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A kind of washing flux paste, solder paste and preparation method thereof

A technology of flux paste and water washing, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as affecting the fluxing activity of fluxing paste, and achieve good tin melting effect, good fluxing activity, and enhanced solubility. Effect

Active Publication Date: 2018-08-14
厦门市及时雨焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both of these documents provide halogen-free formulations, which avoid environmental pollution problems, but also affect the fluxing activity of the solder paste

Method used

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  • A kind of washing flux paste, solder paste and preparation method thereof
  • A kind of washing flux paste, solder paste and preparation method thereof
  • A kind of washing flux paste, solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1: Preparation of a kind of water-washing flux paste

[0045] Table 1 Example 1-5 Washing Flux Paste Formulation (w / w%)

[0046]

[0047]

[0048] Preparation of 1-(3-aminopropyl)imidazole rosin salt: 1-(3-aminopropyl)imidazole and hydrogenated rosin are dissolved in isopropanol at a molar ratio of 1:1, neutralized and then dried.

[0049] Raw material formula: see Table 1.

[0050] Preparation:

[0051] 1-(3-aminopropyl)imidazole rosin salt, Add PE 3100, polyethylene glycol 400 monooleate, 1,2-ethylenediamine dihydroiodide, hydrogenated castor oil, and 1,2,3-benzotriazole into a beaker and mix, heat to a clear solution Finally, slowly stir and cool to obtain a paste mixture;

[0052] Mix the above paste mixture with 1,2-ethylenediamine dihydroiodide and WACKER model N20 fumed silica, and grind it with a three-roll mill to obtain a paste;

[0053] The paste obtained by grinding with a three-roller mill was tested with a scraper fineness meter, and...

Embodiment 2

[0054] Embodiment 2: Preparation of a kind of water-washing flux paste

[0055] Preparation of 1-(3-aminopropyl) imidazole rosin salt: 1-(3-aminopropyl) imidazole and maleic acid modified rosin are dissolved in isopropanol with a molar ratio of 1:1, after neutralization Dried.

[0056] Raw material formula: see Table 1. The preparation method is the same as in Example 1.

Embodiment 3

[0057] Embodiment 3: Preparation of a kind of water-washing flux paste

[0058] Preparation of 1-(3-aminopropyl) imidazole rosin salt: 1-(3-aminopropyl) imidazole and acrylic acid-modified rosin are dissolved in isopropanol with a molar ratio of 1:1, dried after neutralization and become.

[0059] Raw material formula: see Table 1. The preparation method is the same as in Example 1.

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Abstract

The invention relates to washable flux paste and soldering paste and a production method thereof. The washable flux paste comprises, by weight, 40-50% of 1-(3- amino propyl) imidazole rosin salt, 15-30% of EO-PO-EO segmented copolymers, 13-25% of polyethylene glycol oleate, 5-8% of halogen activating agents, 0.2-2% of fumed silica, 0.2-2% of hydrogenated castor oil and 0.05-2% of corrosion inhibitors. The produced soldering paste has the advantages that the thermal collapse resistance is good, the tin melting effect of micro welding spots is good, residues can be washed through distilled water after welding and the soldering-aiding activity is high. The soldering paste can be used for welding electronic products such as computers and mobile phones, high reliability can be realized by completely washing the residues after welding, and the distilled water can serve as a washing agent, so that the environment friendliness is high.

Description

technical field [0001] The invention belongs to the technical field of industrial soldering, and in particular relates to a water-washing solder paste and a preparation method thereof, as well as a solder paste prepared by using the water-wash solder paste. Background technique [0002] SMT is Surface Mount Technology (Surface Mount Technology), which is currently the most popular technology and process in the electronics assembly industry. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering. [0003] Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, paste soldering ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 罗礼伟郑序漳
Owner 厦门市及时雨焊料有限公司
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