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Heat-conductive double-sided adhesive based on EB curing and preparation method thereof

A heat-conducting double-sided adhesive, double-sided technology, applied in the field of heat-conducting adhesives, to achieve the effect of fast speed, high production capacity and low cost

Inactive Publication Date: 2019-11-01
CGN DASHENG ELECTRON ACCELERATOR TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to solve the problem of how to design the components suitable for EB curing thermally conductive double-sided adhesive, reduce the preparation cost of thermally conductive double-sided adhesive, and improve the thermal conductivity of thermally conductive double-sided adhesive, and propose a thermally conductive double-sided adhesive based on EB curing. Glue

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  • Heat-conductive double-sided adhesive based on EB curing and preparation method thereof
  • Heat-conductive double-sided adhesive based on EB curing and preparation method thereof

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preparation example Construction

[0018] A method for preparing a thermally conductive double-sided adhesive based on EB curing, comprising the following steps: S1, fully ethoxylated bisphenol A dimethacrylate, diluting monomers containing acrylate functional groups, thermally conductive and heat-dissipating fillers and auxiliary agents After mixing evenly, grind to obtain EB cured thermally conductive glue; S2, apply the EB cured thermally conductive glue in step S1 to the PET double-sided release film, and place the coated PET double-sided release film in a nitrogen atmosphere Next, EB curing is carried out to obtain a thermally conductive double-sided adhesive. In this application, the ethoxylated bisphenol A dimethacrylate, diluting monomers containing acrylate functional groups, heat-conducting and heat-dissipating fillers and additives are fully mixed through a high-speed mixer, the speed of the high-speed mixer is ≥ 2500rpm, and the stirring time is 20min ~30min to obtain a uniformly stirred mixture, an...

Embodiment 1

[0022] Preparation of EB curing thermally conductive glue: mix 15kg 8 ethoxylated bisphenol A dimethacrylates, 25kg 12 ethoxylated bisphenol A dimethacrylates, 15kg 2-phenoxyethyl acrylic acid Esters, 2kg cyclotrimethylolpropane cyclomethylal acrylate, 35kg alumina, 3kg dispersant BYK110, 1kg Degussa gas silicon A200 are put into the reaction vessel, and the high-speed mixer is used to fully stir and mix, and the stirring speed is ≥ 2500rpm, the stirring time is 20min to obtain a uniform mixture, and then use a sand mill to grind the homogeneous mixture. The number of grinding times is 2 times to obtain EB cured thermally conductive glue.

[0023] Preparation of EB-cured thermally conductive adhesive: First, apply the above-mentioned EB-cured thermally-conductive glue evenly on a PET double-sided release film with a thickness of 25 μm using a scraper coater. The weight is 40g, the release grammage of the other side is 20g, and the coating thickness of the EB curing thermally c...

Embodiment 2

[0025] Preparation of EB curing thermally conductive glue: mix 15kg 8 ethoxylated bisphenol A dimethacrylates, 25kg 12 ethoxylated bisphenol A dimethacrylates, 15kg 2-phenoxyethyl acrylic acid Esters, 2kg cyclotrimethylolpropane cyclomethylal acrylate, 35kg alumina, 3kg dispersant BYK110, 1kg Degussa gas silicon A200 are put into the reaction vessel, and the high-speed mixer is used to fully stir and mix, and the stirring speed is ≥ 2500rpm, the stirring time is 20min to obtain a uniform mixture, and then use a sand mill to grind the homogeneous mixture. The number of grinding times is 2 times to obtain EB cured thermally conductive glue.

[0026] Preparation of EB-cured thermally conductive adhesive: First, apply the above-mentioned EB-cured thermally-conductive glue evenly on a PET double-sided release film with a thickness of 25 μm using a scraper coater. The weight is 40g, and the release grammage of the other side is 20g, and the other side of the PET double-sided release...

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Abstract

The invention relates to a heat-conductive double-sided adhesive based on EB curing. The heat-conductive double-sided adhesive is prepared from the following main components in percentages by mass: 20% to 60% of ethoxylated bisphenol A dimethacrylate, 10% to 40% of a diluted monomer containing an acrylate functional group, 10% to 60% of a heat-conductive and heat-dissipating filling material and 2% to 10% of an auxiliary agent. According to the invention, a VOC-free heat-conductive double-sided adhesive component is designed and can be cured by an EB curing process; by application of the EB curing process, low cost, environmental friendliness, rapid speed and high productivity are achieved; meanwhile, the heat-conductive double-sided adhesive prepared by using the method provided by the invention has excellent adhesiveness and heat conductivity.

Description

technical field [0001] The invention relates to a thermally conductive adhesive, in particular to a thermally conductive double-sided adhesive based on EB curing and a preparation method thereof. Background technique [0002] Thermally conductive double-sided adhesive is prepared from acrylic polymer filled with thermally conductive and heat-dissipating fillers. It has high thermal conductivity and insulation characteristics, and has the characteristics of softness, compressibility, close fit and strong adhesion. It can adapt to a wide temperature range and can fill unevenness. The surface can be tightly and firmly attached to the heat source device and the heat sink, and the heat can be quickly conducted. The materials prepared by thermally conductive double-sided adhesive include resins containing acrylic functional groups. The conventional preparation method needs to use a large amount of solvent to dissolve. During the construction process, the solvent will inevitably vo...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J4/02C09J11/04
CPCC09J4/00C09J11/04C09J7/10C09J2301/30
Inventor 封玉龙罗洪文陈东陈川红季左周佩芳陆梦琳王平
Owner CGN DASHENG ELECTRON ACCELERATOR TECH
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