Graphene heat-conducting film applied to mobile phone and tablet personal computer

Abstract

The invention discloses a graphene heat-conducting film applied to a mobile phone and a tablet computer. The graphene heat-conducting film comprises a graphene heat-conducting film body, a double-faced adhesive tape layer and a heat-conducting silica gel sheet, wherein the graphene heat conduction film body comprises a substrate and a graphene layer, and the graphene layer is distributed on the upper surface of the substrate; the heat conduction silica gel sheet is attached to the lower surface of the substrate; the double-faced adhesive tape layer is attached to the lower surface of the heat-conducting silica gel sheet; graphene in the graphene layer comprises a carbon element and a non-carbon element; the non-carbon element is at least one of fluorine, nitrogen, oxygen, sulfur, hydrogen,chlorine, bromine and iodine; and the graphene in the graphene layer is graphene with a functional group, the functional group is at least one of hydroxyl, carboxyl, carbonyl, amino and sulfydryl, and gaps of a contact surface are filled with the heat-conducting silica gel sheet, so the overall heat transfer efficiency of the graphene heat-conducting film is greatly improved, and the graphene heat-conducting film is easy to transport, convenient to apply and excellent in heat-conducting property.

Description

technical field [0001] The invention relates to the technical field of graphene heat-conducting films, in particular to a graphene heat-conducting film applied to mobile phones and tablets. Background technique [0002] Since the discovery of graphene in 2004, its unique structure and excellent performance have attracted widespread attention from researchers. Its excellent electrical conductivity, thermal conductivity, high specific surface area and mechanical properties make graphene have great application potential , in the prior art: the patent of application publication number CN 108461463 A discloses a kind of graphene composite film that is applied to CPU chip, and its preparation method is as follows: (1) graphene oxide powder is mixed uniformly in solvent, ultrasonic dispersion 50 -80min, then stand still for 20-25min to obtain a suspension; (2) adopt the spin coating method to coat the suspension on the substrate, and then vacuum dry it for 5-15min to obtain a singl...

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Problems solved by technology

[0002] Since the discovery of graphene in 2004, its unique structure and excellent performance have attracted widespread attention from researchers. Its excellent electrical conductivity, thermal conductivity, high specific surface area and mechanical properties make graphene have great application potential , in the prior art: the patent of application publication number CN 108461463 A discloses a kind of graphene composite film that is applied to CPU chip, and its preparation method is as follows: (1) graphene oxide powder is mixed uniformly in solvent, ultrasonic dispersion 50 -80min, then stand still for 20-25min to obtain a suspension; (2) adopt the spin coating method to coat the suspension on the substrate, and then vacuum dry it for 5-15min to obtain a single-layer graphene film; (3) Spray one deck copper powder layer on the graphene film, the thickness of copper powder layer is 0.01-0.05mm; (4) remove substrate, obtain single-layer high conductivity graphene film; (5) repeat step (2), step ( 3) and step (4) 3-5 times; (6) in the sealed chamber, the single-layer high-conductivity graphene film will be stacked on the substrate, and the mixed gas will be introduced, under the pressure of 50-200N Press for 15-30 minutes to obtain a graphene film with high conductivity. When the graphene sheets are assembled, there will be gaps with the contact surface. The gaps will not only form thermal resistance but also affect the density of the graphene film, thereby reducing the overall heat transfer of the graphene thermal film. Efficiency, at the same time, its complex structure cannot meet the needs of use

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