Quick-flowing underfill adhesive capable of being cured at low temperature and preparation method thereof

Abstract

The invention belongs to the technical field of filling adhesives and relates to a quick-flowing underfill adhesive capable of being cured at low temperature. The quick-flowing underfill adhesive is prepared from the following components, by mass: 20-50 parts of epoxy resin with a core layer-shell layer structure, 10-30 parts of a curing agent, 5-15 parts of a latent curing accelerator, 10-30 parts of a filler, 0.01-1.5 parts of a surfactant, and 1-2 parts of a coupling agent. The core layer is a high-temperature cured amino compound, the shell layer is a low-temperature cured epoxy compound,and the glass transition temperature of the high-temperature cured amino compound is higher than that of the low-temperature cured epoxy compound. The underfill adhesive disclosed by the invention hasthe characteristic of easiness in repair, can be used at a lower temperature during heating and adhesive removal, reduces thermal damage to a mainboard and components, and is easier to fall off fromthe mainboard and the components when being heated, so that the underfill adhesive has an excellent repair effect and low repair rejection rate.

Description

technical field [0001] The invention belongs to the field of filling adhesives, in particular to a fast-flowing low-temperature-curable bottom filling adhesive and a preparation method thereof. Background technique [0002] In the 21st century, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic devices is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. At the same time, chip packaging is required The size is further miniaturized and miniaturized, integrated circuits are becoming lighter, thinner, and smaller, and the integration, density, and performance of integrated circuits are gradually improved, so many new packaging technologies and packaging forms have emerged. [0003] Packaging is to put "clothes" on the chip, protect the chip from damage caused by physical, chemical and other environmental ...

AI Technical Summary

Problems solved by technology

[0008] In addition, because some defective chips or poor soldering are only found in the test after flip-chip, it needs to be reworked, repaired and replaced.

However, thermosetting epoxy resin has very good thermal stability, and all replacement or rework repair processes in the industry use the method of removing bad chips after heating, which makes it difficult to replace chips if the heating temperature is too high or the time is too long , there is no guarantee that other peripheral components will not be damaged, which will directly lead to the failure of multi-chip components or the falling off of other peripheral components, which will eventually lead to the discarding of the entire circuit board or more cumbersome repair process

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