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Lead-free electronic silver paste and preparation method thereof

A technology of lead electronics and silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of large environmental pollution and poor solderability, and achieve simple preparation process and sticky Good adhesion and improved solderability

Inactive Publication Date: 2012-04-25
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional silver paste, especially the high-temperature sintered thick-film electronic silver paste dedicated to the positive electrode of solar cells, the inorganic binder used is mainly lead-containing glass powder with a low melting point, which has great environmental pollution and poor solderability.

Method used

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  • Lead-free electronic silver paste and preparation method thereof
  • Lead-free electronic silver paste and preparation method thereof
  • Lead-free electronic silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] First, add the mass of SiO to the V-shaped mixer respectively: 2 30.0g, Al 2 o 3 15.0g, B 2 o 3 40.0g, and 15.0g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat in a muffle furnace at 1000°C for 3h; take out the molten material and pour it into Quenching in cold water, putting it into a ball mill and milling for 3 hours until the average fineness is 12-14 μm, and then the lead-free inorganic binder is obtained after discharging and drying, which is ready for use.

[0035] Add 40.0g of diethylene glycol butyl ether to a reactor equipped with a condenser, start the agitator and heat for standby; then add 36.0g of methyl methacrylate, 5.0g of isooctyl acrylate, 15.0g of methyl Add glycidyl acrylate and 3.8g of N-methylolacrylamide into the mixing kettle, add 0.2g of benzoyl peroxide and stir evenly, and set aside; Add the above mixed monomers dropwise into the kettle, control all the mixed monomers to be ...

Embodiment 2

[0038] First, add the mass percentage in the V-type mixer as follows: SiO 2 45g, Al 2 o 3 10g, B 2 o 335g, and 10g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat it in a muffle furnace at 1100°C for 2 hours; take out the molten material and quickly pour it into cold water Quenching, putting into a ball mill and ball milling for 4 hours until the average fineness is 10-12 μm, and the lead-free inorganic binder is obtained after discharging and drying, which is ready for use.

[0039] Add 84g of diethylene glycol ethyl ether acetate in a reactor equipped with a condenser, start the agitator and heat it for standby; then add 5.5g of ethyl acrylate, 6g of butyl acrylate, and 4.4g of glycidyl methacrylate into the mixing tank Add 0.1g of azobisisobutyronitrile, stir evenly, and set aside; when the diethylene glycol ethyl ether acetate in the reaction kettle is heated to 85°C, add the above mixed monomers dropwise ...

Embodiment 3

[0042] First, add the mass percentage in the V-type mixer as follows: SiO 2 50g,Al 2 o 3 20g, B 2 o 3 25g, and 5g of tin-bismuth-silver alloy powder (Sn63Bi36.7Ag0.3), mix well; then put the mixed material in a crucible, heat it in a muffle furnace at 1200°C for 2 hours; take out the molten material and pour it into cold water quickly Quenching, putting into a ball mill and ball milling for 5 hours until the average fineness is 3-5 μm, and the lead-free inorganic binder can be obtained after discharging and drying, which is ready for use.

[0043] Add 25.0g of diethylene glycol dibutyl ether, 25.0g of diethylene glycol methyl ether acetate in the reactor with condenser, start the stirrer and heat for standby; then 28.0g of methyl methacrylate, 5.0 g of ethyl acrylate, 5.0 g of isooctyl acrylate, 9.5 g of glycidyl methacrylate, 1.0 g of N-methylol acrylamide, and 1.0 g of hydroxypropyl acrylate were added to the mixing tank, and 0.5 g Stir the benzoyl peroxide evenly and s...

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Abstract

The invention discloses lead-free electronic silver paste, which comprises the following raw materials in percentage by mass: 3-10 percent of inorganic binder, 10-20 percent of self-crosslinking acrylic resin, 65-75 percent of silver powder, 0.5-5 percent of surface modifying agent, 0.5-5 percent of additive and 0.1-0.5 percent of defoaming agent. The invention also discloses a preparation method of the lead-free electronic silver paste, comprising the following steps of: uniformly mixing the silver powder and the inorganic binder; adding the surface modifying agent to be uniformly stirred; adding the self-crosslinking acrylic resin, the addictive and the defoamming agent into the mixture to be ground for 5-8 hours; and filtering to obtain the lead-free electronic silver paste. In the invention, the method for preparing lead-free electronic silver paste has the advantages of no lead, environment protection, simple process, convenient feasibility, no special equipment and small investment, and is convenient to control the product performance.

Description

technical field [0001] The invention belongs to the technical field of electronic fine chemicals, in particular to a lead-free environment-friendly electronic silver paste and a preparation method thereof. Background technique [0002] Electronic paste is one of the important electronic fine chemicals. It can be widely used in many industries such as electronics, information, communication, precision components and solar energy. It is a high-tech product supported by the state. [0003] In recent years, with the increasing shortage of conventional energy sources such as coal, oil, and natural gas, it is imminent to develop new renewable energy sources. Countries have invested heavily in the development of various new energy sources. Among them, the development of the solar energy industry is particularly rapid. The high-temperature sintered thick-film electronic silver paste is currently the most important paste used in solar cell electrodes. It is believed that with the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00C09J1/00H01L31/0224
Inventor 宋锡瑾王杰王锦凯
Owner ZHEJIANG UNIV
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