Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Radio frequency transceiver chip, synchronization system and method for radio frequency transceiver chip

A radio frequency transceiver chip, radio frequency signal technology, applied in the direction of synchronization device, transmission system, synchronization receiver, etc., can solve the problems of phase alignment difficulty of local oscillator network, large scale of local oscillator network, low precision, etc., to avoid high frequency undershoot The effects of reduced sampling performance, convenience and multi-function, and high precision

Active Publication Date: 2020-08-04
杭州城芯科技有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main disadvantages of the traditional phased array architecture are the large scale of the local oscillator network, high power consumption, and low precision. Especially for some high-frequency applications, due to the bandwidth limitation of the transmission medium (such as copper cable), the phase of the local oscillator network will very difficult to align

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radio frequency transceiver chip, synchronization system and method for radio frequency transceiver chip
  • Radio frequency transceiver chip, synchronization system and method for radio frequency transceiver chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] Such as figure 1 As shown, a radio frequency transceiver chip provided by an embodiment of the present invention includes a mixer, an analog-to-digital converter, a receiving local oscillator unit, a transmitting local oscillator unit, a digital-to-analog converter, and a digital unit, wherein:

[0029] The receiving link of the RF tr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a radio frequency transceiver chip, a synchronization system and method for the radio frequency transceiver chip, the radio frequency transceiver chip includes a mixer, an analog-to-digital converter, a receiving local oscillator unit, a transmitting local oscillator unit, a digital-to-analog converter and a digital unit , the receiving link is a zero-IF architecture, which is composed of a mixer and an analog-to-digital converter, and the receiving local oscillator unit is a fractional frequency synthesizer; the transmitting link is a radio frequency direct sampling architecture, which is composed of a digital-to-analog converter, and the transmitting local oscillator unit is Integer frequency synthesis; the input of fractional frequency synthesis and integer frequency synthesis is reference clock and synchronization signal. When multi-chip synchronization is performed, the integer frequency synthesis synchronization of the transmitting link is performed first, and then the fractional frequency synthesis synchronization of the receiving link is performed; the fractional frequency synthesis synchronization includes the synchronization of the fractional frequency division module and the synchronization of the multi-mode frequency division module. The invention is suitable for large-scale phased arrays, does not need to supply high-frequency local oscillator signals externally, and effectively reduces the power consumption of a multi-chip synchronous clock network.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a radio frequency transceiver chip, and a synchronization system and method for the radio frequency transceiver chip. Background technique [0002] The role of the radio frequency transceiver chip is to pass the radio frequency signal to the baseband for subsequent signal processing after amplification, filtering and analog-to-digital conversion, which determines the communication quality of radio frequency communication. The receiving chain of the RF transceiver chip usually includes a low-noise amplifier, a down-mixer, a filter, and an analog-to-digital converter; the transmitting chain usually includes multiple units such as a digital-to-analog converter, a filter, and an up-mixer. [0003] In recent years, with the development of phased array communication requirements such as 5G mobile communication, RF transceiver chips are required to have the ability to work s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/40H04L7/00
CPCH04B1/40H04L7/0079
Inventor 李国儒孙庭波
Owner 杭州城芯科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products