Reworkable thermal deadhesion adhesive tape for manufacture procedure and preparation method of adhesive tape

Abstract

The invention discloses a reworkable thermal deadhesion adhesive tape for manufacture procedure. The adhesive tape comprises a substrate layer and a thermal deadhesion adhesive layer coating the surface of the substrate layer, wherein the thermal deadhesion adhesive layer comprises components as follows: butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, hydroxyethyl methylacrylate, a styrene-isoprene-styrene block copolymer, thermoplastic phenolic resin, methylbenzotriazole, N,N-diethylaniline, azodiisobutyronitrile, 4,4'-diaminodiphenyl ether, polyethylene wax, gamma-methacryloxy propyl trimethoxyl silane, an antioxidant and a solvent. The reworkable thermal deadhesion adhesive tape for the manufacture procedure has notably reduced adhesion after being heated, can be easily stripped from an attached object and is convenient to rework, the adhesion of the adhesive layer can recover after the adhesive tape recovers the normal temperature, therefore, the adhesive tape can be recyclable, and the economic cost is saved.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a reworkable heat-unbonding adhesive tape for manufacturing processes and a preparation method thereof. Background technique [0002] With the development of science and technology, the degree of automation is getting higher and higher. The continuity and simplification of product production process has become an important means to improve the competitiveness of enterprises. At present, in order to ensure the continuity and simplicity of production process, high-end electronic products usually require Take certain protective measures for electronic components. [0003] At present, there are roughly two main protective measures: one is to use low-adhesive pressure-sensitive adhesive tapes, and the other is to use thermally debonding tapes with thermal expansion microspheres. These two tapes have certain disadvantages. It is difficult for the low-adhesive pressure-sensitive adhesive tape to bon...

AI Technical Summary

Problems solved by technology

These two tapes have certain disadvantages. It is difficult for the low-adhesive pressure-sensitive adhesive tape to bond objects with rough surfaces, and the adhesive force will increase with the extension of time and the increase of temperature and pressure. Peeling; while the adhesive layer of the thermally debonding adhesive tape with thermal expansion microspheres basically disappears after thermal debonding, which will easily lead to complete separation between the adhesive layer and the component or even the adhesive layer and the substrate layer, causing the component to fall off and be damaged. , In addition, due to the increase in the volume of the expanded microspheres after thermal debonding, the surface of the adhesive layer of this type of tape is usually rough and soft, and the adhesive layer is prone to shrinkage or sliding after being subjected to external forces, which affects the process stability.

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