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A low contraction, low-modular, heat-resistant UV-thermal dual-curing adhesive and preparation method

A low-modulus, low-shrinkage technology, used in adhesives, non-polymer organic compound adhesives, non-polymer adhesive additives, etc., can solve the problems of poor storage stability, poor process regulation, poor mutual solubility, etc. Good flexibility, low modulus, effect of improving heat resistance

Active Publication Date: 2021-08-31
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above two hybrid systems (1) and (2) are physically mixed with two types of resins and their curing agents with completely different reaction mechanisms. The components are very different, resulting in problems such as poor mutual solubility and poor storage stability.
The above (3) one-component system, due to the large molecular weight and high viscosity of the resin, has poor compatibility with propionic acid resin and epoxy resin, resulting in problems such as high glue viscosity and poor process regulation.

Method used

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  • A low contraction, low-modular, heat-resistant UV-thermal dual-curing adhesive and preparation method
  • A low contraction, low-modular, heat-resistant UV-thermal dual-curing adhesive and preparation method
  • A low contraction, low-modular, heat-resistant UV-thermal dual-curing adhesive and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] 15 parts of self-made hyperbranched epoxy resin containing fluorene skeleton, 20 parts of bisphenol A epoxy resin, 10 parts of DAP, 5 parts of tetrahydrofuran methacrylate, 4 parts of 1-hydroxycyclohexyl benzophenone, 1 part of Parts of 3-(2,3-glycidoxy)propyltrimethoxysilane, 1.5 parts of benzoic acid were added to the above-mentioned premix, under vacuum and dark state, revolution 30r / min, autorotation 800r / Under the condition of 1 min, stir for 30 min; add 0.2 part of carbon black, 20 parts of tetrakis (3-mercaptopropionic acid) pentaerythritol ester, control the temperature not higher than 35 ℃, in the state of vacuum and dark, revolution 15r / min, rotate 600r / min Under the conditions, stir for 30min; add 20 parts of silicon micropowder, control the temperature not to be higher than 25℃, under the condition of vacuum and light-proof, under the condition of revolution 10r / min, stir for 30min; add 3.5 parts of PN-23.5 parts, control the temperature not to be higher tha...

Embodiment 2

[0062] 20 parts of self-made hyperbranched epoxy resin containing fluorene skeleton, 15 parts of bisphenol F epoxy resin, 10 parts of DAIP, 8 parts of 3,3,5 trimethylcyclohexane acrylate, 5 parts of 1- Hydroxycyclohexyl benzophenone, 1 part of 3-(2,3-glycidoxy)propyltrimethoxysilane, 1.8 parts of benzoic acid were added to the above premix, and revolutionized in a vacuum and dark state. 30 r / min, under the condition of autorotation 800 r / min, stir for 30 min; add 0.2 part of carbon black, 20 parts of trimethylolpropane tris(3-mercaptopropionate), control the temperature not higher than 35 ℃, avoid in vacuum Under the condition of light state, under the condition of revolution 15r / min, under the condition of autorotation 600r / min, stir for 30min; add 15 parts of talc powder, control the temperature not higher than 25 ℃, under the condition of vacuum and dark, under the condition of revolution 10r / min, stir for 30min; Add 3.5 parts of EH-5031S, control the temperature not to be ...

Embodiment 3

[0066] 20 parts of self-made hyperbranched epoxy resin containing fluorene skeleton, 18 parts of novolac epoxy resin, 5 parts of triallyl isocyanurate, 10 parts of isobornyl methacrylate, 5 parts of 2 -Hydroxy-2-methyl-1-phenylacetone, 1 part of bis(2,4,6-trimethylbenzoyl)phenylphosphonium oxide, 1.5 parts of 3-aminopropyltriethoxysilane , 1 part of barbituric acid is added to the above premix, under the condition of vacuum and dark, revolution 40 r / min, under the condition of autorotation 800 r / min, stir for 30min; add 0.2 part of carbon black, trimethylol 25 parts of propane trimercaptoacetate, the control temperature is not higher than 35 ℃, under the condition of vacuum and dark, revolution 15r / min, under the condition of autorotation 600r / min, stir for 30min; add 15 parts of silicon powder, control the temperature not higher than 25℃, under the condition of vacuum and light-proof, under the condition of revolution 10r / min, stir for 30min; add 4.5 parts of EH-4070S, contro...

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Abstract

The invention discloses a low-shrinkage, low-modulus, heat-resistant UV-heat dual-curing adhesive and a preparation method thereof. It belongs to the technical field of adhesives. By using mercapto ester as UV curing agent (thiol-olefin system) and epoxy resin curing aid, the adhesive has high light positioning strength after ultraviolet radiation, and the cured product after thermal curing has a low modulus. Good flexibility, high bonding strength. By adding self-made hyperbranched epoxy resin containing fluorene skeleton, the heat resistance of the glue is improved, and the shrinkage rate and water absorption rate of the glue are reduced. It has excellent properties of low shrinkage, low modulus and high heat resistance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a low-shrinkage, low-modulus, heat-resistant UV-heat dual-curing adhesive and a preparation method thereof. Background technique [0002] Compared with traditional UV-curable adhesives and thermal-curable adhesives, UV-thermal dual-curing adhesives have the characteristics of UV and thermal dual-curing, which can be cured with ultraviolet radiation for pre-fixation, and then heated in places where ultraviolet rays cannot be exposed. way to cure quickly. [0003] At present, the UV-thermal dual-curing adhesive products and researches on the market mainly include the following systems: (1) (acrylic acid) free radical-(epoxy) cationic hybrid system, which has the characteristics of fast curing speed and high hardness; (2) (Acrylic) free radical-(epoxy) heat curing hybrid system, first use ultraviolet radiation to cure fast positioning, and then heat to cure places tha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/04C09J11/06C08G59/02
CPCC08G59/02C08G59/022C09J4/06C09J11/04C09J11/06
Inventor 魏芳芳李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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