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Method for improving nickel electroplating quality of aluminum-silicon alloy

A technology of silicon-aluminum alloy and electroplating nickel, which is applied in the direction of electrolytic coating, surface reaction electrolytic coating, anodic oxidation, etc., can solve problems such as delamination, rough coating, and blistering, and achieve manufacturing cost reduction, electroplating cost reduction, and product quality. The effect of high pass rate

Active Publication Date: 2020-01-10
GUIZHOU ZHENHUA HUALIAN ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned defects existing in the prior art, the present invention provides a method for improving the quality of electroplating nickel on silicon-aluminum alloys; to solve the quality problems of delamination, foaming, and rough coatings that are prone to occur between the base layer and the coating; to improve the quality of electroplating products Pass rate; an electroplating process technology and bath solution formula to improve the convenience of operation

Method used

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  • Method for improving nickel electroplating quality of aluminum-silicon alloy
  • Method for improving nickel electroplating quality of aluminum-silicon alloy
  • Method for improving nickel electroplating quality of aluminum-silicon alloy

Examples

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Embodiment 1

[0044] A method for improving the quality of electroplating nickel on silicon-aluminum alloys, comprising:

[0045] (1) Organic degreasing: soak the silicon-aluminum alloy in an organic solvent, wash at 50°C for 15 minutes, and dry the silicon-aluminum alloy for later use; the organic solvent is composed of turpentine and gasoline with a mass ratio of 3:1;

[0046] (2) Cleaning: Rinse the silicon-aluminum alloy in clean water at room temperature for 1-15 minutes;

[0047] (3) Electrolytic degreasing: use tungsten carbide-based hard alloy as the cathode, and silicon-aluminum alloy as the anode, and put it into the electrolyte solution for electrolytic degreasing for 5 minutes. The formula of the electrolyte is tripotassium phosphate 80g / L, acetic acid 20g / L, potassium hydroxide 5g / L, sodium sulfate 10g / L, and the balance is water; the electrolysis conditions are: temperature 55°C, current density 8A / dm 2 ;

[0048] (4) Drying: bake the silicon-aluminum alloy at 60°C and 0.1 s...

Embodiment 2

[0072] A method for improving the quality of electroplating nickel on silicon-aluminum alloys, comprising:

[0073] (1) Organic degreasing: soak the silicon-aluminum alloy in an organic solvent, wash at 55° C. for 15 minutes, and dry the silicon-aluminum alloy for later use; the organic solvent is composed of turpentine and gasoline with a mass ratio of 3:1;

[0074] (2) Cleaning: Rinse the silicon-aluminum alloy in clean water at room temperature for 1 min;

[0075] (3) Electrolytic degreasing: use tungsten carbide-based hard alloy as the cathode, and silicon-aluminum alloy as the anode, and put it into the electrolyte solution for electrolytic degreasing for 8 minutes. The formula of the electrolyte is tripotassium phosphate 80g / L, acetic acid 20g / L, potassium hydroxide 5g / L, sodium sulfate 10g / L, and the balance is water; the electrolysis conditions are: temperature 55°C, current density 8A / dm 2 ;

[0076] (4) Drying: bake the silicon-aluminum alloy at 65°C and 0.2 standa...

Embodiment 3

[0100] Implement according to the steps of Example 2, but the step (21) pre-nickeling is changed to: put the silicon-aluminum alloy into the alkaline pre-nickeling solution for pre-nickeling, at a temperature of 26° C., pre-plating for 5 minutes; the pre-nickeling The solution formula is: nickel chloride 19g / L, sodium hypophosphite 20g / L, sodium pyrophosphate 30g / L, sodium citrate 3g / L, potassium hydroxide 6g / L; other operating measures are the same.

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Abstract

The invention relates to the field of aluminum-silicon alloy electroplating, in particular to a method for improving the nickel electroplating quality of aluminum-silicon alloy. The method comprises the steps of organic oil removal, cleaning, electrolytic degreasing, drying, sand blasting, cleaning, oil removal, cleaning, descaling, cleaning, racking, cleaning, activation, cleaning, hard sulfuricacid anodizing, cleaning, copper pre-plating, cleaning, activation, cleaning, nickel pre-plating, nickel plating, cleaning, cleaning with hot water, cleaning and drying. According to the method, through adding of the steps of activation and hard sulfuric acid anodizing, the bonding between a substratum and copper plating is promoted, and generation of watermarks after plating is avoided; the qualified rate reaches 97%, and rework is reduced after the plating quality is qualified; the plating cost is reduced, so that the overall manufacturing cost is further reduced; meanwhile, the delivery cycle is shortened; and the method is high in adaptation to operators, and benefits scale promotion.

Description

technical field [0001] The invention relates to the field of silicon aluminum alloy electroplating, in particular to a method for improving the quality of silicon aluminum alloy electroplating nickel. Background technique [0002] The current silicon-aluminum alloy electroplating nickel, the plating quality is not good, and the electroplating process is cumbersome: silicon-aluminum alloy → degreasing → cleaning → drying → sandblasting → cleaning → pickling → cleaning → hanging → cleaning → zinc dipping → once Cleaning → dezincification → cleaning → secondary galvanizing → cleaning → pre-plating copper → cleaning → activation → cleaning → pre-nickel plating → nickel plating → recycling → cleaning → drying → inspection → storage, plus hanging to pre-plating Copper: There are 7 processes in the galvanizing process and 8 processes in pre-copper plating, and there are two galvanizing and one dezincifying processes. It is difficult to control the operation, the product qualificati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/14C25D11/10C25D11/08C25D11/16C25D5/44C25D3/12C25D3/38
CPCC25D3/12C25D3/38C25D5/14C25D5/44C25D11/08C25D11/10C25D11/16
Inventor 潘彦霖黎学良龙建成覃淑王钰茸杨琎许蕾龙光武张玉春潘松
Owner GUIZHOU ZHENHUA HUALIAN ELECTRONICS
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