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Flexible light-emitting diode (LED) lamp band and manufacturing method thereof

A technology of LED light strips and LED light sources, which is applied in lighting devices, cooling/heating devices of lighting devices, light sources, etc., to achieve good heat dissipation performance, high stability, and convenient assembly

Inactive Publication Date: 2012-11-21
重庆楚商光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flexible LED light strip and its manufacturing method, which solves the assembly and connection problems existing in the rigid substrate in the prior art through a flexible substrate, and uses COB modular packaging technology to meet batch and large-scale requirements. Production requirements

Method used

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  • Flexible light-emitting diode (LED) lamp band and manufacturing method thereof
  • Flexible light-emitting diode (LED) lamp band and manufacturing method thereof
  • Flexible light-emitting diode (LED) lamp band and manufacturing method thereof

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Embodiment Construction

[0029] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0030] Such as figure 1 , figure 2 As shown, a flexible LED light strip is formed by arranging a plurality of LED light source modules. The LED light source module includes two isolated upper and lower copper sheets 1 and a copper sheet connected between the upper and lower two copper sheets 1. An insulating sheet 5, the upper surfaces of the copper sheet 1 and the insulating sheet 5 are coated with a heat-conducting layer 4, and at least one string of LED chips 3 are mounted on the heat-conducting layer 4, and on the upper and lower two copper sheets 1 Electrode welding points 2 are respectively provided, and the LED chips 3 are connected in series between the upper and lower electrode welding points 2 .

[0031] During the implementation process, the LED light source module is designed as a small rectangular box, and the upper an...

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Abstract

The invention discloses a flexible light-emitting diode (LED) lamp band and a manufacturing method thereof. The lamp band is formed by arranging a plurality of LED light source modules. The flexible LED lamp band is characterized in that each LED light source module comprises an upper copper sheet, a lower copper sheet and an insulation sheet, wherein the upper copper sheet and the lower copper sheet are isolated; the insulation sheet is connected between the upper copper sheet and the lower copper sheet; heat conduction layers are respectively coated on the upper surface of the copper sheet and the upper surface of the insulation sheet; at least one string of LED chips is mounted on each heat conduction layer; the corresponding upper copper sheet and the corresponding lower copper sheet are respectively provided with an electrode soldering point; and the LED chips are connected in series between each upper electrode soldering point and each lower electrode soldering point. The manufacturing method comprises the following six steps of cutting, etching, packing, coating, mounting and wiring. The invention has the obvious effects that the lamp band is good in connectivity; chip on board (COB)-packaged LED light source modules are high in stability and convenient in assembly. The single LED light source module can be mounted or multiple LED light source modules can be combined; and large-scale mass production manufacturing can be realized. The flexible LED lamp band not only can be applied to corn lamps but also can be used for manufacturing various traditional lamps and also can be well utilized on street lamp light source modules or tunnel lamp light source modules.

Description

technical field [0001] The invention relates to LED technology, in particular to a flexible LED light strip and a manufacturing method thereof. Background technique [0002] Traditional LED lamps usually use straw hat lamps, especially in the production process of LED corn lamps, which need to be assembled with manual plug-ins. In this way, whether it is a cylinder or a polyhedron lamp, there is a secondary assembly problem in the production process of inserting and then assembling, which brings great inconvenience to batch and large-scale production. [0003] In order to improve the defects caused by LED straw hat lamps, chip on board (COB) packaging technology (Chip On Board, COB) has been introduced into the manufacturing process of LED lamps. Chinese patent application 201110269255.5 discloses an ultra-thin LED using COB packaging technology. Surface light source, which combines the packaging form of the device with the lamp housing, realizes the direct heat conduction ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S4/00F21V23/06F21V29/00F21Y101/02F21S4/24F21V29/71F21V29/87F21Y115/10
Inventor 李述洲王兴龙胡刚
Owner 重庆楚商光电科技有限公司
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