Wire rod for 5000MPa-grade diamond wire and production method thereof

Abstract

The invention discloses a wire rod for a 5000MPa-grade diamond wire and a production method thereof. The wire rod comprises the following chemical components: 1.01%-1.1% of carbon, 0.15%-0.4% of silicon, 0.3%-0.6% of manganese, 0.01%-0.4% of chromium, 0.0005%-0.002% of boron and / or 0.01%-0.09% of vanadium, and the balance iron and impurities including less than or equal to 0.003% of aluminum, less than or equal to 0.0008% of titanium, less than or equal to 0.005% of sulfur and less than or equal to 0.008% of phosphorus. The production method comprises the steps of vacuum melting, remelting, coping after cogging / forging, high-speed wire rolling and cooling, wherein the casting temperature ranges from 1580 DEG C to 1620 DEG C, and the casting speed ranges from 300 kg / min to 400 kg / min. The center carbon segregation of the wire rod is larger than or equal to 1.00 and smaller than or equal to 1.03, the wire rod can be used for preparing 5000 MPa-grade steel wires of 40-46 microns, and the technical blank of wire rods for ultrahigh-strength diamond wire buses at home and abroad is filled.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and relates to a production method of a 5000MPa diamond wire wire rod and a wire rod prepared by the production method. Background technique [0002] Cutting wire, also known as cutting wire, cutting steel wire, and cutting wire, is a special wire used for cutting, and it is also a special steel wire with a diameter of less than 0.20mm and a galvanized copper surface. It is widely used as a consumable material In the field of energy, aviation, equipment and public facilities. Diamond wire, as a high-carbon cutting steel wire embedded with fine diamond particles on the surface, is mainly used for cutting and forming materials such as solar silicon wafers, quartz materials, monocrystalline silicon, polycrystalline silicon, and diamonds. [0003] In order to reduce the loss of the material to be cut, such as silicon material, during the cutting process, the diamond wire is developing i...

AI Technical Summary

Problems solved by technology

[0004] However, at present, the wire rod that can be used to draw and prepare 5000MPa grade diamond wire is still in a blank state, that is to say, the existing wire rod basically cannot be prepared under the basic requirements of diameter and continuous wire mileage 5000MPa grade diamond wire

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