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Composite material as well as preparation method and application thereof

A technology of composite materials and thin film composite materials, which is applied to flexible composite films with strong heat dissipation and electromagnetic shielding performance and its preparation, its preparation, and the field of composite materials, which can solve problems such as interference with electronic components, interface separation, and unreliable electrical connection at the interface.

Pending Publication Date: 2021-01-12
NANKAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when they are applied to integrated solutions for electronic chip shielding and heat dissipation functions, they often face a series of problems such as complex overall structure of shielding heat dissipation, poor reliability, and insufficient thermal conductivity.
In addition, for the interface of various shielding heat dissipation structures, when the electronic equipment is used for a long time, the thermal shock often causes unreliable electrical connection and interface separation between the interfaces, which in turn causes the leakage of electromagnetic waves inside the chip and interferes with other nearby electronics. Components, endangering the health of equipment users, and at the same time causing serious problems in the heat dissipation of equipment, which in turn causes more electromagnetic radiation

Method used

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  • Composite material as well as preparation method and application thereof
  • Composite material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] 1. The preparation method of composite material, its concrete preparation steps are as follows:

[0081] 1) Mix the magnetic sendust alumina spherical powder with a diameter range of 1-20 μm and simethicone oil evenly by machine to obtain a fluid magnetic powder-based filler;

[0082] 2) Mixing the carbon fibers with a length range of 200-700 μm and the magnetic powder-based filler obtained in step 1 with a machine to obtain a magnetic powder carbon fiber-based dope;

[0083] 3) put the viscous obtained in step 2 into an extruder for shearing treatment, and then extrude from a tapered outlet that changes from large to small to obtain a fiber-oriented block composite material; and

[0084] 4) The bulk composite material obtained in step 3 is subjected to ultra-low temperature slicing perpendicular to the extrusion direction to obtain a flexible film composite material with a thickness of 300 μm, and the mass fraction of the magnetic sendust spherical powder in the compos...

Embodiment 2

[0087] The preparation method of composite material, its specific preparation steps are as follows:

[0088] 1) Mix the magnetic carbonyl iron flake powder with a diameter range of 5-50 μm and the silicon elastomer uniformly by machine to obtain a fluid magnetic powder-based filler;

[0089] 2) the nickel fiber with the length range of 500-2000 μ m is mixed with the magnetic powder-based filler obtained in step 1 with a machine to obtain a magnetic powder nickel fiber-based dope; and

[0090] 3) Put the viscous material obtained in step 2 into an extruder for shearing treatment, and then extrude from a tapered outlet that changes from large to small to obtain a fiber-oriented block composite material. The mass fraction of the magnetic carbonyl iron flake powder in the composite material is 80wt.%, and the mass fraction of the nickel fiber is 10wt.%.

Embodiment 3

[0092] The block composite material obtained in Example 2 was cryogenically sliced ​​perpendicular to the extrusion direction to obtain a flexible film composite material with a thickness of 300 μm.

[0093] After testing, the flexible film composite material obtained through the above preparation process has both low lap resistance, strong heat dissipation and electromagnetic shielding performance. Its carbon fiber orientation is good, and it has a high thermal conductivity of 23W / m K along the vertical direction. Less than 0.1Ω, its EMI near-field shielding effect is ≥38dB (0.1GHz~18GHz).

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Abstract

The invention relates to a composite material. The composite material comprises magnetic wave-absorbing powder, a polymer matrix and a mixture of carbon-based fibers or metal fibers, wherein the composite material is a fiber-oriented composite material. The invention further relates to a preparation method and application of the composite material. The composite material has the functions of low lap joint impedance, heat dissipation and electromagnetic shielding.

Description

technical field [0001] This application belongs to the field of materials. In particular, the application relates to composite materials, their preparation methods and uses. More specifically, the application relates to the technical fields of heat dissipation, electromagnetic wave shielding, and electrical connection of electronic equipment, and in particular to a flexible composite film with high conductivity, strong heat dissipation and electromagnetic shielding performance, and its preparation method and application. Background technique [0002] With the explosive development of electronic information technology, electronic equipment tends to be smaller and thinner, the integration of various components (such as chips) inside the equipment is getting higher and higher, and the performance of the devices is also rising. What is more important is the higher heat generation and electromagnetic wave radiation power per unit area, causing heat dissipation and electromagneti...

Claims

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Application Information

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IPC IPC(8): H05K9/00H05K7/20
CPCH05K9/009H05K9/0083H05K7/2039
Inventor 黄毅陈永胜陈宏辉王子源
Owner NANKAI UNIV
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