Environment-friendly superfine tin wire and preparation method thereof

A kind of solder wire, environment-friendly technology, applied in the field of environment-friendly ultra-fine solder wire and its preparation, can solve problems such as components, circuit short circuit, easy bridging, etc., achieve improved lubricity, short production cycle, prevent oxidation and tin The effect of metamorphic elements

Pending Publication Date: 2019-07-02
中山翰荣新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, for microelectronic assemblies (SMT), circuit boards, components, miniature connectors, and infrared process weldments with a solder joint pitch of less than or equal to Φ0.2mm, the required solder wire must be less than or equal to Φ0.12mm, otherwise , the two solder joints are prone to bridging, resulting in short circuits of components and lines

Method used

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  • Environment-friendly superfine tin wire and preparation method thereof
  • Environment-friendly superfine tin wire and preparation method thereof
  • Environment-friendly superfine tin wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0038] The preparation method of embodiment 1~6 is as follows:

[0039] Table 1: Each component weight composition among the embodiment 1~6:

[0040]

[0041] Table 2: Composition by weight percentage of each component of flux in Examples 1-6:

[0042]

[0043]

Embodiment 1～2

[0044] The implementation scheme of embodiment 1~2:

[0045] A preparation method of environment-friendly ultra-fine solder wire, comprising the steps of:

[0046] 1) Weigh the raw materials of Sn, Bi and the third element alloy according to the weight ratio, melt and heat to 380-400°C, keep warm, stir, stand still, remove slag, and cast a cylindrical billet with a specification of Φ84×180mm;

[0047] 2), put the Φ84×180mm billet into a 350-ton large deformation extruder with a diameter of Φ9mm, and put rosin welding oil into the rosin barrel at a ratio of 2.3%;

[0048]3) Control the temperature of the rosin barrel at 110°C, the billet temperature at 100°C, and the extrusion force at 150kg / cm 2 , the wire output speed is about 1.5m / min, adjust the neutrality of the rosin nozzle and the size of the gap and test the flux content of the thick wire until the flux content of the core of the thick tin wire is 2.0-2.6%;

[0049] 4) Pass the thick tin wire of Φ9mm into 16 near-fini...

Embodiment 3～4

[0059] The implementation scheme of embodiment 3~4:

[0060] A preparation method of environment-friendly ultra-fine solder wire, comprising the steps of:

[0061] 1) Weigh the raw materials of Sn, Bi and the third element alloy according to the weight ratio, melt and heat to 380-400°C, keep warm, stir, stand still, remove slag, and cast a cylindrical billet with a specification of Φ84×180mm;

[0062] 2), put the Φ84×180mm billet into a 350-ton large deformation extruder with a diameter of Φ9mm, and put rosin welding oil into the rosin barrel at a ratio of 2.1%;

[0063] 3) Control the temperature of the rosin barrel at 110°C, the billet temperature at 100°C, and the extrusion force at 150kg / cm 2 , the wire output speed is about 1.5m / min, adjust the neutrality of the rosin nozzle and the size of the gap and test the flux content of the thick wire until the flux content of the core of the thick tin wire is 2.0-2.6%;

[0064] 4) Pass the thick tin wire of Φ9mm into 16 near-fin...

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Abstract

The invention discloses an environment-friendly superfine tin wire and a preparation method thereof. The environment-friendly superfine tin wire comprises third element alloy and scaling powder, according to main points of the technical scheme, the third element alloy is prepared from the following components in percentage by weight: 54.0% to 64.5% of Sn, and 29.7% to 39.8% of Bi; the third element alloy accounts for 2.3% to 3.7%, and the scaling powder accounts for 2.0% to 2.6%; the third element alloy is prepared from the components in percentage by weight of the tin wire: 0.05% to 0.1% of Ga, 0.15% to 0.33% of In, 0.15% to 0.24% of Co, and 1.7% to 3.32% of Ni; and the scaling powder is prepared from the following components in percentage by weight: 65% to 80% of a carrier, 6% to 15% ofan activating agent, 5% to 16% of a surface activating agent, 1% to 2.85% of a thixotropic agent, and 0.46% to 6.32% of an inhibitor. The lead-free environment-friendly superfine tin wire is low in melting point, good in wettability, and excellent in crack growth resistance and corrosion resistance performance.

Description

[0001] 【Technical field】 [0002] The invention relates to a solder wire material, more specifically an environment-friendly ultra-fine solder wire and a preparation method thereof. [0003] 【Background technique】 [0004] Welding technology has been developed for more than six decades and continues to develop and innovate as science and technology advance. At present, the development of soldering material products has been developed in the direction of lead-free, halogen-free, environmental protection and functionalization in terms of composition; in terms of product cost performance, it has developed in the direction of reliable quality and low cost; It is developing in a narrower direction, and various evaluation technical indicators have gradually been refined and improved. In addition, with the needs of electronic products and their technological development, products are gradually developing in the direction of functionalization, low temperature and energy saving. This ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/362B23K35/40
CPCB23K35/262B23K35/3612B23K35/362B23K35/40
Inventor 龙斌顾文欣黄宏生李爱良付波
Owner 中山翰荣新材料有限公司
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