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A kind of solder paste and preparation method thereof

A solder paste and flux paste technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve the problems of affecting electrical conductivity and strength, high arc welding cost, low rivet connection efficiency, etc., to improve production efficiency, Improve printing resistance and good soldering activity

Active Publication Date: 2021-07-20
漳州佳联化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Argon arc welding has high welding cost, low efficiency, and high work intensity, and only the welding material is available around the copper cap, and the entire bottom has a large hollow area and less contact area
The efficiency of connecting with rivets is lower, and if the connection is not good, it will damage the copper body and affect the electrical conductivity and strength, and the entire bottom cavity area is also large

Method used

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  • A kind of solder paste and preparation method thereof
  • A kind of solder paste and preparation method thereof
  • A kind of solder paste and preparation method thereof

Examples

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preparation example Construction

[0032] The embodiment of the present invention also provides the preparation method of the above-mentioned solder paste, comprising the following steps:

[0033] S1, mix the film-forming agent and part of the above-mentioned solvents, heat to 145-150°C, cool to 100-110°C after completely dissolving, then place in a container with a cover, and store in cooling water at 8-12°C for 6 After ~10 hours, the first paste was obtained.

[0034] S2, adding an activator and a thixotropic agent to the first paste, and grinding until the fineness of the paste is not greater than 15 μm, to obtain a second paste. In this step, an activator and a thixotropic agent are firstly added and ground together with the first paste to prevent the paste from forming micelles. In a preferred embodiment, the grinding step is: rough grinding twice and then fine grinding once, repeating the above grinding process until the fineness of the paste is less than 15 μm.

[0035] S3, emulsifying the second paste...

Embodiment 1

[0053] A kind of solder paste provided by this embodiment is prepared according to the following steps:

[0054] 1) The components of the solder paste were obtained in the following parts by weight: 30 parts of hydrogenated rosin resin, 8 parts of polymerized rosin, 5 parts of pentaerythritol rosin ester, 20 parts of dibutyl succinate, 16 parts of ethylene glycol phenyl ether, 4-n- 6 parts of butyl benzoic acid, 6 parts of polyacid, 1.2 parts of 2,3-dibromosuccinic acid, 4 parts of polyamide wax, 0.8 parts of fumed silica, 2 parts of tetrakis (2-hydroxypropyl) ethylenediamine 0.5 part, 0.5 part of antioxidant 1010, 0.5 part of triallyl isocyanurate.

[0055] 2) Add hydrogenated rosin resin, polymerized rosin, and pentaerythritol rosin ester to part of the solvent, heat to 150°C to dissolve, cool naturally to 105°C, and cover in initial cooling water (10±2°C) for eight hours Then grind.

[0056] 3) Add an activator and a thixotropic agent to the above 2) and grind until the p...

Embodiment 2

[0065] A kind of solder paste provided by this embodiment is prepared according to the following steps:

[0066] 1) Obtain the components of the soldering paste according to the following parts by weight: 28 parts of acrylic rosin, 6 parts of polymerized rosin, 7 parts of polyethylene glycol 1500, 18 parts of triethylene glycol propyl ether, and 18 parts of dibutyl maleate , 5 parts of p-hydroxyphenylacetic acid, 8 parts of maleic acid, 1.8 parts of 2,3-dibromobutene diol, 4.5 parts of ethylene bislauric acid amide, 0.6 parts of fumed silica, 2.2 parts of aniline, anti 0.6 part of oxygen agent BHT, 0.3 part of 2-phenylimidazole.

[0067] 2) Add acrylic rosin, polymerized rosin, and polyethylene glycol 1500 to an organic solvent, heat to 150°C to dissolve, cool naturally to 105°C, and cover in initial cooling water (10±2°C), Grind after eight hours.

[0068] 3) Add an activator and a thixotropic agent to the above 2) and grind until the paste fineness is less than 15 μm.

[...

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Abstract

The invention provides a solder paste and a preparation method thereof, and relates to the technical field of soldering materials. The solder paste includes 90.2-91.8 parts of lead-free metal alloy powder and 8.2-9.8 parts of flux paste; wherein, the flux paste includes 37-45 parts of film-forming agent, 30-38 parts of solvent, 10-18 parts of activator, 4-5.5 parts of thixotropic agent, 1-2.5 parts of surfactant, 0.4-0.8 part of antioxidant, and 0.3-0.6 part of corrosion inhibitor; and the activator includes organic acid and bromine-containing compound. The solder paste can be applied to the soldering of the electrode terminals of the fuse. Continuous production can be achieved through reflow soldering, which greatly improves production efficiency. At the same time, after soldering, the copper cap and the copper handle are tightly connected, and the solder around the edges is smooth and full, without trachoma, and the void area is small, and the electrical conductivity and connection strength are greatly improved.

Description

technical field [0001] The invention relates to the technical field of welding materials, and in particular to a solder paste and a preparation method thereof. Background technique [0002] The tubular fuse is composed of a fuse body and a fuse holder, and the electrode terminals of the fuse need to have good electrical conductivity and connection strength. The electrode terminal part is mainly composed of a copper cap and an L-shaped copper handle. The connection between the copper cap and the L-shaped copper handle was mainly connected by argon arc welding or rivets in the past. Argon arc welding has high welding costs, low efficiency, and high work intensity, and only the welding material is available around the copper cap, and the entire bottom has a large hollow area and less contact area. The efficiency of connecting with rivets is lower, and if the connection is not good, it will damage the copper body and affect the electrical conductivity and strength, and the hol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/025B23K35/262B23K35/3612B23K35/362
Inventor 钟招亨黄浩练华
Owner 漳州佳联化工有限公司
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