Arc ion plating for composite filtering of combined magnetic field and lined bias conical pipe and stepped pipe
A technology of arc ion plating and composite filtration, applied in the field of arc ion plating, which can solve the problems of large particle defects, limited use of target elements, and low transmission efficiency of arc plasma, so as to improve utilization efficiency, realize effective control, and reduce arc Waiting for the effect
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specific Embodiment approach 1
[0020] Specific implementation mode one: the following combination figure 1 , 2 and 3 illustrate this embodiment. The device used in this embodiment combines magnetic field and lined bias conical tube and stepped tube compound filter for arc ion plating, including bias power supply (1), arc power supply (2), arc ion plating target Source (3), multi-level magnetic field device (4), multi-level magnetic field power supply (5), combination device of lined bias conical tube and stepped tube (6), lined bias power supply (7), movable coil device ( 8), movable coil device power supply (9), rheostat device (10), sample stage (11), bias power supply waveform oscilloscope (12) and vacuum chamber (13);
[0021] In this device:
[0022] The substrate workpiece to be processed is placed on the sample stage (11) in the vacuum chamber (13), the multi-stage magnetic field device (4), the combination device of the lined bias conical tube and the stepped tube (6), and the movable coil device ...
specific Embodiment approach 2
[0036] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the device can also realize other functions: it can combine traditional DC magnetron sputtering, pulse magnetron sputtering, traditional arc ion plating and pulse cathode arc Combination of one or more than two methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device on the workpiece for thin film deposition to prepare pure metal thin films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structures.
specific Embodiment approach 3
[0037] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the combined magnetic field and the arc ion plating of the lined bias conical tube and the ladder tube composite filter are connected, the arc power supply (2) is turned on, and the multi-stage magnetic field is turned on The power supply (5) adjusts the multi-level magnetic field device (4), turns on the liner bias power supply (7), the liner bias conical tube and stepped tube combination device (6) maintains a DC positive bias, and turns on the bias power supply (1 ), turn on the power supply of the movable coil device (9), adjust the movable coil device (8), adjust the output resistance of the rheostat device (10), adjust the process parameters, perform thin film deposition, and prepare multilayers with different stress states, microstructures and element ratios The structural film is the same as the second embodiment.
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