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A microneedle array brain-computer interface device and its preparation method

A microneedle array, brain-computer interface technology, applied in the fields of electronics and biomedical engineering, can solve the problems of reducing the yield and uniformity of devices, optimizing process steps, time-consuming and laborious, etc., to promote development, simplify manufacturing processes, and reduce production. cost effect

Active Publication Date: 2022-03-22
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the improvement of the microneedle array process in the above literatures is focused on the tip mask and silicon pillar cutting, and other process steps have not been effectively optimized.
Moreover, in the process flow proposed by Florian Solzbacher et al. in 2010, the treatment of tip insulation involves steps such as filling glass powder, high temperature annealing, manual grinding and suspension polishing. yield and uniformity
[0006] In summary, the processing technology of microneedle array brain-computer interface devices is filled with glass powder as the medium to achieve the purpose of insulation between microneedles. This process is not only complicated but also has a certain impact on the device, so there is an urgent need for a The new process is used to improve the production efficiency and yield of the device and reduce the processing cost of the device

Method used

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  • A microneedle array brain-computer interface device and its preparation method
  • A microneedle array brain-computer interface device and its preparation method
  • A microneedle array brain-computer interface device and its preparation method

Examples

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Embodiment 1

[0037] This embodiment provides a method for preparing a microneedle array type brain-computer interface device. The microneedle array layer is prepared with a non-metallic conductor, and the metal lead wire is processed by direct pressure welding.

[0038] Such as figure 2 As shown in (a), the microneedle array layer is prepared by using a low-resistance silicon wafer. After cleaning the silicon wafer, spin-coat photoresist with a thickness of 5um on the silicon wafer, pre-bake for 120s, expose for 45s, develop for 45s, rinse with deionized water for 30s, blow dry with nitrogen, and then sputter metal on the surface. Put the sputtered silicon wafer into an acetone solution to carry out the lift-off process, and finally obtain a metal pad on the upper surface of the silicon wafer; as a preferred method, the thickness of the low-resistance silicon wafer is 1.5mm, and the sputtered metal is chromium and gold.

[0039] Such as figure 2 As shown in (b), a glass sheet is used ...

Embodiment 2

[0046] This embodiment provides a method for preparing a microneedle array type brain-computer interface device. The metal material is used as the microneedle array layer, and the metal lead wire is processed in the form of multi-layer metal interconnection. The following steps are specifically adopted:

[0047] Such as image 3 As shown in (a), the microneedle array layer is prepared by using a titanium sheet. Choose polished titanium sheet and wash it for later use.

[0048] Such as image 3 As shown in (b), a glass sheet is used as the insulating layer between the needles. Using high-precision laser machining through-glass via (TGV) technology to design the through-holes on the glass sheet, and prepare a number of through-holes distributed in an array on the glass sheet. As a preferred manner, the diameter of the through hole may be 10um-100um, and the thickness of the glass sheet is 300um.

[0049] Such as image 3 As shown in (c), the glass sheet and the titanium she...

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Abstract

The invention provides a microneedle array type brain-computer interface device and a preparation method thereof, comprising: using a non-conductive material as an insulating layer between needles, preparing a plurality of through holes in the insulating layer between the needles; preparing a plurality of metal pads on the conductive material layer The conductive material layer is arranged under the insulating layer between the needles, and the upper surface of the conductive material layer is connected to the lower surface of the insulating layer between the needles; the conductive material layer is processed into a micro columnar structure distributed in an array, so that the micro columnar structure Insulate each other; process the micro-columnar structure into a microneedle structure with a needle tip at the bottom to form a microneedle array layer distributed in an array with the needle tip facing down; prepare external leads for connecting external circuits above the microneedle array layer; Electrode points are prepared on the tip of the microneedle array layer; a microneedle array brain-computer interface device is obtained. The invention has the advantages of reducing the process steps of the microneedle array type brain-computer interface device, improving production efficiency and yield, reducing the processing cost of the device, and the like.

Description

technical field [0001] The invention relates to the fields of electronics and biomedical engineering, in particular to a microneedle array brain-computer interface device and a preparation method thereof, which can be used for electrical stimulation and recording of the cerebral cortex and nerves, etc. . Background technique [0002] Brain-computer interface (Brain-computer interface) provides a pathway to connect the brain and external devices. It can stimulate nerve cells to generate action potentials through external devices, and can also record the action potentials generated by nerve cells, so as to realize the connection between the brain and external devices. two-way communication. Therefore, BCIs are widely used to study and treat various neurological diseases, such as Parkinson's disease, epilepsy, depression, and essential tremor, etc. [0003] Brain-computer interface devices are mainly divided into two types: implantable and non-implantable. Compared with non-i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/01
CPCG06F3/015
Inventor 刘景全徐庆达谢凡
Owner SHANGHAI JIAOTONG UNIV
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