Diamond circuit board preparation method based on laser direct processing

A laser direct, diamond technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of high equipment requirements, complex and cumbersome preparation process, environmental hazard waste liquid, etc., achieve excellent performance, simple process, super Effect of High Heat Dissipation Performance

Inactive Publication Date: 2021-05-25
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, traditional printed circuit boards are prepared by coating copper on the base material through lamination, exposure, development, etching, film removal, and rinsing. The entire preparation process is very complicated and cumbersome, and requires high equipment. In the process of copper etching technology, waste liquid that is quite harmful to the environment will be produced

Method used

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  • Diamond circuit board preparation method based on laser direct processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The diamond circuit board is prepared by the diamond circuit board preparation method based on laser direct processing, and the specific steps are as follows:

[0026] Select a diamond sheet with a size of 10mm×10mm×1mm, and perform pretreatment on the diamond sheet. Firstly, use 500 mesh and 1000 mesh SiC sandpaper to mechanically grind the diamond substrate, and then use 3 μm diamond grinding paste to polish, and finally Soak the polished diamond substrate in acetone, ethanol and deionized water respectively, and ultrasonically clean it for 10 minutes to produce a flat sheet substrate. The surface roughness Ra of the pretreated diamond substrate is 0.009±0.002 μm, and the thermal conductivity is 2000~2400W / (m K); put the pretreated substrate under the laser irradiation, the laser irradiation is carried out under the protection of high-purity argon, the laser power is 500W, the scanning speed is 500μm / s, and the spot diameter is 1000μm. A graphitized modified layer is ...

Embodiment 2

[0029] The difference from Example 1 is that the laser power of Example 2 is 200W, the spot diameter is 500 μm, and other conditions are the same as Example 1.

[0030] In Example 2, a diamond substrate with graphite wires on the surface was also obtained, but the width of the graphite wires was different, and the final measured width was 500 μm. Compared with Example 1, the width of the graphite wire is reduced, which improves its high-density interconnection; the prepared diamond circuit board has the characteristics of high heat dissipation performance and high-density interconnection structure.

Embodiment 3

[0032] The difference from Example 1 is that the laser power of Example 3 is 100W, the spot diameter is 200 μm, and other conditions are the same as those of Example 1.

[0033] In Example 3, a diamond substrate with graphite wires on the surface was also obtained, but the width of the graphite wires was different, and the final measured width was 200 μm. Compared with Example 1, the width of the graphite wire is reduced, which improves its high-density interconnection; the prepared diamond circuit board has the characteristics of high heat dissipation performance and high-density interconnection structure.

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Abstract

The invention discloses a diamond circuit board preparation method based on laser direct processing. A traditional circuit board base material is replaced with insulating and heat-conducting diamond, partial graphitization of the surface of the diamond is induced by adopting a laser processing method, and a graphite wire is formed on a laser scanning route. The method specifically comprises the following steps: selecting a diamond thin plate with a flat surface, and treating the diamond thin plate to obtain a sheet-shaped substrate with a smooth and flat surface; and irradiating the pretreated diamond substrate with laser, and irradiating the graphite wire with a pre-designed pattern on the diamond substrate by controlling laser process parameters and a scanning mode. The preparation method is simple and convenient, and the manufacturing of the diamond circuit board with high heat dissipation efficiency is directly realized in one step by using a laser processing technology; and the manufactured diamond circuit board is excellent in performance and has the advantages of being high in heat dissipation performance and strength, capable of achieving a high-density interconnection structure on the surface and the like.

Description

technical field [0001] The invention relates to the field of laser processing and the field of electronic information technology, in particular to a method for processing a diamond circuit board with high heat dissipation efficiency. Background technique [0002] High-performance printed circuit boards are an important carrier for high-power devices to achieve high-speed signal processing and transmission, and the development of high heat dissipation materials and the construction of high-density interconnections are two hot issues that need to be resolved urgently in the manufacture of high-reliability printed circuit boards. In order to ensure the stability of carrier work and the reliability of circuit signal transmission, the design and manufacture of printed circuit boards must achieve high interconnection density, and its insulating substrate must also have excellent heat resistance and heat dissipation. The insulating materials of traditional printed circuit substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10
CPCH05K3/105H05K2203/107
Inventor 李玉龙刘冠鹏李学文雷敏王文琴胡小武张超华
Owner NANCHANG UNIV
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