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A kind of preparation method of carbon fiber uniform electroplating copper layer

A technology for uniform electroplating and electroplating of copper layers, applied in the electrolytic process, electrolytic components, cells, etc., can solve the problems that affect the close bond between the coating and carbon fiber, the quality of the copper coating is general, and the process procedures are complex, and achieve low cost, coating The effect of good binding force and simple process

Active Publication Date: 2021-04-09
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the process methods applied to carbon fiber copper plating include: electroless plating, electroplating, electroless plating-electroplating, and two-step electroplating, etc. These processes are complicated, costly, pollute the environment, and the quality of the copper plating layer is average.
[0005] However, for copper plating on the surface of carbon fiber, due to the large roughness of the carbon fiber surface, it will affect the degree of tight bonding between the coating and the carbon fiber.

Method used

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  • A kind of preparation method of carbon fiber uniform electroplating copper layer
  • A kind of preparation method of carbon fiber uniform electroplating copper layer
  • A kind of preparation method of carbon fiber uniform electroplating copper layer

Examples

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Embodiment 1

[0041] A method for preparing a carbon fiber uniform electroplated copper layer, comprising:

[0042] (1) Carbon fiber desizing: Cut the 12K (a bundle of fibers is 12000 carbon fiber monofilaments) carbon fiber tows with a monofilament diameter of 7 to 8 μm into short fiber tows with a length of 5 cm, and place them in acetone at 115 ° C. Reflux for 48 hours, then wash with acetone for 3 times, and dry in a blast oven at 50°C for 5 hours;

[0043] (2) Fix the desizing-treated carbon fibers on the metal support by physical methods to ensure that the carbon fibers are dispersed as much as possible;

[0044] (3) Configuration of electroplating solution: 100.00g CuSO 4 ·5H 2 O, 20.00g C 4 h 4 o 6 KNa·4H 2 O, 180.00gC 6 h 5 Na 3 o 7 2H 2 O, 24.00g KNO 3 Dissolve 0.10g of polyethylene glycol (PEG) in 1L of ultrapure water, stir evenly at room temperature, then add 0.27g of NaCl, the composition of the electroplating solution is shown in Table 1 below, and continue to sti...

Embodiment 2

[0050] A preparation method of carbon fiber uniform electroplated copper layer is basically the same as the method of embodiment 1, the difference is:

[0051] In step (1), the temperature of acetone reflux is 100°C; the drying temperature is 40°C;

[0052] In step (4), the distance between cathode and anode is 4cm, and the current density is kept at 0.80mA / cm 2 , the voltage is 1.5V, electroplating is 90min; the drying temperature is 40°C.

[0053] Such as Figure 5 Shown is the scanning electron microscope (SEM) image of the topography of the copper layer on the surface of the carbon fiber in Example 2 of the present invention. Compared with Example 1, the final attachments on the surface of the carbon fiber are the same copper grains, and the material of the copper grains There is no difference in the structure itself, but there are small differences in the amount of adhesion and surface morphology, but the copper grains on the surface of the carbon fiber are very uniform...

Embodiment 3

[0056] A preparation method of carbon fiber uniform electroplated copper layer is basically the same as the method of embodiment 1, the difference is:

[0057] In step (1), the temperature of acetone reflux is 120°C; the drying temperature is 60°C;

[0058] In step (4), the distance between cathode and anode is 10cm, and the current density is kept at 1.00mA / cm 2 , the voltage is 3.0V, electroplating is 60min; the drying temperature is 60°C.

[0059] Such as Image 6 Shown is the scanning electron microscope (SEM) image of the topography of the copper layer on the surface of the carbon fiber in Example 3 of the present invention. Compared with Example 1, the final attachments on the surface of the carbon fiber are the same copper grains, and the material of the copper grains There is no difference in the structure itself, but there are small differences in the amount of adhesion and surface morphology, but the copper grains on the surface of the carbon fiber are very uniform...

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Abstract

The invention discloses a method for preparing a uniform electroplated copper layer of carbon fibers. The method comprises: (1) desizing carbon fibers; (2) fixing carbon fibers; In the electroplating tank containing the electroplating solution, adjust the distance between the cathode and the anode to be 4-10cm, and keep the current density at 0.80-1.00mA / cm 2 , the voltage is 1.5-3.0V, the electroplating temperature is 10-30°C, and the electroplating is 60-90min. Among them, the electroplating solution contains: CuSO 4 ·5H 2 O, C 4 h 4 o 6 KNa·4H 2 O, C 6 h 5 Na 3 o 7 2H 2 O. KNO 3 , polyethylene glycol, NaCl and water. The method of the invention can change the thickness, uniformity and surface appearance of the carbon fiber copper coating after electroplating by controlling the composition, concentration and current density of the electroplating solution, and the coating has good and uniform bonding force and no bonding between carbon fibers.

Description

technical field [0001] The invention relates to a method for electroplating copper, in particular to a method for preparing a uniform electroplated copper layer of carbon fibers. Background technique [0002] The composite material with carbon fiber as reinforcement has high specific strength, high specific modulus and excellent heat resistance, and is an ideal engineering material. However, the wettability and compatibility between carbon fibers and various matrices are poor, so that the external load cannot be transmitted to the bearing fibers through the matrix, and the fibers do not play a reinforcing role but weaken the performance of the matrix. In addition, carbon fiber can undergo graphite transformation at a certain temperature in some catalytic matrix (such as Fe, Ni), and a brittle reaction layer is formed at the two-phase interface, which significantly reduces the mechanical properties of the composite material. [0003] To solve the above problems, one of the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/54C25D3/38C25D21/12
CPCC25D3/38C25D5/54C25D21/12
Inventor 武建勋谢海生吴芮刘俊逸费德君
Owner SICHUAN UNIV
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