Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A low-temperature rapid pressure-free manufacturing method for high-temperature-resistant joints for power chip packaging

A power chip and manufacturing method technology, applied in the direction of manufacturing tools, welding equipment, welding equipment, etc., can solve the problems of high welding temperature, long welding time, poor reliability of joints, etc., and achieve excellent electrical conductivity, less internal defects, and good reliability Effect

Active Publication Date: 2021-06-11
XIAMEN UNIV +2
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a low-temperature rapid non-pressure manufacturing method for high-temperature-resistant joints for power chip packaging, so as to solve the current manufacturing problems of high-temperature packaging joints for power chips, such as high welding temperature, long welding time, and poor joint reliability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A low-temperature rapid pressure-free manufacturing method for high-temperature-resistant joints for power chip packaging
  • A low-temperature rapid pressure-free manufacturing method for high-temperature-resistant joints for power chip packaging
  • A low-temperature rapid pressure-free manufacturing method for high-temperature-resistant joints for power chip packaging

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0042] Select commercial copper foam with a pore size of 150 μm, a porosity of 63.1%, and a thickness of 100 μm, and cut it into 10×10mm 2 For small square pieces, first use alcohol solution to ultrasonically clean it for 5 minutes, then use 5% hydrochloric acid alcohol solution to ultrasonically clean it for 1 minute, then use deionized water to ultrasonically clean it for 1 minute and dry it with nitrogen, and finally use argon plasma to clean it. Machine cleaning for 10 minutes, power range 100W. Melt the tin-copper eutectic solder in the molten pool, add an appropriate amount of copper powder (1kg solder to 10-50g copper powder) and stir well, keep the temperature at 240°C, scrape off the surface oxide film, clean the plasma and The foamed copper without flux added is quickly immersed in the molten solder, kept for 5 seconds, then taken out, cooled to room temperature with water, and dried with cold air.

[0043] Using a flat-plate thermoforming machine with independent t...

example 2

[0046] The preparation process of the copper foam / intermetallic compound composite high-temperature-resistant welding prefabricated sheet similar to Example 1 was adopted. Using a flat-plate thermoforming machine with independent temperature control on both sides and the ability to apply ultrasonic loads, set the heating plate on the low temperature side to 200°C and the heating plate on the high temperature side to 240°C; when the temperature rises to the predetermined temperature, place the prefabricated sheet on the Between the plates, the pressure is 400MPa, so that the thickness of the prefabricated sheet reaches 50μm; when the thickness value reaches the preset value, keep the pressure value stable, turn on the pneumatic device, insert the ultrasonic probe into the probe groove of the heating plate on the high temperature side, turn on the ultrasonic wave, and the ultrasonic power The ultrasonic pressure is 1200W, the ultrasonic pressure is 0.6MPa, and the ultrasonic time...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
pore sizeaaaaaaaaaa
Login to View More

Abstract

The present invention proposes a low-temperature rapid non-pressure manufacturing method for high-temperature-resistant joints for power chip packaging, using temperature gradients, ultrasonic waves, and flat-plate thermocompression coupling processes to manufacture foamed copper / intermetallic compound composite high-temperature-resistant solder prefabricated sheets, and using the above-mentioned The solder prefabricated sheet structure realizes the low-temperature rapid pressure-free connection of power chips and obtains the manufacturing process of large-scale high-temperature resistant solder joints. The composite high-temperature-resistant welded prefabricated sheet and high-temperature-resistant welded joint manufactured by the present invention have the advantages of simple preparation process, short welding time, and low material cost, and the formed high-temperature-resistant welded joint has extremely high shear strength and good electrical conductivity. and thermal conductivity.

Description

technical field [0001] The invention belongs to the field of material preparation, and in particular relates to a low-temperature rapid pressure-free manufacturing method of a high-temperature-resistant joint for power chip packaging. Background technique [0002] The third-generation power semiconductor chips such as silicon carbide and gallium nitride have faster switching frequency, stronger operating voltage, greater current carrying capacity, and higher temperature resistance than traditional silicon chips. , big data network, high-power lighting and other fields have broad application prospects. At present, due to the continuous development of power chips in the direction of integration and high performance, the service temperature of the chip has risen significantly, and its average operating temperature has exceeded 200°C. For special applications such as aerospace, oil exploration, and communication base stations, the peak operating temperature Even reaching 300°C,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/60B23K26/38B23K26/70B23K1/00
CPCB23K1/00B23K26/38B23K26/60B23K26/702
Inventor 张志昊朱轶辰操慧珺
Owner XIAMEN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com