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Light-weight epoxy resin composite material and preparation method thereof

A technology of epoxy resin and composite materials, applied in the field of electromagnetic shielding materials and polymer conduction, can solve the problems of inability to obtain higher electrical conductivity and electromagnetic shielding performance, poor mechanical properties of materials, and inability to resist corrosion, and achieve good industrialization. Promising, productive, easy-to-achieve effects

Active Publication Date: 2016-05-11
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditionally, metal materials with excellent electromagnetic shielding performance are usually used as electromagnetic shielding materials, but they have many disadvantages such as high density, high cost, and poor corrosion resistance, which cannot meet the increasingly high requirements of modern society for electromagnetic shielding materials. , for example, in the field of aerospace, not only is the material required to have excellent electromagnetic shielding performance, but also the material is required to maintain a high enough mechanical strength while reducing the density to increase the payload of the aircraft
[0005] It is well known that the properties of various aspects of materials often form conflicts that restrict each other, especially for epoxy resins, if the material is required to have high conductivity and / or high electromagnetic shielding performance, it is usually necessary to increase the amount of conductive filler , but increasing the amount of conductive filler will often lead to poor mechanical properties of the material; while reducing the amount of conductive filler in the material, high conductivity and electromagnetic shielding performance cannot be obtained. Reports on conductive, high electromagnetic shielding epoxy resin materials; it is often very difficult for those skilled in the art to simultaneously improve the performance of various aspects of electromagnetic shielding materials

Method used

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  • Light-weight epoxy resin composite material and preparation method thereof
  • Light-weight epoxy resin composite material and preparation method thereof
  • Light-weight epoxy resin composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] (1) Preparation of expandable epoxy resin mixture

[0085] Take 100g of E51 epoxy resin, add multi-walled carbon nanotubes according to the ratio in Table 1, and mix at least five times on a three-roll shear mixer to obtain a uniformly dispersed carbon nanotube / epoxy resin mixture. Then add polymer expanded microspheres EXPANCEL in sequence TM 031DU40, 32g polyether amine curing agent BAXXODUR TM EC301, and mix well to get the expandable epoxy resin mixture.

[0086] (2) Preparation of silver-plated melamine formaldehyde (MF) foam

[0087] The MF open-cell foam (BasotectW) with a size of 4cm×3cm×0.5cm was placed in an ethanol solution, and cleaned under ultrasound for 30min to remove surface impurities; the cleaned MF foam was placed at a temperature of 65°C and a concentration of 12g Soak in about 30min in the sodium hydroxide solution of / L, to roughen the surface, then take out the distilled water and wash; place the hydrochloric acid solution of stannous chloride...

Embodiment 2

[0093] (1) Prepare the expandable epoxy resin mixture.

[0094] Take 100g of NPEL-128 epoxy resin, add 3g of multi-walled carbon nanotubes, and mix on a three-roll shear mixer to obtain a uniformly dispersed carbon nanotube / epoxy resin mixture. Then add 1.5g polymer expansion microsphere EXPANCEL TM 051DU40, 50g polyamide curing agent V140, stir well to get the expandable epoxy resin mixture.

[0095] (2) Preparation of nickel-plated polyurethane (PU) foam.

[0096] Put the PU (4cm×3cm×0.5cm) foam in an ethanol solution and clean it under ultrasonic for 30min to remove surface impurities; put the cleaned PU foam in sodium hydroxide with a temperature of 65°C and a concentration of 12g / L Soak in the solution for about 30min to roughen the surface, then take out the distilled water and wash it; soak the roughened PU foam in the hydrochloric acid solution of stannous chloride (12g / LSnCl 2 and 5ml / L conc 2 ) for 20 minutes; place the activated PU foam in a nickel plating sol...

Embodiment 3

[0100] (1) Prepare the expandable epoxy resin mixture.

[0101] Take 100g of E51 epoxy resin, add 3.5g of conductive carbon black, then mix on a three-roller shear mixer to obtain a mixture of conductive carbon black / epoxy resin, and then add a certain amount of surface coupling treated carbon black according to the formula in Table 2. Glass hollow microspheres (3M TM , particle size 15-120μm), and then add 15g of triethanolamine / triethylenetetramine (4:3) and mix well to obtain the expandable epoxy resin mixture.

[0102] (2) Preparation of nickel-plated PVC foam.

[0103] Put the open-cell PVC foam (4cm×3cm×0.5cm) in distilled water and clean it under ultrasonic for 30min to remove surface impurities; put the cleaned PVC foam in the hydrogen oxidation solution with a temperature of 50°C and a concentration of 12g / L Soak in sodium solution for about 30 minutes to roughen the surface, then take out distilled water and wash it; place the roughened PVC foam in a hydrochloric a...

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Abstract

The invention discloses a light-weight epoxy resin composite material, which is prepared from an expandable epoxy resin mixture and metallized foam, wherein the ratio of the weight of the expandable epoxy resin mixture to the volume of the metallized foam is greater than or equal to 0.2g / cm<3>. The light-weight epoxy resin composite material has various advantages of low density, high mechanical strength, low electrical resistivity, excellent electromagnetic shielding performance and the like, and is very suitable for being applied as a conducting material and / or an electromagnetic shielding material; in addition, a preparation method of the light-weight epoxy resin composite material is simple and convenient; the energy consumption is low; the production efficiency is high; good industrialization prospects are realized.

Description

technical field [0001] The invention belongs to the field of polymer conductive and electromagnetic shielding materials, in particular to an epoxy resin composite material with light weight, high conductivity and high electromagnetic shielding and a preparation method thereof. Background technique [0002] With the development of modern high-tech, electromagnetic interference and electromagnetic compatibility problems caused by electromagnetic waves are becoming more and more serious, which not only cause interference and damage to electronic instruments and equipment, affect their normal work, seriously restrict the international competitiveness of my country's electronic products and equipment, but also It will pollute the environment and endanger human health; in addition, the leakage of electromagnetic waves will also endanger the security of national information security and military core secrets. [0003] The key factor to solve the above problems is to explore and deve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/28C08L75/04C08L27/06C08L79/08C08K7/24C08K3/04C08J9/14C08J9/12C08J9/06C08J9/10
CPCC08J9/06C08J9/104C08J9/12C08J9/14C08J2203/04C08J2203/22C08J2363/00C08J2427/06C08J2461/28C08J2475/04C08J2479/08C08K2201/001C08K2201/011C08L63/00C08L2203/14C08L61/28C08K7/24C08L75/04C08L27/06C08K3/04C08K7/06C08L79/08
Inventor 包建军张爱民徐雨
Owner SICHUAN UNIV
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