Preparation process of zirconium oxide composite abrasive, and grinding fluid

Abstract

The invention relates to a preparation process of a novel zirconium oxide composite abrasive, and a grinding fluid. The preparation process comprises the following steps: firstly, preparing zirconiumoxide composite abrasive organic precursor sol; granulating the organic precursor sol; and sintering to obtain the zirconium oxide composite abrasive. The zirconium oxide composite abrasive prepared by the invention is formed by bonding countless tiny zirconium oxide particles through a boracic aluminate melt at a grain boundary; although the macroscopic size is large, the zirconium oxide composite abrasive is broken along a glass bonding interface in the silicon wafer grinding process, the abrasive is slightly broken, a large number of new and fine grinding edges are generated due to continuous breakage in the grinding process, the composite abrasive has very high self-sharpening performance, and the grinding efficiency is improved by 30% or above compared with that of an aluminum oxide abrasive; and besides, the surface of the ground object is provided with a large number of fine grinding marks, the surface roughness value of the ground workpiece is lower, stable and consistent grinding amount can be provided in the using process, and the grinding efficiency and the surface quality of the ground workpiece can be effectively considered.

Description

technical field [0001] The invention relates to a preparation process and a grinding liquid of a zirconia composite abrasive, in particular to a preparation process of a zirconia composite abrasive and a grinding liquid for preparing a grinding liquid for surface processing of a single crystal silicon wafer, and belongs to the field of abrasive preparation. Background technique [0002] At present, the plane finishing of monocrystalline silicon in my country mainly adopts mechanical grinding. The common processing method is to purchase flaky white corundum with a particle size of 7-14 microns as the grinding material, and then mix the abrasive with water (or organic solvent) and dispersant to prepare alumina grinding liquid. The double-end grinding equipment for single crystal silicon wafers adopts a special double-sided vertical grinder. When grinding, there is a cast iron plate on the upper and lower ends of the grinder, and the prepared alumina grinding liquid is added dro...

AI Technical Summary

Problems solved by technology

There is currently a technical bottleneck in this process. With the development of electronic technology, the polished single crystal silicon wafer requires as high a finish as possible and as low a surface residual stress as possible. This requires the use of a finer diameter hard abrasive. However, the finer abrasive will greatly reduce the grinding efficiency, and at the same time, due to the reduction of the grinding ability, the flatness error of the silicon wafer will increase, which is not conducive to high-precision photoetching

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