Anti-oxidation bonding copper wire and preparation method thereof

Abstract

The invention discloses an anti-oxidation bonding copper wire, wherein the anti-oxidation bonding copper wire comprises a bonding copper wire and an anti-oxidation coating layer coated on the outer wall of the bonding copper wire. A formula of the anti-oxidation coating layer comprises the components in parts by weight: 21 to 33 parts of hydroxyethyl cellulose, 18 to 23 parts of tin octanoate, 19 to 29 parts of methylsilane, 30 to 41 parts of trichloro insecticidal ester, 15 to 35 parts of diester fumarate, 18 to 33 parts of cerium oxide, 14 to 29 parts of dimethylaminopropylamine, 25 to 38 parts of sodium oleate, 17 to 31 parts of trimethylolpropane trimethacrylate, 15 to 35 parts of cellulose acetate butyrate, 18 to 38 parts of vinyl acetate, 15 to 26 parts of montmorillonite powder, 14 to 23 parts of sepiolite powder, 10 to 15 parts of titanium dioxide, 5 to 9 parts of nano calcium sulfate, 12 to 18 parts of an anti-freezing agent, 15 to 27 parts of chloromethane, 13 to 26 parts of polyethylene wax, 16 to 21 parts of magnesium stearate and 12 to 20 parts of sodium stearate. The surface of the bonding copper wire is coated with the anti-oxidation coating layer through a laser melting method, the anti-oxidation performance of the bonding copper wire is further improved, and thus it is guaranteed that the bonding copper wire is not prone to oxidation in the storage, transportation and use processes.

Description

technical field [0001] The invention belongs to the technical field of oxidation-bonding copper wire, and in particular relates to an oxidation-resistant bonding copper wire; in particular, it also relates to a preparation method of an oxidation-resistant bonding copper wire. Background technique [0002] The bonding wires in integrated circuits and semiconductor discrete devices mainly use copper wires, that is, bonding copper wires. This kind of bonding copper wires is a relatively mature product and has the advantages of stable chemical properties. [0003] However, due to the high oxidation characteristics of copper wire, it must be used within the specified time after opening the package, and nitrogen and hydrogen mixed gas must be added to protect it, so that flammable and explosive gases will diffuse around the packaging and bonding production site, thereby It will increase the risk. If the exhaust system is installed, the temperature and humidity conditions will be f...

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Problems solved by technology

[0004] The object of the present invention is to provide a kind of anti-oxidation bonding copper wire and its preparation method, to solve the problem in the above-mentioned background technology that it is not convenient to use due to the high oxidation characteristics of copper wire

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