Liquid metal conductive paste and preparation method thereof, and electronic device

A liquid metal and conductive paste technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, electrical components, cables/conductors, etc., can solve the problems of pollution efficiency, operator injury, high energy consumption, etc.

Inactive Publication Date: 2020-05-08
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Oily slurries contain a large amount of organic solvents, causing air pollution and injury to operators
Although water-based slurry will not cause harm to people, due to the high specific heat of water, there will be defects such as long baking time, high energy consumption, inability to meet the molding on non-temperature-resistant substrates, serious pollution and low efficiency.

Method used

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  • Liquid metal conductive paste and preparation method thereof, and electronic device
  • Liquid metal conductive paste and preparation method thereof, and electronic device
  • Liquid metal conductive paste and preparation method thereof, and electronic device

Examples

Experimental program
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Effect test

preparation example Construction

[0050] In addition, an embodiment of the present invention also provides a method for preparing a liquid metal conductive paste, which is used to manufacture the liquid metal conductive paste described in any one of the above. Specifically, such as figure 2 as shown, figure 2 The flow chart of the preparation method of the liquid metal conductive paste provided by the embodiment of the present invention, the preparation method of the liquid metal conductive paste includes:

[0051] Step S1, dissolving the main resin with a reactive diluent.

[0052] It should be noted that, when the liquid metal conductive paste also includes additives, the additives can be added after the main resin is dissolved in step S1, and then step S2 is performed.

[0053] Step S2, adding electron radiation curing agent and auxiliary agent to the material obtained in step S1.

[0054] Step S3, weighing the liquid metal and the conductive filler, and putting them into a closed container together wi...

Embodiment 1

[0077] Liquid metal conductive paste:

[0078] composition Types of Dosage (g) Main resin Polyurethane Modified Acrylic Resin 3 Conductive filler flake silver powder 12 liquid metal Gallium Indium Tin Eutectic Alloy 6 Active diluent Methyl methacrylate 5 Electronic Radiation Curing Agent Hexylene glycol diacrylate 3 Defoamer BYK028 0.5

Embodiment 2

[0080] Liquid metal conductive paste:

[0081]

[0082] The test initial resistance and bending resistance data of the conductive circuit made of the liquid metal conductive paste in embodiment 1 and embodiment 2, and the test initial resistance and bending resistance data of the conductive circuit made of traditional rolled copper foil are as follows (each The difference between the conductive lines is only that the materials are different, and other parameters such as length, width, and thickness are the same. for 200mm):

[0083] Example 1 Example 2 Calendered Copper Foil initial resistance 6.7,6.7 7.2,7.4 0.3 10,000 times 7.0,6.9 7.4,7.6 0.6 20,000 times 6.8,6.8 7.3,7.6 2.8 30,000 times 6.9,6.8 7.6,7.7 11.8 40,000 times 6.9,6.9 7.7,7.7 82.6 50,000 times 7.0,7.1 7.6,7.7 85.4 60,000 times 6.9,6.9 7.7,7.7 90.8 70,000 times 7.1,7.2 7.6,7.7 fracture 80,000 times 7.0,7.1 7.6,7.7 fracture...

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Abstract

The invention provides a liquid metal conductive paste and a preparation method thereof, and an electronic device, and relates to the technical field of new materials. The liquid metal conductive paste provided by the invention comprises, by weight, 5%-30% of a matrix resin, 10%-60% of a conductive filler, 2%-30% of an electron irradiation curing agent, 1%-40% of liquid metal, 10%-30% of a reactive diluent and 0%-10% of an auxiliary agent, wherein the liquid metal is a metal simple substance or alloy with a melting point lower than a room temperature. According to the technical scheme, pollution in a forming process of a conductive circuit can be reduced, and the conductive circuit can be manufactured on a non-temperature-resistant base material.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular to a liquid metal conductive paste, a preparation method thereof, and an electronic device. Background technique [0002] In recent years, with the rapid development of electronic information technology, the market has increasingly stringent requirements for the specificity and functionality of printed conductive materials. Conductive materials have gradually developed from single materials such as metal and carbon to composite conductive pastes. [0003] At present, most conductive pastes are prepared by thermal curing to prepare conductive lines in electronic devices. Ordinary heat-curing conductive paste can be divided into oily paste and water-based paste according to the type of solvent used. After molding, the contained solvent is gradually volatilized or absorbed, and then the conductive particles are in contact with each other to realize the conductive function. Oil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 董仕晋门振龙于洋
Owner BEIJING DREAM INK TECH CO LTD
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