

[0051] The Baume degree of the sodium water glass solution is 42, and the modulus is 2.8;

[0052] The average particle size of the metakaolin is 30 μm;

[0053] The average particle diameter of the spherical alumina is 20um;

[0054] Preparation method: The following preparation methods are carried out at room temperature.

[0055]Use sand core movable filtering device, use 200 mesh filter screens to suck and filter sodium water glass solution for 30 minutes, obtain the sodium water glass after suction filtration; Add silicon phosphate under the weight proportion in the sodium water glass after suction filtration, in Stir for 2min at a stirring rate of 200r / min to mix the two to obtain a suspen...

Embodiment 3

[0057] The high-temperature-resistant inorganic glue includes the following raw materials in parts by weight: 54% sodium water glass, 38.5% metakaolin, 4% silicon phosphate, 0.3% styrene-acrylic emulsion, 0.5% magnesium oxide, 0.7% polyacrylic acid and 2% spherical oxide aluminum;

[0058] The Baume degree of the sodium water glass solution is 43, and the modulus is 2.6;

[0059] The average particle size of the metakaolin is 50 μm;

[0060] The average particle diameter of the spherical alumina is 25um;

[0061] Preparation method: The following preparation methods are carried out at room temperature.

[0062] Use sand core movable filtering device, use 200 mesh filter screens to suck and filter sodium water glass solution for 30 minutes, obtain the sodium water glass after suction filtration; Add silicon phosphate under the weight proportion in the sodium water glass after suction filtration, in Stir at a stirring rate of 300r / min for 3min to mix the two to obtain a suspe...

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Abstract

The invention discloses a high-temperature-resistant inorganic adhesive and a preparation method thereof. The high-temperature-resistant inorganic adhesive contains sodium water glass, meta-kaolin, silicon phosphate, styrene-acrylic emulsion, magnesium oxide, polyacrylic acid and spherical aluminum oxide. The high-temperature-resistant inorganic adhesive provided by the invention has the advantages of low curing temperature, safety and environmental protection, can tolerate the high temperature of 300 DEG C or above for a long time, can have good adhesive property with ceramics in the range of normal temperature to 300 DEG C, has good water resistance and acid and alkali resistance, has a compact cured body structure, and can isolate air and moisture permeation.

Description

technical field [0001] The invention belongs to the field of electronic packaging, and in particular relates to a high-temperature-resistant inorganic glue and a preparation method thereof. Background technique [0002] For electronic devices, only after the chip is packaged can it work stably and reliably for a long time. Since many optoelectronic devices, such as VCSEL lasers, deep ultraviolet LEDs, accelerometers, gyroscopes, crystal oscillators and other device chips are very sensitive to air and moisture, in order to improve the performance and reliability of these electronic devices, their chips must be packaged in a vacuum Or protective gas, isolated from outside air, moisture, etc., to achieve airtight packaging. However, for deep-ultraviolet LED packaging, due to the high energy of deep-ultraviolet photons, if organic materials are used for packaging, under long-term high-energy ultraviolet irradiation conditions, organic materials will undergo molecular dissociati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/26H01L23/29
CPCC04B28/26H01L23/29C04B2111/00844C04B2201/10C04B2201/30C04B14/106C04B22/16C04B24/26C04B22/066C04B14/303
Inventor 陈明祥孙庆磊刘京隆程浩
Owner 武汉利之达科技股份有限公司
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