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A method for preparing high-precision resistance on the surface of an LTCC substrate

A substrate surface, high-precision technology, applied in the direction of resistance manufacturing, resistors, coating resistance materials, etc., can solve the problems of film adhesion, poor electrode solder resistance, low resistance value accuracy, etc., to achieve good solder resistance , high line precision and high application frequency

Active Publication Date: 2017-07-04
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface resistance of existing LTCC substrates is usually prepared by screen printing and sintering, which has some disadvantages: (1) the resistance accuracy is low, generally 20% to 30%; (2) the adhesion of the film layer is limited. (3) Poor electrode solder resistance, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] A method for preparing high-precision resistance on the surface of a LTCC substrate is specifically implemented as follows:

[0037] (1) Prepare a multilayer LTCC substrate, grind and polish the surface of the LTCC substrate with a grinder and a polishing machine;

[0038] (2) Soak the LTCC substrate treated in step (1) with acetone for 3 times, the total soaking time is not less than 30min, and ultrasonic treatment is performed in the first and last 1min to 3min of the first soaking process; the second and third soaking process Ultrasonic treatment is carried out in the last 1min to 3min of the process; the LTCC substrate is taken out from the acetone, and then immersed in ethanol for 2 times, the total soaking time is not less than 10min, and ultrasonic treatment is performed in the first 1min of each soaking process; Take it out, spray and clean it with deionized water; dry the LTCC substrate with nitrogen; place the LTCC substrate on a hot plate for drying;

[0039...

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Abstract

The invention relates to the field of LTCC, thin film and hybrid substrate manufacturing, in particular to a method for preparing high-precision resistors on the surface of LTCC substrates, which mainly includes grinding and polishing of LTCC substrates, cleaning, cavity filling, resistance pattern making, electrode pattern making, annealing, resistance Resistance measurement procedure. By adopting the technical scheme of the present invention, the resistance value accuracy of the surface resistance of the LTCC substrate can be increased from the original 20% to 30% to 5% to 10%, and the solder resistance of the electrode and the adhesion of the film layer can be effectively improved. Make lines smaller, more precise, and more frequent.

Description

technical field [0001] The invention relates to the field of manufacturing LTCC, thin films and mixed substrates, in particular to a method for preparing high-precision resistance on the surface of an LTCC substrate. Background technique [0002] Electronic equipment is gradually developing in the direction of miniaturization, light weight, high frequency and multi-function. LTCC (low temperature co-fired ceramic) technology has three-dimensional wiring and unlimited layers, fast signal transmission speed, low loss and reliable It has been widely used in many fields due to its technical advantages such as high performance and the ability to embed passive components and reserve cavities to realize chip embedment. However, the surface resistance of existing LTCC substrates is usually prepared by screen printing and sintering, which has some disadvantages: (1) the resistance accuracy is low, generally 20% to 30%; (2) the adhesion of the film layer is limited. (3) Poor electrod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/075H01C17/12H01C17/28
Inventor 党元兰赵飞刘晓兰徐亚新梁广华唐小平严英占卢会湘朱二涛杨宗亮王康
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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