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High-conductivity high-thermal-conductivity pouring sealant and preparation method thereof

A technology of high thermal conductivity and potting glue, which is applied in the field of electrical materials, can solve the problems of dispersion and filler aggregation, and achieve the effect of easy dispersion, uniform dispersion, and improvement of electrical properties

Inactive Publication Date: 2021-04-20
晟大科技(南通)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of thermally conductive and electrically conductive potting compounds usually requires the addition of thermally conductive fillers and conductive fillers at the same time, but at the same time it also leads to the problem of filler aggregation affecting dispersion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A highly conductive and thermally conductive potting sealant, comprising the following proportions by weight: 30 parts of vinyl silicone oil, 20 parts of hydrogen-containing silicone oil, 10 parts of vinyl MQ silicone resin, 20 parts of silicone polymer / silver modified zinc oxide , 1 part platinum catalyst, 0.5 part inhibitor.

[0021] The platinum catalyst mentioned above is one of chloroplatinic acid-isopropanol and chloroplatinic acid-divinyltetramethyldisiloxane, wherein the mass content of platinum is 3‰-1%.

[0022] Inhibitors are 2-methyl-3-butynyl-2-ol, 3-methyl-1-hexynyl-3-ol, 1-ethynylcyclohexanol, methyltris(methylbutynyloxy ) silane, one or more of phenyltris(methylbutynyloxy)silane, vinyltris(methylbutynyloxy)silane and polyvinyl polysiloxane.

[0023] Wherein, the preparation method of the above-mentioned organosilicon polymer / silver-modified zinc oxide comprises the following steps:

[0024] (1) Silver-modified zinc oxide: add zinc oxide particles and K...

Embodiment 2

[0033] A highly conductive and thermally conductive potting sealant, comprising the following proportions by weight: 30 parts of vinyl silicone oil, 30 parts of hydrogen-containing silicone oil, 20 parts of vinyl MQ silicone resin, 35 parts of silicone polymer / silver modified zinc oxide , 2 parts platinum catalyst, 0.75 parts inhibitor.

[0034] The platinum catalyst mentioned above is one of chloroplatinic acid-isopropanol and chloroplatinic acid-divinyltetramethyldisiloxane, wherein the mass content of platinum is 3‰-1%.

[0035] Inhibitors are 2-methyl-3-butynyl-2-ol, 3-methyl-1-hexynyl-3-ol, 1-ethynylcyclohexanol, methyltris(methylbutynyloxy ) silane, one or more of phenyltris(methylbutynyloxy)silane, vinyltris(methylbutynyloxy)silane and polyvinyl polysiloxane.

[0036] Wherein, the preparation method of the above-mentioned organosilicon polymer / silver-modified zinc oxide comprises the following steps:

[0037] (1) Silver-modified zinc oxide: add zinc oxide particles an...

Embodiment 3

[0046]A highly conductive and thermally conductive potting sealant, comprising the following proportions by weight: 30 parts of vinyl silicone oil, 40 parts of hydrogen-containing silicone oil, 30 parts of vinyl MQ silicone resin, 50 parts of silicone polymer / silver modified zinc oxide , 3 parts platinum catalyst, 1 part inhibitor.

[0047] The platinum catalyst mentioned above is one of chloroplatinic acid-isopropanol and chloroplatinic acid-divinyltetramethyldisiloxane, wherein the mass content of platinum is 3‰-1%.

[0048] Inhibitors are 2-methyl-3-butynyl-2-ol, 3-methyl-1-hexynyl-3-ol, 1-ethynylcyclohexanol, methyltris(methylbutynyloxy ) silane, one or more of phenyltris(methylbutynyloxy)silane, vinyltris(methylbutynyloxy)silane and polyvinylpolysiloxane.

[0049] Wherein, the preparation method of the above-mentioned organosilicon polymer / silver-modified zinc oxide comprises the following steps:

[0050] (1) Silver-modified zinc oxide: add zinc oxide particles and KH55...

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Abstract

The invention discloses a high-conductivity high-thermal-conductivity pouring sealant and a preparation method thereof. The pouring sealant comprises the following components in parts by weight: 30 parts of vinyl silicone oil, 20-40 parts of hydrogen-containing silicone oil, 10-30 parts of vinyl MQ silicone resin, 20-50 parts of organosilicon polymer / silver modified zinc oxide, 1-3 parts of platinum catalyst and 0.5-1 part of an inhibitor. The preparation method of the pouring sealant comprises the following steps: (1) adding the vinyl silicone oil, the vinyl MQ silicon resin and the organosilicon polymer / silver modified zinc oxide into a kneading machine, kneading for 2-5 hours in the kneading machine at 80-120 DEG C, and performing uniform mixing; (2) adding hydrogen-containing silicone oil and an inhibitor, kneading for 2-5 hours in a kneading machine at the temperature of 80-100 DEG C, and performing uniform mixing; (3) adding a platinum catalyst, kneading in a kneading machine at 60-90 DEG C for 1-3 hours, performing uniform mixing, and discharging bubbles in vacuum to obtain the organic silicon pouring sealant. The pouring sealant provided by the invention has high thermal conductivity and high electrical conductivity.

Description

technical field [0001] The invention relates to the technical field of electric materials, in particular to a high-conductivity and high-heat-conduction potting glue and a preparation method thereof. Background technique [0002] High-density packaging of electronic components is an inevitable trend in the development of electronic products. During the use of electronic devices, a large amount of heat will be generated, which will cause the temperature of the chip to rise, and the heat conduction efficiency will directly affect the stability of electronic product performance, service life and safety. Therefore, the development of high thermal conductivity and high conductivity potting compound is the key to realize the heat dissipation of electronic components. Potting glue is mainly used for bonding, sealing, potting and coating protection of electronic components, so that internal components and circuits have good resistance to external impact and vibration, and improve t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J9/02
Inventor 卢儒朱凉伟刘广林
Owner 晟大科技(南通)有限公司
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