Low-water-absorption toughened polyamide material and preparation method thereof
A technology of tough polyamide and low water absorption, which is applied in the field of toughened polyamide materials with low water absorption and its preparation, can solve the problems of limiting the use range of PA6 and PA66, affecting material performance, and adding more materials, etc. Dimensional stability, low cost, and the effect of increasing compatibility
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Embodiment 1
[0024] A toughened polyamide material with a low water absorption rate. In parts by weight, the toughened polyamide material with a low water absorption rate comprises the following components: 77 parts of PA6, 10 parts of EPDM-g-MAH, and 10% of methylol content 2 parts of octyl phenolic vulcanization resin, 10 parts of EPDM rubber, 1 part of brominated octyl phenolic vulcanization resin with 11% methylol content and 4.5% bromine content, 100.5 parts of antioxidant H, silicone 0.5 parts, silicone oil 0.03 parts.
Embodiment 2
[0026] A toughened polyamide material with a low water absorption rate. In parts by weight, the toughened polyamide material with a low water absorption rate comprises the following components: 70 parts of PA6, 8 parts of POE-g-MAH, and 10% of methylol content 1 part of octyl phenolic vulcanization resin, 20 parts of EPDM rubber, 1 part of brominated octyl phenolic vulcanization resin with 11% methylol content and 4.5% bromine content, 100.7 parts of antioxidant H, silicone 0.3 parts, 0.04 parts of silicone oil.
Embodiment 3
[0028] A toughened polyamide material with a low water absorption rate. In parts by weight, the toughened polyamide material with a low water absorption rate comprises the following components: 86 parts of PA6, 5 parts of PE-g-MAH, and 10% of methylol content 3 parts of octyl phenolic vulcanization resin, 5.5 parts of EPDM rubber, 0.5 parts of brominated octyl phenolic vulcanization resin with 11% methylol content and 4.5% bromine content, 0.8 parts of antioxidant H100, silicone 0.8 parts, silicone oil 0.05 parts.
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