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Preparation method of carbon fiber uniformly-electroplated copper layer

A technology of uniform electroplating and electroplating copper layer, which is applied in the direction of electrolysis process, electrolytic components, cells, etc., can solve the problems that affect the degree of close bonding between the plating layer and carbon fiber, the quality of the copper plating layer, and the complicated process procedures, etc., to achieve low cost and high-quality plating The effect of good combination and simple process

Active Publication Date: 2020-04-14
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the process methods applied to carbon fiber copper plating include: electroless plating, electroplating, electroless plating-electroplating, and two-step electroplating, etc. These processes are complicated, costly, pollute the environment, and the quality of the copper plating layer is average.
[0005] However, for copper plating on the surface of carbon fiber, due to the high roughness of the carbon fiber surface, it will affect the degree of tight bonding between the coating and the carbon fiber.

Method used

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  • Preparation method of carbon fiber uniformly-electroplated copper layer
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  • Preparation method of carbon fiber uniformly-electroplated copper layer

Examples

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Embodiment 1

[0041] A method for preparing a carbon fiber uniform electroplated copper layer, comprising:

[0042] (1) Carbon fiber desizing: Cut the 12K (a bundle of fibers is 12000 carbon fiber monofilaments) carbon fiber tows with a monofilament diameter of 7 to 8 μm into short fiber tows with a length of 5 cm, and place them in acetone at 115 ° C. Reflux for 48 hours, then wash with acetone for 3 times, and dry in a blast oven at 50°C for 5 hours;

[0043] (2) Fix the desizing-treated carbon fibers on the metal support by physical methods to ensure that the carbon fibers are dispersed as much as possible;

[0044] (3) Configuration of electroplating solution: 100.00g CuSO 4 ·5H 2 O, 20.00g C 4 h 4 o 6 KNa·4H 2 O, 180.00gC 6 h 5 Na 3 o 7 2H 2 O, 24.00g KNO 3 Dissolve 0.10g of polyethylene glycol (PEG) in 1L of ultrapure water, stir evenly at room temperature, then add 0.27g of NaCl, the composition of the electroplating solution is shown in Table 1 below, and continue to sti...

Embodiment 2

[0050] A preparation method of carbon fiber uniform electroplated copper layer is basically the same as the method of embodiment 1, the difference is:

[0051] In step (1), the temperature of acetone reflux is 100°C; the drying temperature is 40°C;

[0052] In step (4), the distance between cathode and anode is 4cm, and the current density is kept at 0.80mA / cm 2 , the voltage is 1.5V, electroplating is 90min; the drying temperature is 40°C.

[0053] like Figure 5 Shown is the scanning electron microscope (SEM) image of the topography of the copper layer on the surface of the carbon fiber in Example 2 of the present invention. Compared with Example 1, the final attachments on the surface of the carbon fiber are the same copper grains, and the material of the copper grains There is no difference in the structure itself, but there are small differences in the amount of adhesion and surface morphology, but the copper grains on the surface of the carbon fiber are very uniform, a...

Embodiment 3

[0056] A preparation method of carbon fiber uniform electroplated copper layer is basically the same as the method of embodiment 1, the difference is:

[0057] In step (1), the temperature of acetone reflux is 120°C; the drying temperature is 60°C;

[0058] In step (4), the distance between cathode and anode is 10cm, and the current density is kept at 1.00mA / cm 2 , the voltage is 3.0V, electroplating is 60min; the drying temperature is 60°C.

[0059] like Image 6 Shown is the scanning electron microscope (SEM) image of the topography of the copper layer on the surface of the carbon fiber in Example 3 of the present invention. Compared with Example 1, the final attachments on the surface of the carbon fiber are the same copper grains, and the material of the copper grains There is no difference in the structure itself, but there are small differences in the amount of adhesion and surface morphology, but the copper grains on the surface of the carbon fiber are very uniform, a...

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Abstract

The invention discloses a preparation method of a carbon fiber uniformly-electroplated copper layer. The method comprises the steps: (1) desizing carbon fibers; (2) fixing the carbon fibers; and (3) taking the carbon fibers as a cathode and a phosphor copper plate as an anode, connecting a circuit, putting the connected circuit into an electroplating bath containing an electroplating liquid, adjusting the distance between the cathode and the anode to be 4-10 cm, keeping the current density to be 0.80-1.00 mA / cm<2>, the voltage to be 1.5-3.0 V and the electroplating temperature to be 10-30 DEGC, and electroplating for 60-90 min, wherein the electroplating liquid comprises CuSO4.5H2O, C4H4O6KNa.4H2O, C6H5Na3O7.2H2O, KNO3, polyethylene glycol, NaCl and water. According to the method, by controlling the components, the concentration and the current density of the electroplating liquid, the thickness, the uniformity and the surface appearance of the electroplated carbon fiber copper plating layer can be changed, the binding force of the plating layer is good and uniform, and the carbon fibers cannot be bonded.

Description

technical field [0001] The invention relates to a method for electroplating copper, in particular to a method for preparing a uniform electroplated copper layer of carbon fibers. Background technique [0002] The composite material with carbon fiber as reinforcement has high specific strength, high specific modulus and excellent heat resistance, and is an ideal engineering material. However, the wettability and compatibility between carbon fibers and various matrices are poor, so that the external load cannot be transmitted to the bearing fibers through the matrix, and the fibers do not play a reinforcing role but weaken the performance of the matrix. In addition, carbon fiber can undergo graphite transformation at a certain temperature in some catalytic matrix (such as Fe, Ni), and a brittle reaction layer is formed at the two-phase interface, which significantly reduces the mechanical properties of the composite material. [0003] In order to solve the above problems, one...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D3/38C25D21/12
CPCC25D3/38C25D5/54C25D21/12
Inventor 武建勋谢海生吴芮刘俊逸费德君
Owner SICHUAN UNIV
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