A kind of preparation method of elastic pressure-sensitive adhesive tape and elastic pressure-sensitive adhesive tape

Abstract

The present invention proposes a preparation method of an elastic pressure-sensitive adhesive tape and the elastic pressure-sensitive adhesive tape. The present invention adopts a polyacrylate resin containing carbon-carbon double bonds and a diluted monomer containing carbon-carbon double bonds as the main components of the adhesive, and Microcapsule-like powder components are used, wherein the shell material of the microcapsule-like powder is made of cellulose-based water-soluble polymers, the core material is made of low-boiling alkanes, and the preparation method of UV curing and heating to break the shell is used to obtain its own The adhesive layer has elasticity, and the finished pressure-sensitive adhesive tape is prepared. Compared with the elastic pressure-sensitive adhesive tape in the prior art, the preparation method of the invention has simple preparation process. The pressure-sensitive adhesive tape obtained by the preparation method of the invention breaks through the limitation of traditional foam tapes, and can have good cushioning and compressibility without using foam as a base material.

Description

Technical field [0001] The invention relates to the technical field of pressure-sensitive adhesive tapes, in particular to a method for preparing elastic pressure-sensitive adhesive tapes and elastic pressure-sensitive adhesive tapes. Background technique [0002] As all kinds of smart electronic products have more and more stringent requirements for anti-drop, anti-deformation, waterproof and dust-proof, hardware manufacturers urgently need high-performance energy-absorbing materials to achieve the above functions. At present, most of the pressure-sensitive tapes with cushioning properties on the market are foam tapes. [0003] Foam tape is a kind of tape product made with foam as the base material. This tape is thicker than ordinary tape, has better sealing and shock absorption effect, and can be used in many occasions. The common foam is a polyolefin or polyurethane foam material. The polyolefin or polyurethane is heated and cut to a high-temperature molten state through equipm...

AI Technical Summary

Problems solved by technology

Due to the characteristics of the foam tape itself, this kind of foam tape often has some inherent deficiencies in its manufacture and application: (1) Since the foam material is made of polyolefin or polyurethane materials, the heat resistance is not good. Well, when there is not enough external tension support, different degrees of shrinkage, arching and other deformations will occur at 80°C, which makes the foam strips unable to undergo high-temperature processing, which means that glue cannot be used directly on the surface of the foam. Coating process to make foam tape: solvent-based glue requires high temperature to remove solvent and cure, UV-type glue will also generate high temperature during long-term UV curing, both of which will cause foam deformation, so only pressure-sensitive Glue is coated on the release film and then pasted on the foam to make the foam tape; and the surface energy of the foam is mostly below 32 dynes, which leads to the production of the foam tape must pass corona, Pre-coating adhesion promoters and other methods to improve the surface energy of the foam, so as to ensure that the pressure-sensitive adhesive layer can be bonded to the surface of the foam, and the bonding strength is sufficient. The process is complicated and the manufacturing cost is high.

(2) Before the foam tape is assembled into the interior of the smart electronic product, cushioning devices of various shapes need to be processed through a die-cutting process. During the die-cutting process, since polyolefin or polyurethane itself is relatively brittle, it is prone to dust , and electronic products have high requirements on cleanliness, which makes it necessary to always pay attention to whether the devices with foam tape produce dust during the assembly process, which increases the cost of quality

[0005] In the prior art, it is reported that expandable polymer microspheres are applied to the adhesive to obtain the pressure-sensitive adhesive sheet through die extrusion, and then laminated with the liner to form an adhesive tape; this method has the following defects: ( 1) It is impossible to produce pressure-sensitive adhesive tapes with thin thickness (less than 200 microns), so it is difficult to apply to ultra-thin spaces; (2) The expandable polymer microspheres are only partially absorbed before the adhesive composition exits the die. Expansion, after extrusion, it can continue to expand after being heated. It is used in the bonding of electronic devices, and there is a risk of continuing to expand and cause damage to the device; (3) After the expansion of the polymer microspheres, the shell is fixed, and the final pressure-sensitive adhesive sheet is elastic. / The compressibility is limited by the mechanical strength of the shell of the microsphere, and the elasticity of the microsphere needs to be changed by adjusting the material and thickness of the shell; (4) The production process of expandable polymer microspheres is relatively cumbersome, and the shell material has high mechanical strength. High temperature above 100°C is required to achieve expansion; (5) It is manufactured by melt extrusion process, the feeding equipment is huge and complicated, and high temperature above 100°C is required to realize the expansion of polymer microspheres, high energy consumption and cumbersome process

The pressure-sensitive adhesive sheet in the aforementioned report is not suitable for current thin and light smart electronic products

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