Low-cost high-heat-dissipation intelligent function module

Abstract

The invention discloses a low-cost high-heat-dissipation intelligent function module which comprises a DBC substrate, the DBC substrate is sequentially connected with a copper wiring layer, a ceramic layer and a copper heat dissipation layer from top to bottom, and the copper wiring layer comprises a first copper wiring layer arranged above one end of the ceramic layer and a second copper wiring layer arranged above the other end of the ceramic layer; the function module further comprises a first side pin, and one end of the first side pin is electrically connected with a first bonding wire arranged on the first copper wiring layer; the function module further comprises an IC chip, the IC chip is welded on the first copper wiring layer, a first welding flux layer is arranged between the IC chip and the first copper wiring layer, and the IC chip is welded on the first copper wiring layer. The problems of insufficient welding, high cost and relatively poor heat dissipation performance of pins of the intelligent function module are solved, the purposes that the pins of the intelligent function module are not easy to deweld and stable in welding are realized, the heat dissipation performance is good, the quality of the intelligent function module is effectively guaranteed, and meanwhile the manufacturing cost is effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of intelligent functional modules, and in particular relates to an intelligent functional module with low cost and high heat dissipation. Background technique [0002] Intelligent power modules not only integrate power switching devices and drive circuits. Moreover, it also integrates fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU. It consists of a high-speed, low-power die, an optimized gate drive circuit, and a fast protection circuit. Even in the event of a load accident or improper use, the IPM itself is guaranteed not to be damaged. IPM generally uses IGBT as a power switching element, and an integrated structure of current sensor and driving circuit is integrated inside. IPM wins more and more markets with its high reliability and ease of use. It is especially suitable for frequency converters and various inverter power supplies f...

AI Technical Summary

Problems solved by technology

[0007] The embodiment of the present application provides a low-cost high heat dissipation intelligent functional module, by soldering the IC chip to the first copper wiring layer, and connecting one end of the first side pin and the first copper wiring layer through the first bonding wire The electrical connection solves the problems of false soldering, high cost, and poor heat dissipation performance of the intelligent function module pins, realizes that the intelligent function module pins are not easy to desolder, the welding is stable, and the heat dissipation is good, effectively ensuring the quality of the intelligent function module. At the same time, effectively reduce manufacturing costs and ensure economic benefits

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