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Film preparation method for improving application frequency of film through stress induction

A thin-film preparation and thin-film technology is applied in the field of preparation of using stress induction to increase the application frequency of soft magnetic thin films, and can solve the problems of inability to take into account high magnetic permeability and high application frequency.

Inactive Publication Date: 2021-07-09
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the above, the current soft magnetic thin films deposited on flexible substrates cannot take into account the characteristics of high magnetic permeability and high application frequency

Method used

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  • Film preparation method for improving application frequency of film through stress induction
  • Film preparation method for improving application frequency of film through stress induction
  • Film preparation method for improving application frequency of film through stress induction

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A thin film preparation method for increasing the application frequency of the thin film by stress induction, specifically comprising the following steps:

[0024] Step 1. Turn on the main power supply and the switches of each part of the electron beam evaporation system, turn on the water cooler, mechanical pump, molecular pump, film thickness meter, and electron gun in turn to preheat the equipment;

[0025] Step 2. Clean the polyimide flexible substrate with absolute ethanol, and dry it for later use;

[0026] Step 3. Put the NiFe alloy target into the water-cooled crucible in the vacuum chamber, put the cleaned polyimide flexible substrate into the high vacuum electron beam evaporation system, and fix the flexible substrate on the sample holder after bending. The semicircle formed by the flexible substrate has a radius of 6 mm and is concave;

[0027] Step 4. Use a high vacuum electron beam evaporation system to deposit a thin film, and evacuate to 1.3×10 -4 Pa, s...

Embodiment 2

[0031] Compared with Embodiment 1, this embodiment differs in that in step 3, the radius of the semicircle formed by the bent flexible substrate is 9 mm.

Embodiment 3

[0033] Compared with Embodiment 1, this embodiment differs in that in step 3, the radius of the semicircle formed by the bent flexible substrate is 12 mm.

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Abstract

The invention discloses a preparation method for improving the application frequency of a soft magnetic film by stress induction and belongs to the technical field of film preparation. The method comprises the following steps of (1) cleaning a flexible substrate; (2) putting the cleaned flexible substrate into a high-vacuum electron beam evaporation system, and fixing the flexible substrate on a specimen holder after bending; and (3) conducting evacuation, and starting material pre-melting, wherein the current of an electron gun is 30-40 mA, the voltage of the electron gun is 10 kV, and the time is 4-5 min; and after the pre-melting is finished, setting the evaporation rate to be 0.1-0.7 nm / s, and depositing the soft magnetic film on the bent flexible substrate. According to the soft magnetic film prepared by the invention, when the flexible substrate is changed from a concave shape (convex shape) to a flat shape, tensile stress (pressure stress) is introduced into the film, and compared with the condition that the stress is not introduced, due to the magnetostrictive effect, the soft magnetic film shows obvious magnetic anisotropy, so that the application frequency of the film is improved to more than 1 GHz, and meanwhile, relatively high magnetic inductivity (mu'100 MHz is greater than 1000) is kept.

Description

technical field [0001] The invention belongs to the technical field of thin film preparation, and in particular relates to a preparation method for increasing the application frequency of soft magnetic thin films by using stress induction. Background technique [0002] At present, the development of the electronic information industry is still dominated by traditional rigid devices. For rigid electronic devices, their processing equipment and manufacturing technology have been perfected after a long period of technological development. High precision, strong stability and other advantages. However, with the continuous development of human science and technology, new requirements have been put forward for the functions of electronic devices. Due to the limitations of mechanical properties of traditional rigid electronic devices based on silicon, they are widely used in many applications, especially emerging flexible consumer electronics. Electronic devices cannot meet human ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32C23C14/54
CPCC23C14/32C23C14/54
Inventor 孙科张婧何宗胜邬传健余忠蒋晓娜兰中文
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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