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Flexible capacitive pressure sensor and preparation method thereof

A pressure sensor and flexible capacitor technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of adhesion of microstructure films and templates, high preparation cost, complicated process, etc., and achieves improved dielectric constant, simple preparation method, The effect of increasing sensitivity

Active Publication Date: 2019-05-21
三三智能科技(日照)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The present invention adopts the self-assembled porous "V"-shaped anodic aluminum oxide (AAO) template infiltration method with low cost, simple preparation process and long-range order of pores to prepare a new type of composite material microstructure array, which successfully solves the problem of high preparation cost and high cost in the prior art. Time-consuming, complicated process, problems of adhesion between microstructured film and template

Method used

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  • Flexible capacitive pressure sensor and preparation method thereof
  • Flexible capacitive pressure sensor and preparation method thereof
  • Flexible capacitive pressure sensor and preparation method thereof

Examples

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Embodiment 1

[0069] 1. If figure 1 As shown, a flexible capacitive pressure sensor with a planar structure, the sensor structure includes from bottom to top: polyimide (PI) substrate 4; conductive polymer layer 5; composite material medium layer 6; gap 8, composite Material dielectric layer 6; conductive polymer layer 5; polyimide (PI) substrate 4; the copper wire 7 is embedded in the conductive polymer layer and extends to the outside of the conductive polymer layer.

[0070] The conductive polymer 5 is formed by mixing poly 3,4-ethylenedioxythiophene (PEDOT) and polystyrene sodium sulfonate (PSS); the composite material medium layer 6 is composed of polymer polyvinylidene fluoride-hexafluoro Propylene (P(VDF-HFP)) and graphene quantum dots (GQD) composite.

[0071] 2. The preparation method of the planar structure flexible capacitive pressure sensor of this embodiment includes the following steps:

[0072] (1) Mix PEDOT and PSS at a mass ratio of 1:5 to form a conductive polymer soluti...

Embodiment 2

[0078] A preparation method of an AAO template with a "V"-shaped hole, comprising the steps of:

[0079] (1-1) Electropolish the aluminum sheet, then immerse the aluminum sheet in acetone and ethanol solution for ultrasonic cleaning for 30min, then transfer it to a medium temperature tube furnace (CVD), in N 2 Annealing under atmosphere, annealing temperature 500℃, time 8h;

[0080] (1-2) embossing the aluminum sheet obtained in step (1-1) with a silicon mold having a honeycomb nanocone to produce a nanocone indentation array;

[0081] (1-3) With the aluminum flake obtained in step (1-2) as the anode, the lead block as the cathode, and 0.3mol / L oxalic acid as the electrolyte, carry out the oxidation reaction for the first time, the reaction voltage is 205V, and the reaction time is 2h. Finally, a preliminary ordered aluminum oxide film is formed on the surface of the aluminum sheet;

[0082] (1-4) Soak the aluminum sheet obtained in step (1-3) in a mixed solution of 6wt% pho...

Embodiment 3

[0087] A preparation method of a sawtooth structure flexible capacitive pressure sensor, comprising the steps of:

[0088] (1) Preparation of graphene quantum dots: 180mg (GO) was dissolved in 10mL N,N-dimethylformamide (DMF), ultrasonicated for 30min, then hydrothermally reacted at 200°C for 8h, cooled to room temperature, collected The brown suspension is subjected to operations such as evaporation, filtration, and purification to obtain graphene quantum dots (GQD) with a size of about 5-10 nm.

[0089] (2) P (VDF-HFP) polymkeric substance is dissolved in solvent N, in the N-dimethylformamide (DMF), the P (VDF-HFP) polymkeric substance concentration is 15wt% in the gained solution, then to this solution Continue to add GQD powder (volume ratio is 0.5Vol%), then ultrasonic treatment 60min obtains P(VDF-HFP) / GQD solution, this solution is spin-coated on the porous alumina (AAO) template prepared by the method in Example 2, to Composite medium layer is prepared, the bottom dia...

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Abstract

The invention relates to the technical field of capacitive pressure sensors, in particular to a flexible capacitive pressure sensor and a preparation method thereof. The sensor comprises a top electrode, a bottom electrode, composite material dielectric layers and a wire, wherein the top electrode and the bottom electrode are each composed of a substrate of which the surface is provided with a conductive polymer layer; the wire extending to the outsides of the conductive polymer layers is embedded in the conductive polymer layers; the composite material dielectric layers are arranged on the surfaces of the conductive polymer layers on the top electrode and the bottom electrode; the flexible capacitive pressure sensor is formed by combining the surfaces, provided with composite material dielectric layers, of the top electrode and the bottom electrode in a face-to-face mode. The prepared high-performance flexible capacitive pressure sensor is high in sensitivity, small in hysteresis andgood in repeatability, the preparation cost is low, the method is simple, large-scale production can be achieved, and the sensor can be widely applied to the fields of a human-computer interaction system, a detection sensor system, medical health detection equipment and the like.

Description

technical field [0001] The invention relates to the technical field of capacitive pressure sensors, in particular to a flexible capacitive pressure sensor and a preparation method thereof. Background technique [0002] The flexible pressure sensor is a flexible electronic device used to sense the force on the surface of an object. It can be attached to the surface of various irregular objects. It has small size, light weight, portability, stretchability, wearability, and good flexibility. It has broad application prospects in industrial production, health monitoring, electronic skin, bioengineering, wearable electronic products and other fields. According to different working principles, pressure sensors can be divided into resistive, capacitive and piezoelectric. Compared with resistive and piezoelectric sensors, capacitive sensors have the characteristics of high sensitivity, small hysteresis, and good dynamic stability, so they are more widely used. [0003] Polymer mat...

Claims

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Application Information

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IPC IPC(8): G01L1/14
Inventor 李阳牛闳森郭云建岳文静张春伟
Owner 三三智能科技(日照)有限公司
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