End-capping reagent containing crosslinkable group, modified polyimide precursor resin, photosensitive resin composition and application thereof

Abstract

The invention provides an end-capping reagent containing a crosslinkable group, modified polyimide precursor resin, a photosensitive resin composition and application thereof. The cross-linkable group-containing end-capping reagent has the effect of a cross-linking agent during high-temperature curing, can be applied to polyimide precursor resin synthesis to obtain modified polyimide precursor resin with a cross-linking function. The odified polyimide precursor resin has a self-crosslinking function, and does not need an additional cross-linking agent; in the high-temperature curing process, the cross-linking group of the end-capping reagent can realize cross-linking among polyimide resin molecules to form a network cross-linked structure, so the overall heat resistance of the photoresistis improved, and meanwhile, the effects of improving the stripping resistance, reducing the amount of micromolecular volatile matters, improving the glass transition temperature of the photoresist andthe like are achieved. Meanwhile, the crosslinkable group reacts with phenolic hydroxyl groups in a polyimide main chain, so all or part of hydroxyl groups are consumed, the hygroscopicity of the material can be reduced, and the stability of a device can be improved.

Description

technical field [0001] The invention belongs to the technical field of photolithography, and relates to an end-capping agent containing a crosslinkable group, a modified polyimide precursor resin, a photosensitive resin composition and applications thereof. Background technique [0002] Polyimide has excellent high and low temperature resistance, mechanical properties, dielectric properties, biocompatibility, low thermal expansion coefficient and many other properties, and is widely used in the electronic equipment industry, aerospace industry, advanced composite materials, fiber, engineering plastics, photoresist and other fields. Photosensitive polyimide is mainly used in photoresist in the field of microelectronics. Compared with ordinary polyimide, it can greatly simplify the photolithography process, and because it has good heat resistance and mechanical properties , electrical properties and corrosion resistance, etc., are widely used in large-scale integrated circuit...

AI Technical Summary

Problems solved by technology

[0005] However, as mentioned above, the method of introducing cross-linking agent has been used in the prior art to improve the molecular weight of the resin and form a network structure to improve its physical properties, but there are the following problems: (1) adding a small molecule cross-linking agent is very difficult. It is difficult to react completely and there are residues; (2) The heat resistance of the crosslinking agent itself is poor, which will affect the thermal stability of the system, resulting in limited improvement of the thermal properties of the material, and at the same time lead to an increase in small molecule volatiles

Therefore, it leads to the difficulty of improving the thermal stability, peel strength and mechanical properties of photoresist, and this problem has also become a problem to be solved urgently by those skilled in the art.

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