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Temperature-resistant thickening light-cured epoxy vinyl ester resin and preparation method thereof

A technology of epoxy vinyl ester and epoxy resin, which is applied in the field of polymers, can solve the problems of reducing the corrosion resistance of vinyl ester resins, being unable to be used for simultaneous temperature resistance, corrosion resistance, and material thermal deformation temperature drop, etc., to achieve The effect of high double bond content, fast photocuring speed and slow thickening speed

Active Publication Date: 2020-05-15
HUACHANG POLYMER EAST CHINA UNIV OFSCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Patent CN 105713173 A discloses "a thickening formula and thickening method for vinyl ester resin matrix" and mentions that "4-6 parts of thickening aids are added on the basis of conventional vinyl ester resins, and the thickening aids are Hydroxypropyl acrylate monomer, after thickening, forms a polyurethane structure and increases the toughness of the resin matrix. Adding ester monomers to vinyl ester resins reduces the thermal deformation temperature of the material and reduces the corrosion resistance of vinyl ester resins. , cannot be used in occasions that are both temperature resistant and corrosion resistant

Method used

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  • Temperature-resistant thickening light-cured epoxy vinyl ester resin and preparation method thereof
  • Temperature-resistant thickening light-cured epoxy vinyl ester resin and preparation method thereof
  • Temperature-resistant thickening light-cured epoxy vinyl ester resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Put 180.0g of bisphenol A type epoxy resin E12 and 250.0g of hydroxymethyl bisphenol A type epoxy resin EL-50 into the reactor, heat up to 105°C, stir evenly, add 2.0g of p-tert-butylcatechol, Stir for 10 minutes, add 114.4g of methacrylic acid, control the temperature to stabilize at 90°C, slowly add 1.2g of benzyltrimethylammonium chloride and 0.4g of 2-ethyl-4-methylimidazole in 3 times within 30 minutes , keep warm at 115-120°C, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture below 90°C, add 432.0g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50°C, add diethoxy 15 g of methyl benzophenone and 5 g of diethyl 2,4,6-tricresylbenzoyl phosphonate were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored away from light.

[0049] Add 100 g of the above-mentioned light yellow transparent liquid resin, 30 g of calcium carbonate, 5.1 g of methylene bis(4-phenylisocyan...

Embodiment 2

[0051] Put 190g of bisphenol A type epoxy resin E20 and 200.0g of hydroxymethyl bisphenol A type epoxy resin CEQ-45 into the reactor, raise the temperature to 105°C, stir evenly, add 2-tert-butylhydroquinone 3.0 g, stirred for 10 minutes, added 112.5g of methacrylic acid, controlled the temperature to stabilize at 90°C, slowly added 0.8g of benzyltriethylammonium chloride and 1.6g of 1-methylimidazole in 3 times within 30 minutes, and kept warm for 115 -120°C, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture below 90°C, add 471.1g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50°C, add 2-hydroxy-2- 18 g of methyl-1-phenylacetone and 3 g of 2,4,6-tricresylbenzoyldiphenylphosphine oxide were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored away from light.

[0052] Add 100g of the above-mentioned light yellow transparent liquid resin, 20g of aluminum hydroxide, 4.2g of ...

Embodiment 3

[0054] Put 241.6g of bisphenol A type epoxy resin E14 and 160g of hydroxymethyl bisphenol A type epoxy resin Apogen101 into the reactor, heat up to 105°C, stir evenly, add 3.5g of di-tert-butyl p-cresol, stir for 10 Minutes, add 95.1g of methacrylic acid, control the temperature to stabilize to 90°C, slowly add 0.9g of benzyldimethylamine and 1.5g of 2-phenyl-4-methyl-5-hydroxymethylimidazole in 3 times within 30 minutes, Keep warm at 115-120°C, react for 1.5-2.5 hours, the acid value is less than 12mgKOH / g, cool the mixture below 90°C, add 480g of styrene, stir for 30 minutes, when the temperature of the mixture is lower than 50°C, add α-aminoalkyl 15 g of benzophenone and 2.8 g of 2,4,6-tricresylbenzoyldiphenylphosphine oxide were stirred for 30 minutes to obtain a light yellow transparent liquid resin, which was stored away from light.

[0055] Add 100 g of the above-mentioned light yellow transparent liquid resin, 10 g of aluminum hydroxide, 4.0 g of methylene bis(4-phenyl...

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Abstract

The invention relates to a temperature-resistant thickening light-cured epoxy vinyl ester resin and a preparation method thereof, and specifically discloses an epoxy vinyl ester resin composition. Thecomposition comprises components (A) to (G). The invention also discloses a method for preparing the resin composition, and a resin product comprising the resin composition.

Description

technical field [0001] The invention belongs to the technical field of macromolecules, and in particular relates to a thickening light-curable epoxy vinyl ester resin and a preparation method thereof. The resin is suitable for light-curing technology and can be used for light-curing prepreg for repairing sewage municipal pipelines and storage tanks material resin. Background technique [0002] Epoxy vinyl ester resin takes epoxy resin as the skeleton, reacts with unsaturated carboxylic acid, and dilutes with styrene or ester monomer to form a composition with unsaturated double bonds, which retains the good mechanical properties of epoxy resin Advantages, widely used in industrial anticorrosion, transportation, construction and other fields. [0003] Epoxy vinyl ester resins are usually cured with peroxides such as methyl ethyl ketone peroxide, benzoyl peroxide, and tert-butyl benzoyl peroxide at room temperature, medium temperature, and high temperature, respectively, depe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F212/08C08K5/29C08G59/14
CPCC08F283/105C08K5/29C08G59/1466C08F212/08
Inventor 刘世强茆凌峰钱建华张迎超刘坐镇
Owner HUACHANG POLYMER EAST CHINA UNIV OFSCI & TECH
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