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Preparation method of high-strength high-conductivity copper-silver alloy micro-wire

A technology of copper-silver alloy and micro-wire, which is applied in the field of preparation of high-strength and high-conductivity copper-silver alloy micro-wire, which can solve problems such as poor physical and mechanical properties, high wire breakage rate, and poor surface quality, and achieve improved drawing and forming capabilities , good engineering application and high production efficiency

Inactive Publication Date: 2019-06-25
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, continuous casting and rolling + drawing and up-drawing continuous casting + rolling / continuous extrusion + drawing are mainly used to prepare Cu-Ag alloy fine wires. The preparation of copper and silver rods by the existing technology is prone to slag inclusion and surface quality. Poor, high internal porosity, high oxygen content, shrinkage cavity and other casting defects, poor physical and mechanical properties, high wire breakage rate in fine wire drawing, the length of a single wire does not meet the use requirements, and the finished product The yield is extremely low, and it is difficult to prepare Cu-Ag alloy fine wires that meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Cu-4.5Ag alloy Φ0.05mm fine wire preparation, according to the proportion of high-purity electrolytic copper plate (purity greater than 99.95wt%, the same below) and high-purity silver plate (purity greater than 99.95wt%, the same below), placed in a vacuum induction furnace, The vacuum degree in the furnace is 5.0×10 -2 Pa, heated to 1250 ℃ ~ 1350 ℃, smelted into a copper-silver alloy ingot with a diameter of Φ100mm; then put the ingot into the electron beam melting furnace, and vacuum the furnace body and gun chamber, the vacuum of the gun chamber is 5.0×10 -4 Pa, the vacuum in the furnace is 5.0×10 -3 Pa, through electron beam smelting, solidification, purification and removal of impurities, an ultra-high-purity copper-silver alloy ingot with a diameter of Φ120mm is obtained, and the total content of impurity elements is less than 15ppm. Machining copper and silver ingots, and put them into the sheath, vacuumize and weld them. The copper and silver ingots are in a v...

Embodiment 2

[0027] Cu-4.5Ag alloy Φ0.03mm fine wire is prepared by using the process of Example 1 to prepare to Φ0.05mm, and drawn to Φ0.03mm through 9 dies on an ultra-fine wire drawing machine. The strength of Φ0.03mm fine wire is 1020MPa, the conductivity is 72%%IACS, and the elongation is 2.5%.

Embodiment 3

[0029] Preparation of Cu-2.5Ag alloy Φ0.015mm fine wire, according to the proportion of high-purity electrolytic copper plate and high-purity silver plate, placed in a vacuum induction furnace, the vacuum degree in the furnace is 1.0×10 -2 Pa, heated to 1200 ℃ ~ 1300 ℃, smelted into a copper-silver alloy ingot with a diameter of Φ80mm; then put the ingot into the electron beam melting furnace, vacuumize the furnace body and the gun chamber, the vacuum of the gun chamber is 1.0 ×10 -4 Pa, the vacuum in the furnace is 1.0×10 -3 Pa, through electron beam smelting, solidification, purification and impurity removal, an ultra-high-purity copper-silver alloy ingot with a diameter of Φ100mm is obtained, and the total content of impurity elements is less than 10ppm. Machining copper and silver ingots, and put them into the sheath, vacuumize and weld them. The copper and silver ingots are in a vacuum state. Put the sheathed copper and silver ingots into the heating furnace for heating....

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Abstract

The invention relates to a preparation method of a high-strength high-conductivity copper-silver alloy micro-wire, and belongs to the technical fields of copper alloy material preparation, non-ferrouswire processing forming and electromagnetic wire manufacturing. The preparation method comprises the following steps that high-purity electrolytic copper plates and high-purity silver plates are putin a vacuum induction furnace according to the mass percent of a copper-silver alloy for smelting; smelting, solidification, purification and impurity removal are conducted on cast ingots by adoptinga vacuum electron beam to prepare high-purity copper-silver alloy ingots; the copper-silver alloy ingots are machined, and sheathing vacuum extrusion is conducted; surface defects of an extruded bar material are removed, and cold rolling is conducted; multi-pass drawing is conducted on the cold rolled bar material on a multi-mold drawing machine to obtain a wire blank; and after vacuum heat treatment is conducted on the wire blank, and multi-mold drawing is conducted on the micro wires. According to the preparation method, the drawing micro-process is stable, and is free of broken ends duringdrawing, the yield is high, the production efficiency is high, the industrialized, large-scale and stable volume production is achieved, the micro-wire of 0.015mm-0.05 mm is prepared, and the method has good engineering application on micro-electromagnetic wires.

Description

technical field [0001] The invention relates to a method for preparing high-strength and high-conductivity copper-silver alloy fine wires, belonging to the technical fields of preparation of copper alloy materials, processing and forming of nonferrous metal wires, and manufacturing of electromagnetic wires. Background technique [0002] Cu-Ag alloy has excellent thermal conductivity and electrical conductivity. It is an advanced conductor material and is widely used in the fields of microelectronics, transportation, aerospace and machinery manufacturing. Its fine wire is the main raw material for manufacturing high-end fine electromagnetic wire (fine enameled wire). With the development and consumption upgrade of electronic products represented by automotive electronics, household appliances, digital products, computers and mobile phones, the market demand for fine electromagnetic enameled wires continues to rise, which has driven a large number of applications of Cu-Ag alloy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/02C22C9/00C22F1/08B21C37/04
Inventor 郭胜利
Owner GRIMAT ENG INST CO LTD
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