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A kind of temperature-resistant thickening light-curable epoxy vinyl ester resin and preparation method thereof

An epoxy vinyl ester and epoxy resin technology, which is applied in the polymer field, can solve the problems of reducing the corrosion resistance of vinyl ester resin, unable to be used for simultaneous temperature resistance, corrosion resistance, and material thermal deformation temperature drop. Good compatibility, increased light-curing speed and light-curing depth, and high hydroxyl content

Active Publication Date: 2022-07-26
HUACHANG POLYMER EAST CHINA UNIV OFSCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Patent CN 105713173 A discloses "a thickening formula and thickening method for vinyl ester resin matrix" and mentions that "4-6 parts of thickening aids are added on the basis of conventional vinyl ester resins, and the thickening aids are Hydroxypropyl acrylate monomer, after thickening, forms a polyurethane structure and increases the toughness of the resin matrix. Adding ester monomers to vinyl ester resins reduces the thermal deformation temperature of the material and reduces the corrosion resistance of vinyl ester resins. , cannot be used in occasions that are both temperature resistant and corrosion resistant

Method used

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  • A kind of temperature-resistant thickening light-curable epoxy vinyl ester resin and preparation method thereof
  • A kind of temperature-resistant thickening light-curable epoxy vinyl ester resin and preparation method thereof
  • A kind of temperature-resistant thickening light-curable epoxy vinyl ester resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Put 180.0g of bisphenol A type epoxy resin E12 and 250.0g of methylol bisphenol A type epoxy resin EL-50 into the reactor, heat up to 105°C, stir evenly, add 2.0g of p-tert-butylcatechol, Stir for 10 minutes, add 114.4g of methacrylic acid, control the temperature to stabilize to 90°C, and slowly add 1.2g of benzyltrimethylammonium chloride and 0.4g of 2-ethyl-4-methylimidazole in 3 times within 30 minutes , keep the temperature at 115-120°C, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture to below 90°C, add 432.0g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50°C, add diethoxy 15 g of benzophenone and 5 g of diethyl 2,4,6-trimethylbenzoylphosphonate were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored in the dark.

[0049] Add above-mentioned light yellow transparent liquid resin 100g, calcium carbonate 30g, methylene bis(4-phenylisocyanate) 5.1g in the rea...

Embodiment 2

[0051] Put 190g bisphenol A type epoxy resin E20 and 200.0g methylol bisphenol A type epoxy resin CEQ-45 into the reactor, heat up to 105 ℃, stir evenly, add 2-tert-butyl hydroquinone 3.0 g, stir for 10 minutes, add 112.5g of methacrylic acid, control the temperature to stabilize to 90°C, slowly add 0.8g of benzyltriethylammonium chloride and 1.6g of 1-methylimidazole in 3 times within 30 minutes, keep the temperature for 115 -120℃, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture to below 90℃, add 471.1g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50℃, add 2-hydroxy-2- 18 g of methyl-1-phenylacetone and 3 g of 2,4,6-tritolylbenzoyldiphenylphosphine oxide were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored in the dark.

[0052] Add above-mentioned light yellow transparent liquid resin 100g, aluminum hydroxide 20g, methylene bis(4-phenyl isocyanate) 4.2g in the rea...

Embodiment 3

[0054] Put 241.6g of bisphenol A type epoxy resin E14 and 160g of methylol bisphenol A type epoxy resin Apogen101 into the reactor, heat up to 105 ° C, stir evenly, add 3.5g of di-tert-butyl-p-cresol, stir for 10 minutes, add 95.1g methacrylic acid, control the temperature to stabilize to 90°C, slowly add 0.9g benzyldimethylamine and 1.5g 2-phenyl-4-methyl-5-hydroxymethylimidazole in 3 times within 30 minutes g, keep the temperature at 115-120°C, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture to below 90°C, add 480g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50°C, add α-ammonia 15 g of alkyl phenone and 2.8 g of 2,4,6-trimethylphenylbenzoyldiphenylphosphine oxide were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored in the dark.

[0055] Add above-mentioned light yellow transparent liquid resin 100g, aluminum hydroxide 10g, methylene bis(4-phenyl isocyanate) 4.0g...

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Abstract

The invention relates to a temperature-resistant thickening light-curable epoxy vinyl ester resin and a preparation method thereof. Specifically, the present invention discloses an epoxy vinyl ester resin composition comprising components (A) to (G). Also disclosed are a preparation method of the resin composition and a resin product comprising the resin composition.

Description

technical field [0001] The invention belongs to the technical field of polymers, and in particular relates to a thickening light-curable epoxy vinyl ester resin and a preparation method thereof. The resin is suitable for a light-curing process and can be used for light-curing prepreg for repairing sewage municipal pipelines and storage tanks. material resin. Background technique [0002] Epoxy vinyl ester resin takes epoxy resin as skeleton, reacts with unsaturated carboxylic acid, and is diluted with styrene or ester monomer to form a composition with unsaturated double bonds, which retains the good mechanical properties of epoxy resin. Advantages, widely used in industrial anti-corrosion, transportation, construction and other fields. [0003] Epoxy vinyl ester resin usually adopts peroxides such as methyl ethyl ketone peroxide, benzoyl peroxide, benzoyl tert-butyl peroxide, etc. to be cured at room temperature, medium temperature, high temperature and other conditions ac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/10C08F212/08C08K5/29C08G59/14
CPCC08F283/105C08K5/29C08G59/1466C08F212/08
Inventor 刘世强茆凌峰钱建华张迎超刘坐镇
Owner HUACHANG POLYMER EAST CHINA UNIV OFSCI & TECH
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