A kind of copper-selenium-based thermoelectric material with high structural stability and preparation method thereof

Abstract

The invention relates to a copper-selenium-based thermoelectric material with high structural stability and a preparation method thereof, belonging to the research field of thermoelectric materials. The chemical formula of the thermoelectric material is Li y Cu 1.85‑x Bi x Se, where x is [0.02, 0.05], and y is [0.01, 0.03]; the present invention obtains Cu with stable cubic phase structure only by changing copper (Cu) vacancies 1.85 Se-based thermoelectric materials. On this basis, by filling copper (Cu) vacancies with lithium (Li) and doping with bismuth (Bi) to adjust the thermoelectric parameters of the material, Li with greatly improved thermoelectric performance was obtained. y Cu 1.85‑ x Bi x Se thermoelectric material, compared with pure phase Cu 1.85 Se-based thermoelectric materials are improved by at least 3 times without changing the structural transition characteristics of the samples. The present invention has very important promotion significance for the inhibition of phase transition of the copper-based sulfide-based thermoelectric material in practical applications.

Description

technical field [0001] The invention belongs to the research field of thermoelectric materials, and particularly relates to a copper-selenium-based thermoelectric material with high structural stability and high thermoelectric performance and a preparation method thereof. Background technique [0002] Thermoelectric material is a functional material that realizes the mutual conversion between thermal energy and electric energy based on the Seebeck effect and the Peltier effect, and has the advantages of long life, safety, reliability, environmental friendliness, no mechanical rotation, and can effectively utilize low-density energy, etc. It has obvious advantages in the fields of military, aerospace, electronic industry, industrial waste heat and automobile exhaust waste heat recovery and utilization. [0003] In recent years, Cu 2-δ X (X=S, Se or Te, δ represents Cu vacancy content)-based thermoelectric materials have lower lattice thermal conductivity and higher thermoele...

AI Technical Summary

Problems solved by technology

However, the occurrence of phase transition means that the coefficient of thermal expansion of the material changes drastically, resulting in huge stress, which leads to cracks or even damage to the material or device; at the same time, the material will have a large latent heat at the phase transition point, and its thermoelectric properties cannot be accurately tested

Images