Copper-aluminum composite material and preparation method thereof
A technology of copper-aluminum composite materials and copper ions, applied in chemical instruments and methods, nanotechnology for materials and surface science, roll speed control, etc., can solve the problem of weakening the bonding strength of copper-aluminum composite connectors and weak interface bonding strength , Difficulty in assembly and processing, etc., to achieve the effect of improving interface bonding strength and mechanical properties, reducing rolling force and heat treatment annealing temperature, shortening production cycle and energy consumption cost
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Embodiment 1
[0029] This embodiment provides a copper-aluminum composite material, including a Cu metal sheet and an Al metal sheet, and the Cu metal sheet and the Al metal sheet are combined into one by cold rolling, wherein, before the cold rolling composite, the Cu metal sheet and the Al The surface of the metal plate is evenly sprayed with Cu nano-sol particles, and the in-situ etching forms abundant active sites, and builds a three-dimensional rough structure on the surface of Cu and / or Al metal. Formation of Cu nanosol particles etch-assisted solid-state bonding of copper-aluminum composites.
[0030] In the above-mentioned embodiment, sol technology and surface nano-etching technology were introduced to controllably prepare Cu nano-sol particles with uniform size and controllable shape, and use Cu nano-sol particles to spray on the surface of Cu and / or Al metal, in situ engraving Erosion builds a three-dimensional rough structure. Atom diffusion and migration occurs on the surface ...
Embodiment 2
[0038] This embodiment provides a copper-aluminum composite material, the Cu metal plate and the Al metal plate, the Cu metal plate and the Al metal plate are combined into one body through cold rolling, wherein, before the cold rolling composite, the surface of the Cu metal plate is evenly sprayed Cu nano sol particles, in situ etching to form abundant active sites, build a three-dimensional rough structure on the surface of Cu metal, and form Cu nano sol particle etching to assist solid-state connection of copper-aluminum composite materials. Promote the interlocking of the Cu metal surface, and under the action of lower stress, atomic diffusion and migration occur through the rich active sites on the interface to form a double high-strength metallurgical bond between the Cu / Al interface and the side surface, avoiding the formation of intermediate phases and reducing the composite material. Interface internal resistance; effectively improve the interface bonding strength and ...
Embodiment 3
[0048] This embodiment provides a copper-aluminum composite material, including: Cu metal sheet and Al metal sheet, Cu metal sheet and Al metal sheet are combined into one by cold rolling, wherein, before cold rolling composite, on the surface of the Al metal sheet Uniform spraying of Cu nano sol particles, in-situ etching to form abundant active sites, construct a three-dimensional rough structure on the surface of Al metal, and form Cu nano sol particle etching to assist solid-state connection of copper-aluminum composite materials. Promote the interlocking of Cu and Al metal surfaces, and under the action of lower stress, atomic diffusion and migration will occur through the rich active sites on the interface to form a double high-strength metallurgical bond between the Cu / Al interface and the side surface, avoiding the formation of intermediate phases and reducing recombination The internal resistance of the interface of the material; effectively improve the interface bondi...
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