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A kind of polyimide thick film or super thick film and preparation method thereof

A technology of polyimide thick film and polyamic acid resin, which is applied in the direction of flat products, other household utensils, coatings, etc., can solve the mechanical properties of polyimide film, increase equipment investment, and low thermal expansion coefficient. and other problems to achieve the effect of avoiding unstable discharge, reducing load and good mechanical properties

Active Publication Date: 2020-12-11
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The preparation methods of the above-mentioned existing polyimide thick film or ultra-thick film either need to be sprayed multiple times, and the process is relatively complicated; or the existing conventional equipment needs to be modified, and equipment investment needs to be increased; , smooth thick film or ultra-thick film, but neither mentioned whether the obtained polyimide film can maintain good mechanical properties and low thermal expansion coefficient

Method used

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  • A kind of polyimide thick film or super thick film and preparation method thereof
  • A kind of polyimide thick film or super thick film and preparation method thereof
  • A kind of polyimide thick film or super thick film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1) Add 51.692kg 4,4',-diaminodiphenyl ether (ODA), 492kg dimethylacetamide (DMAC) and 28.154kg pyromellitic dianhydride (PMDA) in the reactor according to the conventional process, stir After uniformity, add PMDA in batches to synthesize a polyamic acid resin solution with a viscosity of 200,000 centipoise, which is a high-viscosity polyamic acid resin solution;

[0037] 2) adding DMAC to the polyamic acid resin solution prepared in step 1) to dilute the solution viscosity to 110,000 centipoise, which is a low-viscosity polyamic acid resin solution;

[0038] 3) Add chlorinated paraffin-42 equivalent to 1% of the weight of the polyamic acid resin solution prepared in step 1) to the polyamic acid resin solution obtained in step 2), stir for 2 hours at room temperature, and send the resulting mixture into a disinfectant Defoaming the kettle to obtain the defoamed polyamic acid resin solution;

[0039] 4) Coating a film release agent (silicone resin methyl branched chain s...

Embodiment 2

[0042] Repeat Example 1, the difference from Example 1 is:

[0043] The viscosity of the high-viscosity polyamic acid resin solution is 150,000 centipoise, and the viscosity of the diluted low-viscosity polyamic acid resin solution is 80,000 centipoise. The temperature is 175°C, and the setting temperature is 500°C.

Embodiment 3

[0045] Repeat Example 1, the difference from Example 1 is:

[0046] The viscosity of the high-viscosity polyamic acid resin solution is 250,000 centipoise, and the viscosity of the diluted low-viscosity polyamic acid resin solution is 140,000 centipoise. The temperature is 185°C, and the setting temperature is 410°C.

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Abstract

The invention discloses a polyimide thick film or ultra thick film and a preparation method thereof. The preparation method comprises the following steps that 1) a high-viscosity polyamide acid resin solution is prepared; 2) the obtained high-viscosity polyamide acid resin solution is diluted to obtain a low-viscosity polyamide acid resin solution with the viscosity being 80000 centipoises to 140000 centipoises; 3) a flow accelerator which is equivalent to 0.5% to 1.5% of the high-viscosity polyamide acid resin solution by weight and has the boiling point being 100 DEG C to 240 DEG C is added into the low-viscosity polyamide acid resin solution, defoaming is carried out after even mixing, and a defoamed polyamide acid resin solution is obtained; and 4) the defoamed polyamide acid resin solution forms a film in a salivation manner, the temperature of a lower drying tunnel is controlled to be 175 DEG C to 185 DEG C, the obtained self-supporting film is stretched in the longitudinal and transverse directions, is preheated and is subjected to thermal imidization, shaping is carried out under 410 DEG C-500 DEG C, and the film is obtained. The method is simple in process, the mechanical properties of the obtained polyimide thick film or ultra thick film are better, and the thermal expansion coefficient is low.

Description

technical field [0001] The invention relates to a preparation method of a polyimide film, in particular to a polyimide thick film or an ultra-thick film and a preparation method thereof. Background technique [0002] Polyimide (PI) films are widely used in the fields of optics, electronics, and aerospace due to their excellent mechanical properties, high and low temperature resistance, thermal dimensional stability, and electrical insulation properties. [0003] According to the thickness, polyimide film can be classified into ultra-thin film (d≤8μm), conventional thin film (8μm<d≤50μm), thick film (50μm<d≤125μm) and ultra-thick film (d>125μm). With the rapid development of science and technology, some applications (such as thermal conductive films, integrated circuits, reinforcing plates and labels, etc.) require thicker PI films to meet the requirements. For example, when preparing high thermal conductivity graphite films, when the film thickness is less than 50 μ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C69/00B29C41/24B29C41/34B29C55/14B29L7/00
CPCB29C41/24B29C41/34B29C55/143B29C69/00B29L2007/00
Inventor 蒋耿杰唐必连周福龙白小庆黄孙息全光好
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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