Light- or heat-curing method and curable resin composition

A curing method and compound technology, applied in chemical instruments and methods, epoxy resin coatings, optics, etc., can solve problems such as sufficient thermal conductivity of resin

Active Publication Date: 2020-01-10
FUJIFILM WAKO PURE CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires the addition of a certain amount of organic resin raw materials, so the upper limit of the filling ratio of the filler to the entire composition is limited, and it may not be possible to say that the thermal conductivity of the obtained resin (cross-linked product) is sufficient.

Method used

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  • Light- or heat-curing method and curable resin composition
  • Light- or heat-curing method and curable resin composition
  • Light- or heat-curing method and curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0331] Example 1: Production of a cured film using a resin composition by irradiation of light (active energy rays) and evaluation of physical properties of the obtained cured film

[0332] To 1,2-diisopropyl-4,4,5,5-tetramethylbiguanide 2-(3-benzoylphenyl) propionate [compound (A)], aluminum tri-sec-butoxide [ Add ion-exchanged water [water (D)] and carbitol acetate [ organic solvent] mixed solution and stirred for 30 minutes to prepare a sol solution. Next, the above-mentioned The sol liquid prepared in , was kneaded for 3 minutes at a rotational speed of 2000 rpm using a planetary mixer (THINKY CORPORATION "Awatori Rentaro AR-250") to prepare a resin composition. The obtained resin composition was coated on an aluminum plate to prepare a coating film, and after prebaking at 150° C., the coating film was prepared using “HLR-100-2” manufactured by SEN LIGHTS Co., Ltd. Irradiate light for 1 minute (active energy rays: surface illumination 254nm = 9mJ / cm 2 and 365nm=11mJ / cm...

Embodiment 2～5

[0371] Examples 2 to 5: Preparation of cured film using a resin composition added with a compound having two or more epoxy groups and evaluation of physical properties of the obtained cured film

[0372] In addition to adding a compound with two or more epoxy groups to the curing system of Example 1 or replacing the type of aluminum nitride used in Example 1, a cured film was produced in the same manner as in Example 1, and evaluated its many properties. Table 5 shows the usage-amount (molar amount) and evaluation result of each component. In addition, the names and places of purchase of components not used in Example 1 and Comparative Examples 1 to 3 among the components used in Examples 2 to 5 are shown below.

[0373] -(I) Filler-

[0374] Aluminum nitride (AlN) (manufactured by TOYO ALUMINUM K.K.; TFZ-A02P; average particle size 1.5 μm)

[0375] Aluminum nitride (AlN) (manufactured by TOYO ALUMINUM K.K.; TFZ-A15P; average particle diameter 15.0 μm)

[0376] -(J) Compou...

Embodiment 6～7

[0383] Examples 6-7: Production of a cured film using a resin composition added with a chelating agent and evaluation of physical properties of the obtained cured film

[0384] Methyl acetoacetate [chelating agent (F)] was added to aluminum tri-sec-butoxide [aluminum alkoxide (B)], and stirred until heat generation ceased. Next, add 1,2-diisopropyl-4,4,5,5-tetramethylbiguanide 2-(3-benzoylphenyl)propionate [compound (A)] and (3-mercapto Propyl) trimethoxysilane [silane coupling agent (C)], and then add a solution of ion-exchanged water [water (D)] and carbitol acetate [organic solvent], and stir for 30 minutes And prepare the sol solution. Next, the sol prepared above was added to a mixture of triallyl cyanurate [compound (H)], aluminum nitride [filler (I)] and carbitol acetate [organic solvent], And it kneaded for 3 minutes at 2000 rpm using the planetary mixer (THINKY CORPORATION "Awatori Rentaro AR-250"), and produced the resin composition. The obtained resin composition...

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Abstract

The purpose of the present invention is to provide a light- or heat-curing method whereby a cured material (crosslinked material / resin) can be obtained even when a large amount of a filler is included, and to provide a curable resin composition used in the curing method. The present invention relates to a light- or heat-curing method and a curable resin composition used in the curing method, the curing method including: a step 1 for obtaining a condensate having Si-O-Al and / or Si-O-Si constituent units, obtained from a silane derived from a silane coupling agent having a mercapto group and aluminum derived from (E) an aluminum alkoxide, from (A) a compound comprising a salt of a carboxylic acid and an amine and having a carbonyl group for generating a radical and a carboxylate group for decarboxylating and generating a base by light irradiation or heating, (B) an aluminum alkoxide, (C) a silane coupling agent having a mercapto group, and (D) water; and a step 2 for reacting the condensate (E), (H) a compound having two or more polymerizable unsaturated groups, and (I) a filler under a condition of light irradiation or heating.

Description

technical field [0001] The present invention relates to a light or thermal curing method for obtaining a cured product (crosslinked product / resin) containing a filler, a curable resin composition used in the curing method, and the like. Background technique [0002] With the increasing demand for high-power LED devices for lighting applications, electronic devices represented by PCs and tablet terminals that process high-speed and large-capacity information, and power semiconductors that control motors in electric vehicles or hybrid vehicles, etc. With higher performance and higher density, the heat generated from components becomes a problem. The generated heat has problems such as having a great influence on the performance and life of the product. How to efficiently dissipate the generated heat without sacrificing product performance such as miniaturization / lightweight / thinness has become an issue. [0003] In general, metals and ceramics are examples of materials with ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G75/045C08G79/10C08L81/02C08L85/00C09D181/02C09D185/00C09K5/14G03F7/004H05K1/05H05K3/44
CPCC08G75/045C08L81/02C09K5/14G03F7/094G03F7/091G03F7/0752C09D163/00H05K2201/0162H05K1/0353C08K3/28C08K5/1545C08F2/44C08F2/50C08K5/175C08K5/0025C08K5/56C08K5/548C08K5/09C08K5/1515C08K2003/282C08K2201/001C08G79/10C08L85/00C09D181/02C09D185/00G03F7/004H05K1/05H05K3/44
Inventor 中野正酒井信彦筑场康佑今关重明
Owner FUJIFILM WAKO PURE CHEM CORP
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