Diamond grinding wheel for precise grinding of semiconductor substrate chamfering

Abstract

The invention relates to the technical field relevant to grinding wheels and particularly provides a diamond grinding wheel for precise grinding of semiconductor substrate chamfering. On the first aspect, the diamond grinding wheel for precise grinding comprises, by weight, 230-380 parts of adhesion agent and 50-80 parts of diamond, wherein the adhesion agent is one or the combination of multipleones selected from cobalt powder, iron powder, silver powder, tin powder, nickel powder and copper powder. According to the diamond grinding wheel for precise grinding, the adhesion agent of a specific particle size is adopted to be combined with the diamond, so that the holding force on the diamond by the adhesion agent is improved, the self-sharpening performance is good, and the wear resistanceand sharpness of the grinding wheel are guaranteed; meanwhile, the surface of an obtained silicon wafer is good in roughness and smooth beneficially, and the grinding wheel can guarantee the dimension and precision of arc grooves of the grinding wheel under the conditions of repeated machining; and besides, the grinding wheel is good in machining performance, and it can be achieved that the wearresistance and sharpness of each arc groove in the grinding wheel are kept consistent.

Description

technical field [0001] The invention relates to the technical field related to grinding wheels, and more specifically, the invention provides a diamond grinding wheel for precision grinding. Background technique [0002] The semiconductor industry represents the cutting-edge technology of the industry, with high technical barriers and large R&D investment. At present, the silicon wafer repair required by the domestic chip-related industries is heavily dependent on imports. The market demand is about 2 million pieces per month, and the market demand is still at an annual rate of 20%. The speed continues to grow, but with the launch of multiple domestic silicon wafer project bases, most of the demand can be met domestically in the next two years. [0003] At present, the market value of grinding wheels used for silicon wafer chamfering is about 20 million yuan / month, and is expected to grow at a rate of 20% per year. At present, they all rely on imports from Japan and the Unit...

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Problems solved by technology

[0003] At present, the market value of grinding wheels used for silicon wafer chamfering is about 20 million yuan / month, and is expected to grow at a rate of 20% per year. At present, they all rely on imports from Japan and the United States. There are no mature products in China, and the price of imported grinding wheels is very expensive. Moreover, the delivery period is long and the after-sales service is not timely. As a consumable, the trade war out of stock may lead to the outage of grinding wheels, which will lead to the suspension of production of semiconductor companies. Therefore, there is an urgent need for localization of grinding wheels to ensure stable production.

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